Collector grid and interconnect structures for photovoltaic arrays and modules

ABSTRACT

An interconnected arrangement of photovoltaic cells is achieved using laminating current collector electrodes. The electrodes comprise a pattern of conductive material extending over a first surface of sheetlike substrate material. The first surface comprises material having adhesive affinity for a selected conductive surface. Application of the electrode to the selected conductive surface brings the first surface of the sheetlike substrate into adhesive contact with the conductive surface and simultaneously brings the conductive surface into firm contact with the conductive material extending over first surface of the sheetlike substrate. Use of the laminating current collector electrodes allows facile and continuous production of expansive area interconnected photovoltaic arrays.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of U.S. patent application Ser. No.13/986,090 filed Mar. 29, 2013 entitled Collector Grid and InterconnectStructures for Photovoltaic Arrays and Modules, which is aContinuation-in-Part of U.S. patent application Ser. No. 13/385,207filed Feb. 6, 2012 entitled Collector Grid and Interconnect Structuresfor Photovoltaic Arrays and Modules, now abandoned, which is aContinuation-in-Part of U.S. patent application Ser. No. 12/803,490filed Jun. 29, 2010 entitled Collector Grid and Interconnect Structuresfor Photovoltaic Arrays and Modules, and now U.S. Pat. No. 8,138,413,which is a Continuation-in-Part of U.S. patent application Ser. No.12/798,221 filed Mar. 31, 2010 entitled Collector Grid and InterconnectStructures for Photovoltaic Arrays and Modules, and now U.S. Pat. No.8,076,568, which is a Continuation-in-Part of U.S. patent applicationSer. No. 11/980,010 filed Oct. 29, 2007 entitled Collector Grid andInterconnect Structures for Photovoltaic Arrays and Modules, nowabandoned.

This application is a Continuation of U.S. patent application Ser. No.13/986,090 filed Mar. 29, 2013 entitled Collector Grid and InterconnectStructures for Photovoltaic Arrays and Modules, which is aContinuation-in-Part of U.S. patent application Ser. No. 13/385,207filed Feb. 6, 2012 entitled Collector Grid and Interconnect Structuresfor Photovoltaic Arrays and Modules, now abandoned, which also is aContinuation-in-Part of U.S. patent application Ser. No. 13/317,117filed Oct. 11, 2011, entitled Collector Grid, Electrode Structures andInterconnect Structures for Photovoltaic Arrays and Methods ofManufacture, and now U.S. Pat. No. 8,222,513, which is aContinuation-in-Part of U.S. patent application Ser. No. 13/199,333filed Aug. 25, 2011, entitled Collector Grid, Electrode Structures andInterconnect Structures for Photovoltaic Arrays and Methods ofManufacture, and now U.S. Pat. No. 8,110,737, which is a Continuation ofU.S. patent application Ser. No. 12/290,896 filed Nov. 5, 2008, entitledCollector Grid, Electrode Structures and Interconnect Structures forPhotovoltaic Arrays and Methods of Manufacture, now abandoned, which isa Continuation-in-Part of U.S. patent application Ser. No. 11/824,047filed Jun. 30, 2007, entitled Collector Grid, Electrode Structures andInterconnect Structures for Photovoltaic Arrays and other OptoelectricDevices, now abandoned, which is a Continuation-in-Part of U.S.application Ser. No. 11/404,168 filed Apr. 13, 2006, entitled Substrateand Collector Grid Structures for Integrated Photovoltaic Arrays andProcess of Manufacture of Such Arrays and now U.S. Pat. No. 7,635,810.

This application is also a Continuation of U.S. patent application Ser.No. 14/545,454 filed May 5, 2015, entitled Photovoltaic Power FarmStructure and Installation, which is a Continuation-in-Part of U.S.patent application Ser. No. 12/590,222 filed Nov. 3, 2009 entitledPhotovoltaic Power Farm Structure and Installation, now abandoned, whichis a Continuation-in-Part of U.S. patent application Ser. No. 12/156,505filed Jun. 2, 2008 entitled Photovoltaic Power Farm Structure andInstallation, now abandoned.

This application also claims priority to U.S. Provisional PatentApplication No. 61/274,960 filed Aug. 24, 2009 entitled Identification,Isolation, and Repair of Shunts and Shorts in Photovoltaic Cells

The instant application claims the benefit of priority from all of theabove identified applications.

BACKGROUND OF THE INVENTION

Photovoltaic cells have developed according to two distinct methods. Theinitial operational cells employed a matrix of single crystal siliconappropriately doped to produce a planar p-n junction. An intrinsicelectric field established at the p-n junction produces a voltage bydirecting solar photon produced holes and free electrons in oppositedirections. Despite good conversion efficiencies and long-termreliability, widespread energy collection using single-crystal siliconcells is thwarted by the high cost of single crystal silicon materialand interconnection processing.

A second approach to produce photovoltaic cells is by depositing thinphotovoltaic semiconductor films on a supporting substrate. Materialrequirements are minimized and technologies can be proposed for massproduction. Thin film photovoltaic cells employing amorphous silicon,cadmium telluride, copper indium gallium diselenide (CIGS), dyesensitized polymers and the like have received increasing attention inrecent years. Despite significant improvements in individual cellconversion efficiencies for both single crystal and thin filmapproaches, photovoltaic energy collection has been generally restrictedto applications having low power requirements. One factor impedingdevelopment of bulk power systems is the problem of economicallycollecting the energy from an extensive collection surface. Photovoltaiccells can be described as high current, low voltage devices. Typicallyindividual cell voltage is less than about two volts, and often lessthan 0.6 volt. The current component is a substantial characteristic ofthe power generated. Efficient energy collection from an expansivesurface must minimize resistive losses associated with the high currentcharacteristic. A way to minimize resistive losses is to reduce the sizeof individual cells and connect them in series. Thus, voltage is steppedthrough each cell while current and associated resistive losses areminimized.

It is readily recognized that making effective, durable seriesconnections among multiple small cells can be laborious, difficult andexpensive. In order to approach economical mass production of seriesconnected arrays of individual cells, a number of factors must beconsidered in addition to the type of photovoltaic materials chosen.These include the substrate employed and the process envisioned. Sincethin films can be deposited over expansive areas, thin film technologiesoffer additional opportunities for mass production of interconnectedarrays compared to inherently small, discrete single crystal siliconcells. Thus a number of U.S. patents have issued proposing designs andprocesses to achieve series interconnections among the thin filmphotovoltaic cells. Many of these technologies comprise deposition ofphotovoltaic thin films on glass substrates followed by scribing to formsmaller area individual cells. Multiple steps then follow toelectrically connect the individual cells in series array. Examples ofthese proposed processes are presented in U.S. Pat. Nos. 4,443,651,4,724,011, and 4,769,086 to Swartz, Turner et al. and Tanner et al.respectively. While expanding the opportunities for mass production ofinterconnected cell arrays compared with single crystal siliconapproaches, glass substrates must inherently be processed on anindividual batch basis.

More recently, developers have explored depositing wide area films usingcontinuous roll-to-roll processing. This technology generally involvesdepositing thin films of photovoltaic material onto a continuouslymoving web. However, a challenge still remains regarding subdividing theexpansive films into individual cells followed by interconnecting into aseries connected array. For example, U.S. Pat. No. 4,965,655 to Grimmeret. al. and U.S. Pat. No. 4,697,041 to Okamiwa teach processes requiringexpensive laser scribing and interconnections achieved with laser heatstaking. In addition, these two references teach a substrate of thinvacuum deposited metal on films of relatively expensive polymers. Theelectrical resistance of thin vacuum metallized layers significantlylimits the active area of the individual interconnected cells.

Many of the legacy techniques used to interconnect individualphotovoltaic cells into a modular format involve the use of low meltingpoint metal solders and/or electrically conductive adhesives. Thesetechniques are time consuming, expensive, and often require batchprocessing. Moreover, the electrical connections achieved with solderand/or electrically conductive adhesives have historically beensusceptible to deterioration when exposed to environmental or mechanicalstress.

It has become well known in the art that the efficiencies of certainpromising thin film photovoltaic junctions can be substantiallyincreased by high temperature treatments. These treatments involvetemperatures at which even the most heat resistant plastics suffer rapiddeterioration, thereby requiring either ceramic, glass, or metalsubstrates to support the thin film junctions. Use of a glass or ceramicsubstrates generally restricts one to batch processing and handlingdifficulty. Use of a metal foil as a substrate allows continuousroll-to-roll processing. However, despite the fact that use of a metalfoil allows high temperature processing in roll-to-roll fashion, thesubsequent interconnection of individual cells effectively in aninterconnected array has proven difficult, in part because the metalfoil substrate is electrically conducting.

U.S. Pat. No. 4,746,618 to Nath et al. teaches a design and process toachieve interconnected arrays using roll-to-roll processing of a metalweb substrate such as stainless steel. The process includes multipleoperations of cutting, selective deposition, and riveting. Theseoperations add considerably to the final interconnected array cost.

U.S. Pat. No. 5,385,848 to Grimmer teaches roll-to-roll methods toachieve integrated series connections of adjacent thin film photovoltaiccells supported on an electrically conductive metal substrate. Theprocess includes mechanical or chemical etch removal of a portion of thephotovoltaic semiconductor and transparent top electrode to expose aportion of the electrically conductive metal substrate. The exposedmetal serves as a contact area for interconnecting adjacent cells. Thesematerial removal techniques are troublesome for a number of reasons.First, many of the chemical elements involved in the best photovoltaicsemiconductors are expensive and environmentally unfriendly. Thisremoval subsequent to controlled deposition involves containment, dustand dirt collection and disposal, and possible cell contamination. Thisis not only wasteful but considerably adds to expense. Secondly, theremoval processes are difficult to control dimensionally. Thus asignificant amount of the valuable photovoltaic semiconductor is lost tothe removal process. Ultimate module efficiencies are furthercompromised in that the spacing between adjacent cells grows, therebyreducing the effective active collector area for a given module area.

Thus there remains a need for manufacturing processes and articles whichallow separate production of photovoltaic structures while also offeringunique means to achieve effective integrated connections.

A further unsolved problem which has thwarted production of expansivesurface photovoltaic modules is that of collecting the photogeneratedcurrent from the top, light incident surface. “Window electrodes” arecommonly employed in the thin film cell stack. Transparent conductiveoxide (TCO) layers are often employed for a top surface “windowelectrode”. Other materials, such as intrinsically conductive polymers,conductive nanowires, etc. have also been proposed as alternatives forconductive metal oxides. Transparent conductive oxides are conductivematerials based on certain metal oxides such as zinc, tin and indium.They are normally applied as thin layers to the top cell surface, withthicknesses normally less than 1 micrometer. In many cases, the TCO mayscatter a portion of the transmitted radiation due to surface roughnessand grain boundary effects. However, because of the thinness of thelayer, this scattering is not detrimental and indeed is often helpfulbecause of a “light trapping” effect.

Transparent conductive oxide (TCO) layers are relatively resistivecompared to pure metals. Thus, efforts must be made to minimizeresistive losses in transport of current through the TCO layer. Oneapproach is simply to reduce the surface area of individual cells to amanageable amount. However, as cell widths decrease, the width of thearea between individual cells (interconnect area) should also decreaseso that the relative portion of inactive surface of the interconnectarea does not become excessive. Typical cell widths of one centimeterare often taught in the art. These small cell widths demand very fineinterconnect area widths, which dictate delicate and sensitivetechniques to be used to electrically connect the top TCO surface of onecell to the bottom electrode of an adjacent series connected cell.Furthermore, achieving good stable ohmic contact to the TCO cell surfacehas proven difficult, especially when one employs those sensitivetechniques available when using the TCO only as the top collectorelectrode. Another method is to form a current collector grid over thesurface. This approach positions highly conductive material in contactwith the surface of the TCO in a spaced arrangement such that the traveldistance of current through the TCO is reduced. In the case of theclassic single crystal silicon or polycrystalline silicon cells, acommon approach is to form a collector grid pattern of traces using asilver containing paste and then fuse the paste to sinter the silverparticles into continuous conductive silver paths. These highlyconductive traces normally lead to a collection buss such as a copperfoil strip. One notes that this approach involves use of expensivesilver and requires the photovoltaic semiconductors tolerate the highfusion temperatures. Another approach is to attach an array of finecopper wires to a surface using conductive adhesive. The wires may alsolead to a collection buss, or alternatively extend to an electrode of anadjacent cell. This wire approach normally involves positioning andfixing individual unsupported fine fragile wires over the surface.Typical of this “wire” approach is that taught in U.S. Pat. No.5,457,057, to Nath et al. which is incorporated herein in its entirety.Another approach, used with “thin film” cells, is to print a collectorgrid array on the surface of a TCO using a conductive ink, usually onecontaining a heavy loading of fine particulate silver. The ink is simplydried or cured at mild temperatures which do not adversely affect the“thin film” cell. These approaches require the use of relativelyexpensive inks because of the high loading of finely divided silver. Inaddition, batch printing on the individual cells is laborious andexpensive. Finally, conductive traces comprising particulate silver inkare relatively resistive compared to continuous metal traces.

In a somewhat removed segment of technology, a number of electricallyconductive fillers have been used to produce electrically conductivepolymeric materials. This technology generally involves mixing ofconductive filler such as silver particles with the polymer resin priorto fabrication of the material into its final shape. Conductive fillersmay have high aspect ratio structure such as metal fibers, metal flakesor powder, or highly structured carbon blacks, with the choice based ona number of cost/performance considerations. More recently, fineparticles of intrinsically conductive polymers have been employed asconductive fillers within a resin binder. Electrically conductivepolymers have been used as bulk thermoplastic compositions, orformulated into paints and inks. Their development has been spurred inlarge part by electromagnetic radiation shielding and static dischargerequirements for plastic components used in the electronics industry.Other known applications include resistive heating fibers and batterycomponents and production of conductive patterns and lines. Thecharacterization “electrically conductive polymer” covers a very widerange of intrinsic resistivities depending on the filler, the fillerloading and the methods of manufacture of the filler/polymer blend.Resistivities for filled electrically conductive polymers may be as lowas 0.00001 ohm-cm. for very heavily filled silver inks, yet may be ashigh as 10,000 ohm-cm or even more for lightly filled carbon blackmaterials or other “anti-static” materials. “Electrically conductivepolymer” has become a broad industry term to characterize all suchmaterials. In addition, it has been reported that recently developedintrinsically conducting polymers (absent conductive filler) may exhibitresistivities comparable to pure metals.

In yet another separate technological segment, coating plasticsubstrates with metal electrodeposits has been employed to achievedecorative effects on items such as knobs, cosmetic closures, faucets,and automotive trim. The normal conventional process actually combinestwo primary deposition technologies. The first is to deposit an adherentmetal coating using chemical (electroless) deposition to first coat thenonconductive plastic and thereby render its surface highly conductive.This electroless step is then followed by conventional electroplating.ABS (acrylonitrile-butadiene-styrene) plastic dominates as the substrateof choice for most applications because of a blend of mechanical andprocess properties and ability to be uniformly etched. The overallplating process comprises many steps. First, the plastic substrate ischemically etched to microscopically roughen the surface. This isfollowed by depositing an initial metal layer by chemical reduction(typically referred to as “electroless plating”). This initial metallayer is normally copper or nickel of thickness typically one-halfmicrometer. The object is then electroplated with metals such as copper,bright nickel and chromium to achieve the desired thickness anddecorative effects. The process is very sensitive to processingvariables used to fabricate the plastic substrate, limiting applicationsto carefully prepared parts and designs. In addition, the many stepsemploying harsh chemicals make the process intrinsically costly andenvironmentally difficult. Finally, the sensitivity of ABS plastic toliquid hydrocarbons has prevented certain applications. ABS and othersuch polymers have been referred to as “electroplateable” polymers orresins. This is a misnomer in the strict sense, since ABS (and othernonconductive polymers) are incapable of accepting an electrodepositdirectly and must be first metallized by other means before beingfinally coated with an electrodeposit. The conventional technology forelectroplating on plastic (etching, chemical reduction, electroplating)has been extensively documented and discussed in the public andcommercial literature. See, for example, Saubestre, Transactions of theInstitute of Metal Finishing, 1969, Vol. 47., or Arcilesi et al.,Products Finishing, March 1984.

Many attempts have been made to simplify the process of electroplatingon plastic substrates. Some involve special chemical techniques toproduce an electrically conductive film on the surface. Typical examplesof this approach are taught by U.S. Pat. No. 3,523,875 to Minklei, U.S.Pat. No. 3,682,786 to Brown et. al., and U.S. Pat. No. 3,619,382 toLupinski. The electrically conductive film produced was thenelectroplated. None of these attempts at simplification have achievedany recognizable commercial application.

A number of proposals have been made to make the plastic itselfconductive enough to allow it to be electroplated directly therebyavoiding the “electroless plating” process. It is known that one way toproduce electrically conductive polymers is to incorporate conductive orsemiconductive fillers into a polymeric binder. Investigators haveattempted to produce electrically conductive polymers capable ofaccepting an electrodeposited metal coating by loading polymers withrelatively small conductive particulate fillers such as graphite, carbonblack, and silver or nickel powder or flake. Heavy such loadings aresufficient to reduce volume resistivity to a level where electroplatingmay be considered. However, attempts to make an acceptableelectroplateable polymer using the relatively small metal containingfillers alone encounter a number of barriers. First, the most conductivefine metal containing fillers such as silver are relatively expensive.The loadings required to achieve the particle-to-particle proximity toachieve acceptable conductivity increases the cost of the polymer/fillerblend dramatically. The metal containing fillers are accompanied byfurther problems. They tend to cause deterioration of the mechanicalproperties and processing characteristics of many resins. Thissignificantly limits options in resin selection. All polymer processingis best achieved by formulating resins with processing characteristicsspecifically tailored to the specific process (injection molding,extrusion, blow molding, printing etc.). A required heavy loading ofmetal filler severely restricts ability to manipulate processingproperties in this way. A further problem is that metal fillers can beabrasive to processing machinery and may require specialized screws,barrels, and the like.

Another major obstacle involved in the electroplating of electricallyconductive polymers is a consideration of adhesion between theelectrodeposited metal and polymeric substrate (metal/polymer adhesion).In most cases sufficient adhesion is required to prevent metal/polymerseparation during extended environmental and use cycles. Despite beingelectrically conductive, a simple metal-filled polymer offers no assuredbonding mechanism to produce adhesion of an electrodeposit since themetal particles may be encapsulated by the resin binder, often resultingin a resin-rich “skin”.

A number of methods to enhance electrodeposit adhesion to electricallyconductive polymers have been proposed. For example, etching of thesurface prior to plating can be considered. Etching can be achieved byimmersion in vigorous solutions such as chromic/sulfuric acid.Alternatively, or in addition, an etchable species can be incorporatedinto the conductive polymeric compound. The etchable species at exposedsurfaces is removed by immersion in an etchant prior to electroplating.Oxidizing surface treatments can also be considered to improvemetal/plastic adhesion. These include processes such as flame or plasmatreatments or immersion in oxidizing acids. In the case of conductivepolymers containing finely divided metal, one can propose achievingdirect metal-to-metal adhesion between electrodeposit and filler.However, here the metal particles are generally encapsulated by theresin binder, often resulting in a resin rich “skin”. To overcome thiseffect, one could propose methods to remove the “skin”, exposing activemetal filler to bond to subsequently electrodeposited metal.

Another approach to impart adhesion between conductive resin substratesand electrodeposits is incorporation of an “adhesion promoter” at thesurface of the electrically conductive resin substrate. This approachwas taught by Chien et al. in U.S. Pat. No. 4,278,510 where maleicanhydride modified propylene polymers were taught as an adhesionpromoter. Luch, in U.S. Pat. No. 3,865,699 taught that certain sulfurbearing chemicals could function to improve adhesion of initiallyelectrodeposited Group VIII metals.

For the above reasons, electrically conductive polymers employing metalfillers have not been widely used as bulk substrates forelectroplateable articles. Such metal containing polymers have found useas inks or pastes in production of printed circuitry. Revived effortsand advances have been made in the past few years to accomplishelectroplating onto printed conductive patterns formed by silver filledinks and pastes.

An additional physical obstacle confronting practical electroplatingonto electrically conductive polymers is the initial “bridge” ofelectrodeposit onto the surface of the electrically conductive polymer.In electrodeposition, the substrate to be plated is often made cathodicthrough a pressure contact to a metal rack tip, itself under cathodicpotential. However, if the contact resistance is excessive or thesubstrate is insufficiently conductive, the electrodeposit currentfavors the rack tip to the point where the electrodeposit will notbridge to the substrate.

Moreover, a further problem is encountered even if specialized rackingor cathodic contact successfully achieves electrodeposit bridging to thesubstrate. Many of the electrically conductive polymers haveresistivities far higher than those of typical metal substrates. Also,many applications involve electroplating onto a thin (less than 25micrometer) printed substrate. The conductive polymeric substrate may berelatively limited in the amount of electrodeposition current which italone can convey. Thus, the conductive polymeric substrate does notcover almost instantly with electrodeposit as is typical with metallicsubstrates. Except for the most heavily loaded and highly conductivepolymer substrates, a large portion of the electrodeposition currentmust pass back through the previously electrodeposited metal growinglaterally over the surface of the conductive plastic substrate. In afashion similar to the bridging problem discussed above, theelectrodeposition current favors the electrodeposited metal and thelateral growth can be extremely slow and erratic. This restricts thesize and “growth length” of the substrate conductive pattern, increasesplating costs, and can also result in large non-uniformities inelectrodeposit integrity and thickness over the pattern.

This lateral growth is dependent on the ability of the substrate toconvey current. Thus, the thickness and resistivity of the conductivepolymeric substrate can be defining factors in the ability to achievesatisfactory electrodeposit coverage rates. When dealing withselectively electroplated patterns long thin metal lines are oftendesired, deposited on a relatively thin electrically conductive polymersubstrate. These factors of course often work against achieving thedesired result.

This coverage rate problem likely can be characterized by a continuum,being dependent on many factors such as the nature of the initiallyelectrodeposited metal, electroplating bath chemistry, the nature of thepolymeric binder and the resistivity of the electrically conductivepolymeric substrate. As a “rule of thumb”, the instant inventorestimates that coverage rate issue would demand attention if theresistivity of the conductive polymeric substrate rose above about 0.001ohm-cm. Alternatively, a “rule of thumb” appropriate for thin filmsubstrates would be that attention is appropriate if the substrate filmto be plated had a surface “sheet” resistance of greater than about 0.1ohm per square.

The least expensive (and least conductive) of the readily availableconductive fillers for plastics are carbon blacks. Attempts have beenmade to electroplate electrically conductive polymers using carbon blackloadings. Examples of this approach are the teachings of U.S. Pat. Nos.4,038,042, 3,865,699, and 4,278,510 to Adelman, Luch, and Chien et al.respectively.

Adelman taught incorporation of conductive carbon black into a polymericmatrix to achieve electrical conductivity required for electroplating.The substrate was pre-etched in chromic/sulfuric acid to achieveadhesion of the subsequently electroplated metal. A fundamental problemremaining unresolved by the Adelman teaching is the relatively highresistivity of carbon loaded polymers. The lowest “microscopicresistivity” generally achievable with carbon black loaded polymers isabout 1 ohm-cm. Here “microscopic resistivity” refers to the resistivityof the polymer/carbon black matrix absent any additional additives. 1ohm-cm. is about five to six orders of magnitude higher than typicalelectrodeposited metals such as copper or nickel. Thus, theelectrodeposit bridging and coverage rate problems described aboveremained unresolved by the Adelman teachings.

Luch in U.S. Pat. No. 3,865,699 and Chien et al. in U.S. Pat. No.4,278,510 also chose carbon black as a filler to provide an electricallyconductive surface for the polymeric compounds to be electroplated. TheLuch U.S. Pat. No. 3,865,699 and the Chien U.S. Pat. No. 4,278,510 arehereby incorporated in their entirety by this reference. However, theseinventors further taught inclusion of materials to increase the rate ofmetal coverage or the rate of metal deposition on the polymer. Thesematerials can be described herein as “electrodeposit growth rateaccelerators” or “electrodeposit coverage rate accelerators”. Anelectrodeposit coverage rate accelerator is a material functioning toincrease the electrodeposition coverage rate over the surface of anelectrically conductive polymer independent of any incidental affect itmay have on the conductivity of an electrically conductive polymer. Inthe embodiments, examples and teachings of U.S. Pat. Nos. 3,865,699 and4,278,510, it was shown that certain sulfur bearing materials, includingelemental sulfur, can function as electrodeposit coverage or growth rateaccelerators to overcome problems in achieving electrodeposit coverageof electrically conductive polymeric surfaces having relatively highresistivity or thin electrically conductive polymeric substrates havinglimited current carrying capacity.

In addition to elemental sulfur, sulfur in the form of sulfur donorssuch as sulfur chloride, 2-mercapto-benzothiazole,N-cyclohexyle-2-benzothiaozole sulfonomide, dibutyl xanthogen disulfide,and tetramethyl thiuram disulfide or combinations of these and sulfurwere identified. Those skilled in the art will recognize that thesesulfur donors are the materials which have been used or have beenproposed for use as vulcanizing agents or accelerators. Since thepolymer-based compositions taught by Luch and Chien et al. could beelectroplated directly they could be accurately defined as directlyelectroplateable resins (DER). These directly electroplateable resins(DER) can be generally described as electrically conductive polymerswith the inclusion of a growth rate accelerator.

Specifically for the present invention, specification, and claims,directly electroplateable resins, (DER), are characterized by thefollowing features:

-   -   (a) presence of an electrically conductive polymer;    -   (b) presence of an electrodeposit coverage rate accelerator;    -   (c) presence of the electrically conductive polymer and the        electrodeposit coverage rate accelerator in the directly        electroplateable composition in cooperative amounts required to        achieve direct coverage of the composition with an        electrodeposited metal or metal-based alloy.

In his patents, Luch specifically identified unsaturated elastomers suchas natural rubber, polychloroprene, butyl rubber, chlorinated butylrubber, polybutadiene rubber, acrylonitrile-butadiene rubber,styrene-butadiene rubber etc. as suitable for the matrix polymer of adirectly electroplateable resin. Other polymers identified by Luch asuseful included polyvinyls, polyolefins, polystyrenes, polyamides,polyesters and polyurethanes.

When used alone, the minimum workable level of carbon black required toachieve “microscopic” electrical resistivities of less than 1000 ohm-cm.for a polymer/carbon black matrix mix appears to be about 8 weightpercent based on the combined weight of polymer plus carbon black. The“microscopic” material resistivity generally is not reduced below about1 ohm-cm. by using conductive carbon black alone. This is several ordersof magnitude larger than typical metal resistivities.

It is understood that in addition to carbon blacks, other well known,highly conductive fillers can be considered in DER compositions.Examples include but are not limited to metallic fillers or flake suchas silver. In these cases the more highly conductive fillers can be usedto augment or even replace the conductive carbon black. Furthermore, onemay consider using intrinsically conductive polymers to supply therequired conductivity. In this case, it may not be necessary to addconductive fillers to the polymer.

The “bulk, macroscopic” resistivity of conductive carbon black filledpolymers can be further reduced by augmenting the carbon black fillerwith additional highly conductive, high aspect ratio fillers such asmetal containing fibers. Herein, “macroscopic resistivity refers to theresistivity of the entire material mix, including all additives whetherthey be conductive or non-conductive and regardless of size. This can bean important consideration in the success of certain applications.Furthermore, one should realize that incorporation of non-conductivefillers may increase the “bulk, macroscopic” resistivity of conductivepolymers without significantly altering the “microscopic resistivity” ofthe conductive polymer “matrix” encapsulating the non-conductive fillerparticles.

Regarding electrodeposit coverage rate accelerators, both Luch and Chienet al. in the above discussed U.S. patents demonstrated that sulfur andother sulfur bearing materials such as sulfur donors and vulcanizationaccelerators function as electrodeposit coverage rate accelerators whenusing an initial Group VIII metal electrodeposit “strike” layer. Thus,an electrodeposit coverage rate accelerator need not be electricallyconductive, but may be a material that is normally characterized as anon-conductor. The coverage rate accelerator need not appreciably affectthe conductivity of the polymeric substrate. As an aid in understandingthe function of an electrodeposit coverage rate accelerator thefollowing is offered:

-   -   a. A specific conductive polymeric structure is identified as        having insufficient current carrying capacity to be directly        electroplated in a practical manner.    -   b. A material is added to the conductive polymeric material        forming said structure. Said material addition may have        insignificant affect on the current carrying capacity of the        structure (i.e. it does not appreciably reduce resistivity or        increase thickness).    -   c. Nevertheless, inclusion of said material greatly increases        the speed at which an electrodeposited metal laterally covers        the electrically conductive surface.        It is contemplated that a coverage rate accelerator may be        present as an additive, as a species absorbed on a filler        surface, or even as a functional group attached to the polymer        chain. One or more growth rate accelerators may be present in a        directly electroplateable resin (DER) to achieve combined, often        synergistic results.

A hypothetical example might be an extended line or trace of conductiveink having a dry thickness of 1 micrometer. Such inks typically includea conductive filler such as silver, nickel, copper, conductive carbonetc. The limited thickness of the ink reduces the current carryingcapacity of this line thus preventing direct electroplating in apractical manner. However, inclusion of an appropriate quantity of acoverage rate accelerator may allow the conductive line to be directlyelectroplated in a practical manner.

One might expect that other Group 6A elements, such as oxygen, seleniumand tellurium, could function in a way similar to sulfur. In addition,other combinations of electrodeposited metals, such as copper andappropriate coverage rate accelerators may be identified. It isimportant to recognize that such an electrodeposit coverage rateaccelerator is important in order to achieve direct electrodeposition ina practical way onto polymeric substrates having low conductivity orvery thin electrically conductive polymeric substrates having restrictedcurrent carrying ability.

It has also been found that the inclusion of an electrodeposit coveragerate accelerator promotes electrodeposit bridging from a discretecathodic metal contact to a DER surface. This greatly reduces thebridging problems described above.

Due to multiple performance problems associated with their intended enduse, none of the attempts identified above to directly electroplateelectrically conductive polymers or plastics has ever achieved anyrecognizable commercial success. Nevertheless, the current inventor haspersisted in personal efforts to overcome certain performancedeficiencies associated with the initial DER technology. Along withthese efforts has come a recognition of unique and eminently suitableapplications employing the DER technology. Some examples of these uniqueapplications for electroplated articles include solar cell electricalcurrent collection grids, electrodes, electrical circuits, electricaltraces, circuit boards, antennas, capacitors, induction heaters,connectors, switches, resistors, inductors, batteries, fuel cells,coils, signal lines, power lines, radiation reflectors, coolers, diodes,transistors, piezoelectric elements, photovoltaic cells, emi shields,biosensors and sensors. One readily recognizes that the demand for suchfunctional applications for electroplated articles is relatively recentand has been particularly explosive during the past decade.

It is important to recognize a number of important characteristics ofdirectly electroplateable resins (DERs) which facilitate the currentinvention. One such characteristic of the DER technology is its abilityto employ polymer resins and formulations generally chosen inrecognition of the fabrication process envisioned and the intended enduse requirements. In order to provide clarity, examples of some suchfabrication processes are presented immediately below in subparagraphs 1through 10.

-   -   (1) Should it be desired to electroplate an ink, paint, coating,        or paste which may be printed or formed on a substrate, a good        film forming polymer, for example a soluble resin such as an        elastomer, can be chosen to fabricate a DER ink (paint, coating,        paste etc.). For example, in some embodiments thermoplastic        elastomers having an olefin base, a urethane base, a block        copolymer base or a random copolymer base may be appropriate. In        some embodiments the coating may comprise a water based latex.        Other embodiments may employ more rigid film forming polymers.        The DER ink composition can be tailored for a specific process        such flexographic printing, rotary silk screening, gravure        printing, flow coating, spraying etc. Furthermore, additives can        be employed to improve the adhesion of the DER ink to various        substrates. One example would be tackifiers.    -   (2) Very thin DER lines often associated with collector grid        structures can be printed and then electroplated due to the        inclusion of the electrodeposit growth rate accelerator.    -   (3) Should it be desired to cure the DER substrate to a 3        dimensional matrix, an unsaturated elastomer or other “curable”        resin may be chosen.    -   (4) DER inks can be formulated to form electrical lines on a        variety of flexible substrates. For example, should it be        desired to form electrical structure on a laminating film, a DER        ink adherent to the sealing surface of the laminating film can        be effectively electroplated with metal and subsequently        laminated to a separate surface.    -   (5) Should it be desired to electroplate a fabric, a DER ink can        be used to coat all or a portion of the fabric intended to be        electroplated. Furthermore, since DER's can be fabricated out of        the thermoplastic materials commonly used to create fabrics, the        fabric itself could completely or partially comprise a DER. This        would eliminate the need to coat the fabric.    -   (6) Should one desire to electroplate a thermoformed article or        structure, DER's would represent an eminently suitable material        choice. DER's can be easily formulated using olefinic materials        which are often a preferred material for the thermoforming        process. Furthermore, DER's can be easily and inexpensively        extruded into the sheet like structure necessary for the        thermoforming process.    -   (7) Should one desire to electroplate an extruded article or        structure, for example a sheet or film, DER's can be formulated        to possess the necessary melt strength advantageous for the        extrusion process.    -   (8) Should one desire to injection mold an article or structure        having thin walls, broad surface areas etc. a DER composition        comprising a high flow polymer can be chosen.    -   (9) Should one desire to vary adhesion between an        electrodeposited DER structure supported by a substrate the DER        material can be formulated to supply the required adhesive        characteristics to the substrate. For example, the polymer        chosen to fabricate a DER ink can be chosen to cooperate with an        “ink adhesion promoting” surface treatment such as a material        primer or corona treatment. In this regard, it has been observed        that it may be advantageous to limit such adhesion promoting        treatments to a single side of the substrate. Treatment of both        sides of the substrate in a roll to roll process may adversely        affect the surface of the DER material and may lead to        deterioration in plateability. For example, it has been observed        that primers on both sides of a roll of PET film have adversely        affected plateability of DER inks printed on the PET. It is        believed that this is due to primer being transferred to the        surface of the DER ink when the PET is rolled up.    -   (10) Should it be desirable to release a plated DER pattern from        a supporting substrate, the DER may be formulated to readily        release from the substrate material. In this case, the plated        DER pattern may be transferred from its original supporting        substrate to a receiving second substrate. The original        supporting substrate functions as a surrogate support during        formation and electroplating of the pattern and then is        subsequently removed during transfer of the electroplated        pattern to the second substrate.

All polymer fabrication processes require specific resin processingcharacteristics for success. The ability to “custom formulate” DER's tocomply with these changing processing and end use requirements whilestill allowing facile, quality electroplating is a significant factor inthe teachings of the current invention.

Another important recognition regarding the suitability of DER's for theteachings of the current invention is the simplicity of theelectroplating process. Unlike many conventional electroplated plastics,DER's do not require a significant number of process steps prior toactual electroplating. This allows for simplified manufacturing andimproved process control. It also reduces the risk of crosscontamination such as solution dragout from one process bath beingtransported to another process bath. The simplified manufacturingprocess will also result in reduced manufacturing costs.

Another important recognition regarding the suitability of DER's for theteachings of the current invention is the wide variety of metals andalloys capable of being electrodeposited. Deposits may be chosen forspecific attributes. Examples may include copper or silver forconductivity, nickel, chromium and gold for corrosion resistance, andtin and tin containing alloys for low temperature solderability orelectrical contact improvement.

Yet another recognition of the benefit of DER's for the teachings of thecurrent invention is the ability they offer to selectively electroplatean article or structure. The articles of the current invention oftenconsist of selective metal patterns selectively positioned inconjunction with insulating materials. Such selective positioning ofmetals is often expensive and difficult. However, the attributes of theDER technology make the technology eminently suitable for the productionof such selectively positioned metal structures. As will be shown inlater embodiments, it is often desired to electroplate a polymer orpolymer-based structure in a selective manner. DER's are eminentlysuitable for such selective electroplating.

Yet another recognition of the benefit of DER's for the teachings of thecurrent invention is the ability they offer to continuously electroplatean article or structure. As will be shown in later embodiments, it isoften desired to continuously electroplate articles. DER's are eminentlysuitable for such continuous electroplating. Furthermore, DER's allowfor selective electroplating in a continuous manner.

Yet another recognition of the benefit of DER's for the teachings of thecurrent invention is their ability to withstand the pre-treatments oftenrequired to prepare other materials for plating. For example, were a DERto be combined with a metal, the DER material would be resistant to manyof the pre-treatments such as cleaning which may be necessary toelectroplate the metal.

Yet another recognition of the benefit of DER's for the teachings of thecurrent invention is that the desired plated structure often requiresthe plating of long and/or broad surface areas. As discussed previously,the coverage rate accelerators included in DER formulations allow forsuch extended surfaces to be covered in a relatively rapid manner thusallowing one to consider the use of electroplating of conductivepolymers.

These and other attributes of DER's may contribute to successfularticles and processing of the instant invention. However, it isemphasized that the DER technology is but one of a number of alternativemetal deposition or positioning processes suitable to produce many ofthe embodiments of the instant invention. Other approaches, such aselectroless metal deposition, electroplating onto silver ink patterns,positioning metal forms such as wire or mesh and many other additive orsubtractive processes to selectively pattern conductive materials may besuitable alternatives. These choices will become clear in light of theteachings to follow in the remaining specification, accompanying figuresand claims.

In order to eliminate ambiguity in terminology, for the presentinvention, specification and claims the following definitions aresupplied.

While not precisely definable, electrically insulating materials maygenerally be characterized as having electrical resistivities greaterthan about 10,000 ohm-cm. Also, electrically conductive materials maygenerally be defined and characterized as materials having electricalresistivities less than 0.001 ohm-cm. Also electrically resistive orsemi-conductive materials may generally be characterized as havingelectrical resistivities in the range of 0.001 ohm-cm to 10,000 ohm-cm.,although such materials are also often characterized as simply“conductive”. For example, certain metal oxides are characterized as“conductive” even though they may have resistivities greater than 0.001ohm-cm. Also, the characterization “electrically conductive polymer”covers a very wide range of intrinsic resistivities depending on theapplication, the filler, the filler loading and the methods ofmanufacture of the filler/polymer blend. Resistivities for electricallyconductive polymers may be as low as 0.00001 ohm-cm. for very heavilyfilled silver inks, yet may be as high as 10,000 ohm-cm or even more forlightly filled carbon black materials or other “anti-static” materials.“Electrically conductive polymer” has become a broad industry term tocharacterize all such materials. Thus, the term “electrically conductivepolymer” as used in the art and in this specification and claims extendsto materials of a very wide range of resitivities from about 0.00001ohm-cm. to about 10,000 ohm-cm and higher.

“Substantially” means being largely or wholly that which is specified.

“Essentially” means fundamentally or “for all intents and purposes”.

A “pattern” is a design or arrangement.

“Direct physical contact” means “touching”.

A “low melting point” metal or alloy is one with a melting point lessthan 600 degrees Fahrenheit.

“Selectively positioned” means that which is specified is positioned ina preselected arrangement or design.

“Terminal edge” is a boundary outside of which there is none of thatwhich is specified.

An “electroplateable material” is a material having suitable attributesthat allow it to be coated with a layer of electrodeposited material,either directly or following a preplating process.

A “metallizable material” is a material suitable to be coated with ametal deposited by any one or more of the available metallizingprocesses, including but not limited to chemical deposition, vacuummetallizing, sputtering, metal spraying, sintering electrolessdeposition and electrodeposition.

“Metal-based” refers to a material or structure having at least onemetallic property and comprising one or more components at least one ofwhich is a metal or metal-containing alloy.

“Alloy” refers to a substance composed of two or more intimately mixedmaterials.

“Group VIII metal-based” refers to a substance containing by weight 50%to 100% metal from Group VIII of the Periodic Table of Elements.

A “metal-based foil”, “bulk metal foil”, “bulk metal wire” etc. refersto structure of metal or metal-based material that may maintain itsintegrity absent a supporting structure. Generally, metal films ofthickness greater than about 2 micrometers may have this characteristic(i.e. 2 micrometers, 10 micrometers, 25 micrometers, 100 micrometers,250 micrometers etc.). Thus, in most cases a “bulk metal foil” will havea thickness between about 2 micrometers and 250 micrometers and maycomprise a structure of multiple layers. Metal wires of diameter greaterthan about 10 micrometers may exhibit self supporting characteristic andtherefore be classified as a “bulk metal wire” wire form.

A “self supporting” structure is one that can be expected to maintainits integrity and form absent supporting structure.

“Portion” means a part of a whole item. When used herein, “portion” mayindicate 100 percent or less of the whole item (i.e. 100 percent, 90percent, 80 percent, 70 percent, 60 percent, 50 percent, 40 percent, 30percent, 20 percent, 10 percent 5 percent, and 1 percent).

A “film” refers to a thin material form having length and width muchgreater than its thickness that may or may not be self supporting.

The terms “monolithic” or “monolithic structure” are used as is commonin industry to describe structure that is made or formed from a singleor uniform material. An example would be a “boat having a monolithicplastic hull”.

A “continuous form” of material is one that has a length dimension fargreater than its width or thickness such that the material can besupplied or produced in its length dimension without substantialinterruption.

A “continuous process” is one wherein a continuous form of a materialcomponent is supplied to or produced by the process. The material feedor output can be as continuous motion or repetitively intermittent. Theoutput product is normally removed either by continuous motion orrepetitively intermittent according to the rate of input.

A “roll-to-roll” process is one wherein a material component is fed tothe process from a roll of material and the output of the process isaccumulated in a roll form.

The “machine direction” is that direction in which material istransported through a process step.

The term “multiple” is used herein to mean “two or more”.

“Sheetlike” characterizes a structure or form having surface dimensionsfar greater than a thickness dimension. A “sheetlike” structure or formcan comprise multiple layers and has a top side (defined by length andwidth) and an oppositely disposed bottom side.

A “web” is a sheetlike material form often characterized as continuousin a length direction.

An “adhesive” is a material that can bond to a surface or object.

A “laminating adhesive” is an adhesive material in the form of a layeror film. The adhesive will typically be activated using heat or pressureor a combination of both.

“Adhesive affinity” is a characteristic of a material's ability toadhesively bond to a mating surface. A material has “adhesive affinity”for a mating surface if it can form or has formed an adhesive bonddirectly to that surface using appropriate adhesive processing.

“Substantially planar” or “essentially planar characterize a surfacestructure which may comprise minor variations in surface topography butfrom an overall and functional perspective can be considered essentiallyflat.

The terms “upper”, “upward facing”, and “top” surfaces or sides ofstructure refer to those surfaces or sides of structures facing upwardin normal use. For example, when used to describe a photovoltaic device,an “upper” surface or side refers to that surface or side intended toface the sun.

The terms “lower”, “downward facing” or “bottom” surfaces or sides referto surfaces or sides facing away from an upper, upward facing or topsurface or side of the structure.

The term “polymer” refers to materials comprising repetitive structuralunits. Polymers are often commonly referred to as “plastics”. Polymerscomprise a broad class of materials having a wide variety of chemical,physical and mechanical properties. Most common polymers are carbonbased (organic polymers) or silicon based (for example siliconematerials). “Polymeric” refers to a material or structure comprising apolymer.

“Organic” materials are those based on or having a significant portionof their structure and characteristics defined by carbon. “Inorganic”materials are those substantially absent carbon.

The term “cross-linked” indicates a polymer condition wherein bondingoccurs between polymer chains. Prior to “cross-linking”, a polymer maybe “flowable” under temperature and pressure. After “cross-linking” thepolymer resists flow.

A “thermoplastic” material is one that becomes fluid and can flow at anelevated temperature. A thermoplastic material may be relatively rigidand non-tacky at room temperature and “melts” (becomes fluid) atelevated temperature above ambient.

An “ohmic” connection, joining or communication is one that behaveselectrically in a manner substantially in accordance with Ohm's Law.

“Conductive joining” refers to fastening two conductive articlestogether such that ohmic electrical communication is achieved betweenthem. “Conductive joining” includes soldering, welding such as achievedwith current, laser, heat etc., conductive adhesive application,mechanical contacts achieved with crimping, twisting and the like, andlaminated contacts as described herein.

An “additive process” is one wherein there is no substantial removal ofmaterial in order to generate a desired material form. Examples ofadditive processing are metal electrodeposition and placement ofpreformed shapes such as metal wires and strips. Examples ofnon-additive processing (subtractive processing) are photoetching ofmetal foils to produce selectively patterned metal devices.

A “structural polymer” is a polymer, such as a plastic, that can providestructural support, often to overlying or underlying structure. A“structural polymer” may also be referred to as a “polymeric support” ora “polymeric carrier”.

“Heat sealing” is a process of attaching two forms together using heat.Heat sealing normally involves softening of the surfaces of one or bothforms to allow material flow and bond activation. “Heat sealing” caninvolve a simple welding of two similar materials or may employ anintermediary adhesive to bond (seal) the two materials to each other.

“Overlapping” identifies a condition wherein one layer or structureeither completely or partially overlays or covers another. Overlappingmay comprise either complete or partial coverage.

“Laminating” is a process involving the mating of two or more surfaces.It normally involves partial or complete overlapping of two or morematerial bodies. The bodies normally have a “sheetlike” form such thatthe laminating process positions the “sheetlike” forms relative to eachother as a layered combination. Laminating often involves the activationof an intermediary “laminating” adhesive medium between the “sheetlike”forms to securely attach the layers to each other. Activation of the“laminating” adhesive is normally accomplished using heat and/orpressure to cause the adhesive to soften and flow to “wet” andintimately contact the mating surface.

“Vacuum lamination” is a process wherein multiple material layers arestacked and a vacuum is drawn encompassing the assembly. Heat is alsonormally used to activate intermediary adhesive layers to bond thestacked layers together.

“Roll lamination” is a process wherein one or more material layers arefed to a pair of rollers positioned with a determined separation (a“nip”). In passing through the “nip” the layers are squeezed together.The layers may be heated during the squeezing process to cause flow andcontact of an intermediary thermoplastic adhesive. Alternatively, apressure sensitive adhesive may be employed without heating whereinpressure causes flow of adhesive to wet the surfaces.

A “laminated contact” is an electrical and physical contact between twoconductive structures which is established and maintained by a polymericlaminating adhesive. A first of the conductive structures is positionedbetween the polymeric adhesive and a surface of the second conductivestructure. Laminating the adhesive to the surface of the secondstructure keeps the first conductive structure between them. The“blanketing” of the first conductive structure securely holds the firstand second conductive structures together.

When describing an object, the adjective “flexible” means that theobject may be significantly deformed without breaking. An object mayoften be flexible because one of its dimensions such as thickness issmall. In addition, flexibility is often, though not always, accompaniedby elasticity in that the object is not necessarily permanently deformedby bending and can be returned to substantially its original shape afterbeing deformed.

The terms “preponderance” or “major portion” designate a quantitygreater than fifty percent (i.e. 50%, 60%, 70%, 80%, 90%, 95%, 100%).

“Transparent” is an adjective characterizing a material or structurethat will transmit a preponderance or major portion of impinging lightor electromagnetic radiation. When used to characterize a component of aphotovoltaic device, transparent describes structure which transmitsradiation (such as visible light) to an extent sufficient to allowacceptable performance of the device.

“Translucent” is an adjective characterizing a structure that transmitsa preponderance or major portion of impinging light or electromagneticradiation but diffuses a portion such that transmitted images arerendered cloudy or blurred.

“Metal oxide” is a chemical compound comprising two or more elements oneof which is oxygen and a least one of which is a metal.

“Substrate” is a structure that can provide support.

An “interconnection component” or “interconnecting component” is astructure designed to facilitate power collection from one or morephotovoltaic cells. An “interconnection component” may comprise acurrent collector structure, an interconnection structure, or acombination of both a current collector and interconnection structure.

“Solder” is a low melting point metal or metal alloy often used toachieve conductive joining.

“Conductive adhesive” is a conductive polymeric material that canadhesively bond to a surface. “Conductive adhesives” are often employedto achieve conductive joining.

A “coating” is a layer of material overlaying a base structure.

OBJECTS OF THE INVENTION

An object of the invention is to teach improvements in the photovoltaicart. The advantages of the invention will become apparent in light ofthe drawings and embodiments.

SUMMARY OF THE INVENTION

In an embodiment of the invention the active photovoltaic cells and aninterconnecting component are produced separately and distinctly. Thecells and interconnecting component are subsequently combined.

An embodiment of the invention contemplates producing thin filmphotovoltaic structures devoid of organic materials on metal foilsubstrates which may be heat treated following deposition in acontinuous fashion without deterioration of the metal support or thinfilm photovoltaic material structures. Completely inorganic thin filmphotovoltaic cells include those based on active layers chosen from, butnot limited to, Cadmium Telluride, Copper-Indium-Gallium Selenide(CIGS), Copper-Zinc-Tin Selenide, (TZTS), amorphous silicon and thinfilm crystalline silicon.

In an embodiment, the photovoltaic junction with its metal foil supportcan be produced and heat treated at elevated temperatures as necessaryin bulk and possibly roll-to-roll fashion.

In an embodiment, the semiconductor materials forming a photovoltaicjunction are deposited over the entire expanse of a supporting metalbased foil.

In an embodiment, the photovoltaic cell has a light incident surfaceformed by a transparent or translucent electrically conductive material.

In an embodiment, the photovoltaic cell has a light incident surfaceformed by a transparent electrically conductive metal oxide.

In an embodiment, an interconnection component or portions thereof areproduced separately and distinctly absent a photovoltaic cell. In thisway the photovoltaic cell structure can be produced using processes(such a heat treatments) possibly inappropriate for the interconnectioncomponent. Many of the heat treatments and processes employed forinorganic cells are at temperatures where organic materials wouldrapidly deteriorate. Therefore, production of the interconnectioncomponent separate from the cell production allows the use of organicmaterials and polymers and their unique forms and processing to be usedfor the interconnection component.

In an embodiment, an interconnecting component comprises a pattern ofelectrically conductive material.

In an embodiment, a interconnecting component comprises a pattern ofelectrically conductive material positioned on a supporting sheetlikesubstrate.

In an embodiment, a interconnecting component comprises a pattern ofadditional electrically conductive material.

In an embodiment, a interconnecting component comprises a pattern ofadditional electrically conductive material positioned on a supportingsheetlike substrate.

In an embodiment, the interconnecting component is combined with totallyinorganic photovoltaic cells after high temperature heat treatments ofthe cells.

In an embodiment, an interconnecting component comprises a currentcollector pattern that extends over a preponderance or major portion ofthe light incident surface of a photovoltaic cell.

In an embodiment, an interconnecting component comprises a currentcollector pattern that is in direct physical contact with an essentiallyplanar light incident surface of a photovoltaic cell.

In an embodiment, an interconnecting component comprises a currentcollector pattern that is in direct physical contact with a lightincident surface of a photovoltaic cell and does not penetrate orsubstantially embed into the photovoltaic cell.

In an embodiment, an interconnecting component comprising comprises aninsulating sheetlike substrate portion and electrically conductivematerial extends through one or more holes in the insulating portionfrom the downward facing side to the upward facing side of thesubstrate.

In an embodiment, an interconnecting component comprises a sheetlikesubstrate having oppositely facing surfaces or sides separated by athickness and terminal edges defined by the length and width dimensionsof the sheetlike substrate. Ohmically joined electrically conductivematerial is positioned on the oppositely facing sides and whereinelectrically conductive material does not extend outside the terminaledges.

In an embodiment, an interconnection component is manufactured using afully additive process.

In an embodiment, an interconnection component has a continuous form.

In an embodiment, an interconnection component is flexible.

In an embodiment, an interconnecting component or portions thereof, aremanufactured using a continuous process.

In an embodiment, an interconnecting component or portions thereof, aremanufactured using a continuous roll-to-roll process.

In an embodiment, an interconnecting component is attached to the lightincident surface of a photovoltaic cell.

In an embodiment, an interconnecting component is attached to the lightincident surface of a photovoltaic cell employing a process whereineither the cell structure or the interconnection component is providedto the process as a continuous form.

In an embodiment, an interconnecting component is attached to the lightincident face of a photovoltaic cell using a lamination processemploying pressure and optionally heat.

In an embodiment, an interconnecting component is attached to the lightincident face of a photovoltaic cell using a roll lamination processemploying pressure and optionally heat.

In an embodiment, a flexible article is produced when a currentcollector portion of a interconnecting component is attached to thelight incident surface of a photovoltaic cell.

In an embodiment, a portion of the current collector region of aninterconnecting component comprises a metal pattern positioned on thetop surface of a photovoltaic cell and wherein a polymeric adhesivefunctions as a blanket overlaying portions of the pattern. Adhesion ofthe adhesive polymer to the top cell surface in regions closely adjacentthe pattern portions holds the pattern portions in firm ohmic electricalcontact with the top cell surface.

In an embodiment, a portion of an interconnection region of ainterconnecting component comprises a metal pattern positioned under thebottom surface of a photovoltaic cell and wherein a polymeric adhesiveblankets pattern portions to position the portions between the adhesiveand bottom cell surface. Adhesion of the adhesive polymer to the bottomcell surface in regions adjacent the pattern portions holds the patternportions in firm ohmic electrical contact with the bottom cell surface.

In an embodiment, the contact between a metal pattern and either the topsurface or bottom surface of a photovoltaic cell is maintained by theblanketing effect of an overlaying adhesive absent the use of solder.

In an embodiment, an interconnection component comprising a currentcollector or current collector/interconnection structure is preparedseparately, absent a photovoltaic cell. The interconnecting componentcomprises a collector portion having a first pattern of conductivematerial positioned on a downward facing surface or side of a polymericlaminating, positioning or encapsulation sheet. The downward facingsurface or side may be positioned in abutting contact with an upwardfacing conductive surface or side such as the top light incident surfaceof a first photovoltaic cell. The interconnect portion comprisesadditional conductive material positioned on or forming an upward facingsurface or side portion of the combined structure. The additionalconductive material may form a second pattern. In an embodiment, theupward facing surface or side of an interconnect portion may bepositioned to abut the bottom conductive surface of a secondphotovoltaic cell.

In an embodiment, portions of an interconnection component comprising acurrent collector or current collector/interconnection structure may belaminated to a surface of a photovoltaic cell. In an embodiment a rolllamination process is used to laminate the structures together.

In embodiments, production of interconnection components separately anddistinctly from the solar cells allows the structures to be uniquelyformulated using polymer-based materials. Further, in embodimentsseparate production of interconnection components allows for and a widerange of processing options and physical forms for the variousconductive and non-conductive components.

In embodiments, laminated application permits current collection andinterconnections among cells to be achieved without a requirement to usethe expensive solders, conductive inks and adhesives, or intricatematerial removal operations although these materials and operations maybe optionally employed.

In an embodiment, electrical and physical contact between a conductivematerial and the top surface of a photovoltaic cell is maintained usinga laminated contact and wherein the contact is absent solder orconductive adhesive.

In an embodiment, electrical and physical contact between a conductivematerial and a bottom conductive surface region of a photovoltaic cellis maintained using a laminated contact and wherein said contact isabsent solder or conductive adhesive.

In an embodiment, conductive material in electrical and physical contactwith the top surface of a photovoltaic cell comprises a low meltingpoint material.

In an embodiment, conductive material in electrical and physical contactwith the top surface of a photovoltaic cell comprises indium.

In an embodiment, a conductive pattern is positioned on a temporaryrelease or surrogate support substrate which is removed just prior to,during or subsequent to application of the pattern to a matingconductive cell surface. The pattern may comprise delicate and finedetail which is maintained by the surrogate support. In an embodiment,the pattern may have an “attachment medium” or” bonding surface” whichmaintains contact of portions of the pattern to the surface afterremoval of the surrogate. This “attachment material” can be a conductiveadhesive, a selectively placed non-conductive adhesive or a low meltingpoint alloy. In some cases the pattern may be selectively coated with asticky material such as a conductive b-stage epoxy. In these cases theinterleaved release film promotes handling prior to application to thecell and subsequent curing. One realizes that it may be advantageous toprepare the pattern and interleaved release film as a continuous formand accumulated on a roll for subsequent application to a mating cellsurface.

In an embodiment, an interconnecting component has a first sheetlikeportion positioned beneath a cell. The portion has holes from a top tobottom side and conductive material is positioned on the top sidesurrounding the holes. An adhesive material is laminated to the bottomside of the substrate portion such that adhesive flow through the holesto the bottom cell surface thereby establishes and maintains electricalcontact of the conductive material with the bottom cell surface.

BRIEF DESCRIPTION OF THE DRAWINGS

The various factors and details of the structures and manufacturingmethods of the present invention are hereinafter more fully set forthwith reference to the accompanying drawings wherein:

FIG. 1 is a top plan view of a prior art thin film photovoltaicstructure including its support structure.

FIG. 1A is a top plan view of the article of FIG. 1 following anoptional processing step of subdividing the article of FIG. 1 intostructure of smaller dimension.

FIG. 2 is a sectional view taken substantially along the line 2-2 ofFIG. 1.

FIG. 2A is a sectional view taken substantially along the line 2A-2A ofFIG. 1A.

FIG. 2B is a simplified sectional depiction of the structure embodied inFIG. 2A.

FIG. 2C is a simplified sectional view similar to FIG. 2B but alsoincluding additional insulating structure protecting raw cell edges.

FIG. 3 is an expanded sectional view showing a form of the structure ofsemiconductor 11 of FIGS. 2 and 2A.

FIG. 4 illustrates a possible process for producing the prior artstructure shown in FIGS. 1-3.

FIG. 5 illustrates the electrical path between two adjacent seriesconnected prior art cells.

FIG. 6 is a top plan view of a starting structure for a first embodimentof the instant invention.

FIG. 7 is a sectional view, taken substantially along the lines 7-7 ofFIG. 6, illustrating a possible laminate structure of the embodiment.

FIGS. 7A and 7B are sectional views of alternate embodiments ofsheetlike substrates.

FIG. 8 is a simplified sectional depiction of the FIG. 7 structuresuitable for ease of presentation of additional embodiments.

FIG. 9 is a top plan view of the structure embodied in FIGS. 6 through 8following an additional processing step.

FIG. 10 is a sectional view taken substantially from the perspective oflines 10-10 of FIG. 9.

FIG. 11 is a sectional view taken substantially from the perspective oflines 11-11 of FIG. 9.

FIG. 12 is a top plan view of an article resulting from exposing theFIG. 9 article to an additional processing step.

FIG. 13 is a sectional view taken substantially from the perspective oflines 13-13 of FIG. 12.

FIG. 14 is a sectional view taken substantially from the perspective oflines 14-14 of FIG. 12.

FIG. 15 is a sectional view taken substantially from the perspective oflines 15-15 of FIG. 12.

FIG. 15A is a view from a perspective similar to that of FIG. 15 butfollowing an additional optional processing step.

FIG. 16 is a top plan of an alternate embodiment similar in structure tothe embodiment of FIG. 9.

FIG. 17 is a sectional view taken substantially from the perspective oflines 17-17 of FIG. 16.

FIG. 17A is a sectional view similar to FIG. 17 showing an additionaloptional component included to prevent shorting during application tocells.

FIG. 18 is a sectional view taken substantially from the perspective oflines 18-18 of FIG. 16.

FIG. 19 is a simplified sectional view of the article embodied in FIG.18 suitable for ease of clarity of presentation of additionalembodiments.

FIG. 20 is a sectional view showing the article of FIG. 19 following anadditional optional processing step.

FIG. 20A is a view from a perspective similar to that of FIG. 20 butfollowing an additional optional processing step.

FIG. 20B is a view similar to FIG. 20A following combination of the FIG.20A structure with a photovoltaic cell.

FIG. 21 is a simplified depiction of a process useful in producingarticles of the instant invention.

FIG. 22 is a sectional view taken substantially from the perspective oflines 22-22 of FIG. 21 showing a possible arrangement of threecomponents just prior to the Process 92 depicted in FIG. 21.

FIG. 23 is a sectional view showing the result of combining thecomponents of FIG. 22 using the process of FIG. 21.

FIG. 24 is a sectional view embodying a series interconnection ofmultiple articles as depicted in FIG. 23.

FIG. 25 is an exploded sectional view of the region within the box “K”of FIG. 24.

FIG. 26 is a top plan view of a starting article in the production ofanother embodiment of the instant invention.

FIG. 27 is a sectional view taken from the perspective of lines 27-27 ofFIG. 26.

FIG. 28 is a simplified sectional depiction of the article of FIGS. 26and 27 useful in preserving clarity of presentation of additionalembodiments.

FIG. 29 is a top plan view of the original article of FIGS. 26-28following an additional processing step.

FIG. 30 is a sectional view taken substantially from the perspective oflines 30-30 of FIG. 29.

FIG. 31 is a sectional view of the article of FIGS. 29 and 30 followingan additional optional processing step.

FIG. 32 is a sectional view, similar to FIG. 22, showing an arrangementof articles just prior to combination using a process such as depictedin FIG. 21.

FIG. 33 is a sectional view showing the result of combining thearrangement depicted in FIG. 32 using a process as depicted in FIG. 21.

FIG. 34 is a sectional view of a series interconnection of a multiple ofarticles such as depicted in FIG. 33.

FIG. 35 is a top plan view of a starting article used to produce anotherembodiment of the instant invention.

FIG. 35A is a top plan view of an embodiment of an alternate structure.

FIG. 36 is a simplified sectional view taken substantially from theperspective of lines 36-36 of FIG. 35.

FIG. 36A is a simplified sectional view taken substantially from theperspective of lines 36A-36A of FIG. 35A.

FIG. 37 is a expanded sectional view of the article embodied in FIGS. 35and 36 showing a possible multi-layered structure of the article.

FIG. 38 is a sectional view showing a structure combining repetitiveunits of the article embodied in FIGS. 35 and 36.

FIG. 39 is a top plan view of the article of FIGS. 35 and 36 followingan additional processing step.

FIG. 39A is a top plan view of an alternate structural embodiment.

FIG. 40 is a sectional view taken from the perspective of lines 40-40 ofFIG. 39.

FIG. 41 is a sectional view similar to that of FIG. 40 following anadditional optional processing step.

FIG. 41A is a sectional view like FIG. 41 but showing additionalstructure added to the embodiments of FIGS. 35A and 36A.

FIG. 41B is a sectional view along the lines 41B-41B of FIG. 39A.

FIG. 42 is a sectional view showing a possible combining of the articleof FIG. 41 with a photovoltaic cell.

FIG. 42A is a sectional view showing a possible combining of the articleof FIG. 41A with a photovoltaic cell.

FIG. 42B is a sectional view showing a possible combining of the articleof FIG. 41B with a photovoltaic cell.

FIG. 43 is a sectional view showing multiple articles as in FIG. 42arranged in a series interconnected array.

FIG. 43A is a sectional view showing an embodiment of multiple articles227 a as in FIG. 42A in a series interconnected array.

FIG. 43B is a sectional view showing an embodiment of multiple articles227 b as in FIG. 42B in a series interconnected array.

FIG. 43C is a sectional view showing an alternate embodiment forconnecting multiple articles 227 as seen in FIG. 42 in a seriesarrangement.

FIG. 43D is a sectional view showing an alternate embodiment forconnecting multiple articles as identified as 227 b in FIG. 42B.

FIG. 44 is a top plan view of a starting article in the production ofyet another embodiment of the instant invention.

FIG. 45 is a sectional view taken substantially from the perspective oflines 45-45 of FIG. 44 showing a possible layered structure for thearticle.

FIG. 46 is a sectional view similar to FIG. 45 but showing an alternatestructural embodiment.

FIG. 46A is a sectional view showing yet another alternate structuralembodiment.

FIG. 46B is a sectional view of the FIG. 46A structural embodiment afteraddition of another component.

FIG. 46C is a top plan view of another structural embodiment.

FIG. 46D is a sectional view of the structural embodiment of FIG. 46Ctaken substantially from the perspective of lines 46D-46D of FIG. 46C.

FIG. 46E is a sectional view of the embodiment of FIGS. 46C and 46Dafter addition of another component.

FIG. 46F is a top plan view of another embodiment.

FIG. 46G is a top plan view of the structural embodiment of FIG. 46Fafter adding an additional structural component.

FIG. 46H is a side view of the embodiment shown in FIG. 46G.

FIG. 47 is a simplified sectional view of the substrates embodied inFIGS. 44-46H useful in maintaining clarity and simplicity for subsequentembodiments.

FIG. 48 is a top plan view of an article such as depicted in FIGS.44-46A and 47 following an additional processing step.

FIG. 49 is a sectional view taken substantially from the perspective oflines 49-49 of FIG. 48.

FIG. 50 is a top plan view of the article of FIGS. 48 and 49 followingan additional processing step.

FIG. 51 is a sectional view taken substantially from the perspective oflines 51-51 of FIG. 50.

FIG. 52 is a sectional view of the article of FIGS. 50 and 51 followingan additional optional processing step.

FIG. 53 is a top plan view of an article similar to that of FIG. 50 butembodying an alternate structural pattern.

FIG. 54 is a sectional view taken substantially from the perspective oflines 54-54 of FIG. 53.

FIG. 55 is a sectional view showing an article combining the article ofFIG. 52 with a photovoltaic cell.

FIG. 56 is a sectional view embodying series interconnection of multiplearticles as depicted in FIG. 55.

FIG. 57 is a top plan view of a structural arrangement as depicted inFIG. 56 but with some structural portions removed for clarity ofexplanation of a feature of the invention.

FIG. 58 is a sectional view taken substantially from the perspective oflines 58-58 of FIG. 57.

FIG. 59 shows top plan view of an alternate embodiment.

FIG. 59A is a sectional view taken substantially from the perspective ofsection lines 59A-59A of FIG. 59.

FIG. 60A is a sectional view embodying a possible condition when using acircular form in a lamination process.

FIG. 60B is a sectional view embodying a possible condition resultingfrom choosing a flat bottom form in a lamination process.

FIG. 61 is a top plan view embodying a possible process to achievepositioning of photovoltaic cells into a series interconnected array.

FIG. 62 is a perspective view of the process embodied in FIG. 61.

FIG. 63 is a top plan view of a modular array which may result from aprocess such as that of FIGS. 61 and 62. Thus, FIG. 63 may representstructure such as that embodied in the sectional views of FIGS. 24, 34,43 and 56.

FIG. 64 is a depiction of the enclosed portion of FIG. 63 labeled “64portion” which shows additional structural detail.

FIG. 65 is a simplified sectional view taken substantially from theperspective of lines 65-65 of FIG. 64. Thus, FIG. 65 may representsimplified views of structure such as that presented in the sectionalviews of FIGS. 24, 34, 43 and 56.

FIG. 66 is a side view of a process wherein an array such as depicted inFIG. 65 may be applied to a protective sheet using roll lamination.

FIG. 67 is a sectional view taken substantially from the perspective oflines 67-67 of FIG. 66.

FIG. 68 is a sectional view showing the details of the layered structureresulting from a lamination process such as that of FIG. 66 wherein aprotective layer is applied an array such as that of FIGS. 63-65.

FIG. 69 is a top plan view showing a simplified depiction of structureuseful to explain a concept of the invention.

FIG. 70 is a sectional view taken substantially from the perspective oflines 70-70 of FIG. 69 plus an additional mating component.

FIG. 71 is a replication of FIG. 15.

FIG. 72 shows the FIG. 71 structure following an optional process stepaccomplishing embedment of the conductive pattern into the substrate.

FIG. 73 is a view of the structure present in FIG. 20 but taken from theperspective such as that of FIG. 17.

FIG. 74 shows the structure of FIG. 73 following an optional processstep accomplishing embedment of the conductive pattern into thesubstrate.

FIG. 75 is a view similar to that of FIG. 20 after an optional embedmentprocess such as that embodied in FIGS. 72 and 74.

FIG. 76 is a view of the FIG. 75 embodiment but showing additional addedstructure.

FIG. 77 is a view similar to FIG. 76 showing one possible form ofinterconnecting structure.

DESCRIPTION OF PREFERRED EMBODIMENTS

Reference will now be made in detail to the preferred embodiments of theinvention, examples of which are illustrated in the accompanyingdrawings. In the drawings, like reference numerals designate identical,equivalent or corresponding parts throughout several views and anadditional letter designation is characteristic of a particularembodiment.

Many of the embodiments of the instant invention involve so-called “thinfilm” photovoltaic structures. Those skilled in the art will recognizethat the invention may have applications to other “non thin film”photovoltaic cells such as DSSC and crystal silicon cells. However, mostof the inventive technology of the invention will be taught belowreferencing thin film photovoltaic structure.

FIGS. 1-5 present a discussion of prior art. Referring to FIGS. 1 and 2,an embodiment of a thin film photovoltaic cell body is generallyindicated by numeral 1. It is noted here that “thin film” has becomecommonplace in the industry to designate certain types of semiconductormaterials in photovoltaic applications. These include the inorganicphotovoltaic materials cadmium sulfide/cuprous sulfide, amorphoussilicon, cadmium telluride, copper-indium-gallium diselenide,copper-zinc-tin selenide, (TZTS), and the like. These photovoltaicmaterials may generally be formed as relatively thin films on the orderof 1 micrometer thick. Further, the inorganic materials can often endurehigh temperature (400 degrees Centigrade and greater) to achievealloying and expected cell performance. Body 1 has a light-incident topsurface 59 and a bottom surface 66.

Body 1 has a width X-1 and length Y-1. It is contemplated that lengthY-1 may be considerably greater than width X-1 such that length Y-1 cangenerally be described as “continuous” and often being able to beprocessed in a roll-to-roll fashion. FIG. 2 shows that the body 1embodiment comprises a thin film semiconductor structure 11 supported by“bulk” metal-based foil 12. Foil 12 has a top surface 65, bottom surface66, and thickness “Z”. In the embodiment, bottom surface 66 of foil 12also forms the bottom surface of photovoltaic body 1. Metal-based foil12 may be of uniform composition or may comprise a laminate of multiplelayers. For example, foil 12 may comprise a base layer of inexpensiveand processable metal 13 with an additional metal-based layer 14disposed between base layer 13 and semiconductor structure 11. Theadditional metal-based layer 14 may be chosen to ensure good ohmiccontact between the top surface 65 of foil 12 and photovoltaicsemiconductor structure 11. Bottom surface 66 of foil 12 may comprise amaterial 75 chosen to achieve good electrical and mechanical joiningcharacteristics as will be shown. “Bulk” metal-based foil 12 is normallyself supporting. Accordingly, the thickness “Z” of foil 12 is oftenbetween 2 micrometers and 250 micrometers (i.e. 5 micrometers, 10micrometers, 25 micrometers, 50 micrometers, 100 micrometers, 250micrometers), although thicknesses outside this range may be functionalin certain applications. One notes for example that should additionalsupport be possible, such as that supplied by a supporting plastic film,metal foil thickness may be far less (0.1 to 2 micrometer) than thosecharacteristic of a “bulk” foil. Nevertheless, a foil thickness between2 micrometers and 250 micrometers may normally provide adequate handlingstrength while still allowing flexibility if roll-to-roll processingwere employed, as further taught hereinafter.

In its simplest form, a photovoltaic structure combines an n-typesemiconductor with a p-type semiconductor to form a p-n junction. FIG. 3illustrates an example of a typical photovoltaic structure in section.In FIGS. 2 and 3 and other figures, an arrow labeled “hv” is used toindicate the light incident side of the structure. In FIG. 3, 15represents a thin film of a p-type semiconductor, 16 a thin film ofn-type semiconductor and 17 the resulting photovoltaic junction. Cellscan be multiple junction or single junction and comprise homo or heterojunctions. Semiconductor structure 11 may comprise any of the thin filmstructures known in the art, including but not limited to CdS, CIS,CIGS, CdTe, Cu2S, amorphous silicon, or one of the emerging thin filmcrystalline silicon or GaAs structures. In some embodiments,semiconductor structure 11 may also comprise organic materials such asso-called “Graetzel” electrolyte cells, polymer based semiconductors,dye sensitized materials and the like. Further, in some casessemiconductor structure 11 may also represent “non-thin film” cells suchas those based on single crystal or polycrystalline silicon since manyembodiments of the invention may encompass such cells, as will beevident to those skilled in the art in light of the teachings to follow.

One skilled in the art appreciates that the processing and fabricationrequirements may vary considerably depending on the nature of thephotovoltaic cell materials. For example, totally inorganic cells may besubjected to high temperature (greater than 400 degree Centigrade) heattreatments for extended periods in order to form the desired reactions,alloying or microstructure. Such processing normally prohibits thepresence of organic materials. Further, deposition of transparentconductive oxide layers may be accomplished in vacuum therebyprohibiting presence of volatile materials. A significant advantage ofthe instant inventions is that the current collector and interconnectstructures can be produced absent the cell and the cell manufacturedseparately. In this way the cell processing is independent of theinterconnection component manufacture and materials.

Often optically transparent “electrode” 18 is included in the thin filmphotovoltaic body. The conductive, optically transparent “windowelectrode” layer 18 forms the top light incident surface of thephotovoltaic cell. As is understood in the art, an electrode is aconductor through which electricity enters or leaves a device.Accordingly, the window electrode normally functions to reduce resistivepower losses in conveyance of generated current laterally (i.e. parallelwith the top surface) to conductive collection or interconnectionstructure. The window electrode 18 often comprises a transparentconductive oxide (TCO) layer such as a thin film of zinc oxide or tinoxide. However, other materials such as intrinsically conductivepolymers and blends of fine wires (nanowires) in polymer matrices can beemployed. For best performance, “window electrodes” generally comprise acontinuous, unbroken layer of transparent conductive material formingthe major portion of the cell's top surface. It is noted that in somecases cells have been etched to selectively remove a TCO materialclosely adjacent cell edges to prevent cell shorting. Except for suchselective removal, the TCO film is advantageously a continuous filmforming the major portion of the top cell surface.

Transparent conductive oxide (TCO) electrode films are normallydeposited in vacuum. They are often very thin, on the order of 1micrometer or less. Such TCO films are fragile and thus require firmsupport to prevent cracking and discontinuities which would reduceelectrical effectiveness. Such firm support is offered by hard materialssuch as glass, inorganic semiconductors and some structural polymerssuch as PET, PEN, acrylic and polycarbonate. Surfaces formed by pliablematerials may not adequately support a TCO film. Also, the surface uponwhich the TCO is deposited will normally be essentially flat.

A number of characteristics of the thin film structures depicted inFIGS. 1, 1A, 2, 2A-C, and 3 are noted. First the thin film photovoltaicbody comprises a stack of sheetlike layers that are often thin. Theindividual inorganic semiconductor layers (such as for example thecommercial CIGS CdTe and TCO materials) indicted by numerals 15, 16, and18 are typically less than about 2 micrometer in thickness. It isimportant to maintain a continuous, unbroken structure for theindividual films. Otherwise, breaks in the film may lead to performancedeterioration and defects such as shunts. One appreciates thatsubstantial or abrupt changes in surface topography may prohibitdeposition of films with required continuity and integrity. Thiscondition is a natural result of the fact that the very thin layersassociated with the thin film structures cannot effectively blanket orcover large surface asperities. In order to form and maintain acontinuous unbroken films, the surfaces must be smooth on a microscopicscale comparable to the film thicknesses. More specifically, the surfaceroughness of an inorganic thin film photovoltaic cell is generally lessthan about 2 micrometer (i.e. 0.1 micrometer, 0.5 micrometer, 1micrometer, 2 micrometer). Accordingly, the microscopic top surface ofthe inorganic thin film cells is “essentially planar” or “essentiallyflat”. It is noted that the characterization “microscopic” top surfacerefers to the surface dimensions typically reported in micrometers. Itdoes not refer to a bulk structural form. For example, a surface of asphere or cylinder may be non-planar on a macroscopic scale yet“essentially flat” on a microscopic scale.

Surface roughness has been a particular problem with metal foilsubstrates where efforts must be made to achieve very smooth substratesurfaces. A relatively “rough” foil surface with numerous or largeasperities will greatly reduce cell effectiveness

An additional characteristic of thin film photovoltaic cells is that theinorganic semiconductors and films are normally relatively hard andimpenetrable. This is an important property, since penetrations throughthe composite layers could potentially short circuit the cell.Nevertheless, because the layers are very thin, handling damage such asscratching of raw cell stock during assembly into modules is always aconcern which must be vigorously monitored.

Because of the various materials and chemistries possible for the toplight incident surface of cells, it is important to appreciate that anymaterials brought into contact with the top cell surface must becompatible with the actual cell surface composition. Specifically, somemetals may be incompatible with the cell surface material and may besusceptible to forming resistive corroded surfaces or electro-migrate toadversely affect cell chemistry. Some metals may form a rectifyingcontact with a particular cell surface. In addition, polymeric materialsbrought into contact with the top cell surface must also be consideredfor compatibility, since functional groups attached to polymer chainscould be incompatible with the cell surface especially in the presenceof contaminants such as water vapor.

In the following, photovoltaic cells having a metal based support foilwill be used to illustrate the embodiments and teachings of theinvention. However, those skilled in the art will recognize that many ofthe applications of the instant invention do not require the presence ofa “bulk” foil as represented in FIGS. 1 and 2. In many embodiments,other conductive rear electrode structures, such as a metallized polymerfilm or glass having a thin metallized or conductive resin layer, may besubstituted for the “bulk” metal foil.

FIG. 4 refers to a method of manufacture of the bulk thin filmphotovoltaic structures generally illustrated in FIGS. 1 and 2. In theFIG. 4 embodiment, a “bulk” metal-based support foil 12 is moved in thedirection of its length Y through a deposition process, generallyindicated as 19. Process 19 accomplishes deposition of the activephotovoltaic structure onto foil 12. In the FIG. 4 embodiment, foil 12is unwound from supply roll 20 a, passed through deposition process 19and rewound onto takeup roll 20 b. As such, the process may becharacterized as a “roll-to-roll” process. Process 19 can comprise anyof the processes well-known in the art for depositing thin filmphotovoltaic structures. These processes include electroplating, vacuumevaporation and sputtering, chemical deposition, and printing ofnanoparticle precursors. Process 19 may also include treatments, such asheat treatments, intended to enhance photovoltaic cell performance.

Those skilled in the art will readily realize that the depositionprocess 19 of FIG. 4 may often most efficiently produce photovoltaicstructure 1 having dimensions far greater than those suitable forindividual cells in an interconnected array. Thus, the photovoltaicstructure 1 may be subdivided into cells 10 having dimensions X-10 andY-10 as indicated in FIGS. 1A and 2A for further fabrication. In FIG.1A, width X-10 defines a first photovoltaic cell terminal edge 45 andsecond photovoltaic cell terminal edge 46. In one embodiment, forexample, X-10 of FIG. 1A may be from 0.25 inches to 12 inches and Y-10of FIG. 1A may be characterized as “continuous”. In other embodimentsthe final form of cell 10 may be rectangular, such as 6 inch by 6 inch,4 inch by 3 inch or 8 inch by 2 inch. In other embodiments, thephotovoltaic structure 1 of FIG. 1 may be subdivided in the “X”dimension only thereby retaining the option of further processing in a“continuous” fashion in the “Y” direction. In the following, cellstructure 10 in a form having dimensions suitable for interconnectioninto a multi-cell array may be referred to as “cell stock” or simply ascells. “Cell stock” can be characterized as being either continuous ordiscreet.

The process 19 of FIG. 4 may deposit semiconductor as continuousmaterial layers over the entirety of the support foil 12 or selectivelydeposit semiconductor material in patterned portions over the surface offoil 12. While not always the case, it is normally advantageous todeposit the active semiconductor material over the entirety of the foil12 surface. Selective deposition normally requires expensive maskingprocessing and often wasted material. In light of the teaching tofollow, one will appreciate that the structural aspects of the instantinvention allow uniform deposition of active semiconductor over theentirety of the surface of substrate 12, a considerable advantage oversome prior art proposals requiring selective deposition of semiconductormaterial.

FIG. 2A is a sectional view taken substantially along the line 2A-2A ofFIG. 1A. In the embodiment of FIG. 2A, semiconductor material 11 isshown to extend over the entirety of the top surface of support 12. Inthe specific case of FIG. 2A, the terminal edges 45 and 46 of the cell10 coincide with the edges of the support foil 12. The photovoltaic cellstructure depicted in FIG. 2A may extend in continuous fashion in thedirection normal to the paper.

FIG. 2B is a simplified depiction of cell 10 shown in FIG. 2A. In orderto facilitate presentation of the aspects of the instant invention, thesimplified depiction of cell 10 shown in FIG. 2B will normally be used.However, one will understand that the FIG. 2B depiction is highlysimplified and does not include component structure nor the edgeprotection structure which would often be present in practice.

FIG. 2C is a simplified depiction of cell 10 as in FIG. 2B but alsoshowing additional structure intended to protect a raw edge of the cellfrom shorting. In the FIG. 2C, a strip of insulating material 60 ispositioned along a cell edge. It has been found convenient to employstrips of a laminating film or pressure sensitive adhesive tape for theinsulating material. An adhesive layer 61 of the strip or tape ispositioned to overlap and contact a cell surface portion adjacent theedge, as shown in the drawing. A structural carrier layer 62 is alsonormally present to support the adhesive. The same process may be usedto protect the edge either from the top or bottom sides. Heat and/orpressure may be used to activate the adhesive of an insulatinglaminating film strip causing it to adhere to the cell surface as shownin the FIG. 2C. It has been found that a simple plastic bag sealer orimpulse sealer may be appropriate to accomplish this. Alternatively,simple room temperature application of a pressure sensitive adhesivetape (for example “Scotch Tape, a product of 3M Co.) has been usedeffectively. Raw edge protection is particularly appropriate when thinfilm photovoltaic cells are employed. In these cases, conductiveelectrical lines associated with current collection and cellinterconnection may extend across cell edges and thus may short theclosely spaced top and bottom surfaces of a cell. Such edge protectionis also particularly important should semiconductor be removed for smalldistances away from cut edges of a photovoltaic cell. Such cut edges mayoccur when a large area cell is subdivided into smaller portions forfurther processing. In those cases the cutting process may smearcomponents together to produce short circuits. These short circuits maybe removed by removing material from the supporting substrate for ashort distance from the cut edge. This removal is often accomplished byetch or laser removal. In these cases the material removal exposes asmall portion of the underlying substrate and it is thus evident thatthe exposed surface must be isolated before a conductive material linemay be positioned to cross the cut edge or terminal edge of the cell.This isolation may be accomplished using the insulation strips asdepicted in FIG. 2C.

FIG. 5 illustrates the basic electrical path between adjacent seriesconnected prior art cells discussed in FIGS. 1-4. In FIG. 5, there areillustrated cells 10 as shown in FIG. 2A. The cells have been positionedto achieve spatial positioning on the support substrate 21. Supportstructure 21 is by necessity non-conductive at least in a spaceindicated by numeral 27 separating the adjacent cells 10. Thisinsulating space prevents short circuiting from metal foil electrode 12of one cell to foil electrode 12 of an adjacent cell. In order toachieve series connection, electrical communication must be made fromthe top surface of window electrode 18 to the foil electrode 12 of anadjacent cell. This communication is shown in the FIG. 5 as a metal wire41. The direction of the net current flow for the arrangement shown inFIG. 5 is indicated by the double pointed arrow “i”. It should be notedthat wire 41 of FIG. 5 is intended to illustrate a current path and notan actual connection. Foil electrode 12 is normally relatively thin, onthe order of 25 micrometer to 250 micrometer. Therefore, connecting toits edge as indicated in FIG. 5 would be impractical. Thus, electricalconnections are normally made to the top surface 65 or the bottomsurface 66 of foil 12. Moreover, one readily recognizes that connectingindividual unsupported metal wires 41 as shown in FIG. 5 would bechallenging in volume production.

Starting now with the preferred embodiments of the invention, a firstembodiment of the invention is presented in FIG. 6. FIG. 6 is a top planview of a starting article in production of a laminating currentcollector grid or electrode according to the instant invention. Thearticle embodied in FIG. 6 represents a wide range of similar sheetlikestructures which form substrates for the inventive interconnectioncomponents and combinations taught herein. FIG. 6 embodies a polymerbased film or glass substrate 70. Substrate 70 has width X-70 and lengthY-70. In embodiments, taught in detail below, Y-70 may be much greaterthan width X-70, whereby film 70 can generally be described as“continuous” in length and able to be processed in the length directionY-70 in a continuous, possibly roll-to-roll fashion. When intended foruse in a current collector structure for a top light incident surface ofa photovoltaic cell, at least a portion of film 70 overlaying the topsurface will be transparent or translucent. FIG. 7 is a sectional viewtaken substantially from the view 7-7 of FIG. 6. Thickness dimensionZ-70 is small in comparison to dimensions Y-70, X-70 and thus substrate70 may have a flexible sheetlike, or web structure.

Another important aspect of the embodiments of the current invention isthe inclusion of web processing to achieve structure and combinations ina facile and economic fashion. A web is a generally planar or sheet-likestructure, normally flexible, having thickness much smaller than itslength or width. This sheet-like structure may also have a length fargreater than its width. A web of extended length may be conveyed throughone or more processing steps in a way that can be described as“continuous”, thereby achieving the advantages of continuous processing.“Continuous” web processing is well known in the paper and packagingindustries. It is normally accomplished by supplying web material from afeed roll of extended length to the process steps. The product resultingfrom the process is often continuously retrieved onto a takeup rollfollowing processing, in which case the process may be termedroll-to-roll or reel-to-reel processing.

An advantage of web processing is that the web can comprise manydifferent materials, surface characteristics and forms. The web maycomprise layers for packaging material options such as pressuresensitive or hot melt adhesive layers, environmental barriers, and assupport for printing and other features. The web can constitute anonporous film or may be a fabric and may be transparent or opaque.Combinations of such differences over the expansive surface of the webcan be achieved. Indeed, as will be shown, the web itself can comprisematerials such as conductive polymers or even metal fibers which willallow the web itself to perform electrical function. The web materialmay remain as part of the final article of manufacture or may be removedafter processing, in which case it would serve as a surrogate ortemporary support during processing.

Normally, a flexible material can be significantly deformed withoutbreaking. As shown in FIG. 7, substrate 70 may be a laminate of multiplelayers 72, 74, 76 etc. or may comprise a single layer of material. Anynumber of layers 72, 74, 76 etc. may be employed. The layers 72, 74, 76etc. may comprise inorganic or organic components such asthermoplastics, thermosets, silicon containing glass-like layers ortransparent metal oxide films. As is understood in the art, athermoplastic is a polymeric material which may be heated to make fluid.Also, as is understood in the art, a thermoset is a material which maycure to a rigid or non-flowing material when heated appropriately. Thevarious layers are intended to supply functional attributes such asenvironmental barrier protection, adhesive characteristics, orstructural or “carrier” properties to substrate 70. Various barrierlayers may provide a number of functional benefits including but notlimited to protection from uv degradation, water or moisture ingress,scratching etc. In addition, one or more of the layers may be used toprovide structural support during processing and application. Suchfunctional layering is well-known and widely practiced in the plasticpackaging art.

Regarding polymer structural or “carrier” films, a number of materialsand forms are suitable for the instant invention. In particular, it isadvantageous to employ materials available as a sheet or film and beavailable in a continuous form. If the structural material film is to beused for the collector regions of the collector/interconnect component,it should exhibit good light transmission. Transparent polymericstructural films are normally electrically insulative. However, atransparent electrically conductive layer such as a transparentconductive oxide may be applied to the structural polymeric film. Theinstant invention often requires the structural polymeric films to havegood processability and web handling characteristics. Fortunately, thepackaging industry has developed a number of materials and forms whichare candidates for use in the instant invention. Candidate materialsinclude, but are not limited to polyethylene, polyethylene terepthalate(PET), polyethylene naphthalate (PEN), polypropylene, biaxially orientedpolypropylene (BOPP), polycarbonate, polyacrylic polymers andfluorinated polymers. Typically, a polymer based structural support filmwill have a thickness of between 12 and 250 micrometer.

Additional layers 72, 74, 76 etc. may comprise barrier layer materials.A barrier layer functions to prevent deterioration of the photovoltaicdevice from damage due to environmental exposure. Various forms ofenvironmental damage may be encountered. An exterior “hardcoat” may beapplied to prevent damage from hail or windblown particulates. A layermay include cross-linking chemistry to “harden” the layer followingassembly with a photovoltaic cell. An ultraviolet blocking layer may beused to protect underlying polymeric materials from deterioration causeby ultraviolet radiation. Many photovoltaic cell chemistries areparticularly sensitive to deterioration caused by atmospheric moisture.Of course, glass remains as the premier transparent barrier againstenvironmental damage. However, in an effort to produce flexiblephotovoltaic devices, a number of flexible polymer based barriermaterials have been proposed for environmental protection ofphotovoltaic cells. Included are fluorinated polymers, biaxiallyoriented polypropylene (BOPP), poly(vinylidene chloride), such as Saran,a product of Dow Chemical, and Siox. Saran is a tradename forpoly(vinylidene chloride) and is manufactured by Dow ChemicalCorporation. Siox refers to a vapor deposited thin film of silicon oxideoften deposited on a polymer support. Siox can be characterized as anultra thin glassy layer. Siox is an example of many of the inorganicfilm structures being proposed as moisture barrier materials forphotovoltaic cells. Other examples of very thin flexible glass materialsare those identified as Corning 0211 and Schott D263. In addition,flexible transparent barrier sheets continue to be developed to allowproduction of flexible, environmentally secure photovoltaic modules.These more recent barrier materials adopt the Siox concept but typicallycomprise stacks of multiple films in a laminar structure. The films maycomprise multiple inorganic layers or combinations of multiple organicand inorganic layers. The multiple layers present a tortuous path formoisture or gas molecules to penetrate through the barrier sheet. Theindividual layers of the barrier sheet are typically very thin, often ofthe order of one micrometer or less, formed by various processing suchas sputtering, chemical vapor deposition and atomic layer deposition.Thus these individual layers are typically not self supporting. Thebarrier stack of multiple thin polymer and inorganic pairs (dyads) maybe deposited onto a supporting carrier film which itself may be appliedover a device for protection. An example of such a barrier filmtechnology is that marketed by Vitex Systems under the tradename“Barix”.

Regarding adhesive materials useable in the invention, a wide variety ofadhesive materials are available and suitable in the practice of theinvention. Polymer based adhesives are very common and may be producedhaving a wide variety of properties. Polymer based adhesives exhibitcharacteristics such as ability to flow and wet a mating surface. Oftenan adhesive comprises functional groups such as polar groups which haveaffinity for mating surfaces. A number of physical and chemicalproperties characterize specific adhesive characteristics:

-   -   Polymeric adhesives may be classified as thermoplastic,        thermosetting, or room temperature active. A thermoplastic        adhesive is one whose adhesive characteristics such as flow,        tack and affinity for mating surfaces are activated by heating        above ambient temperature. Normally a thermoplastic adhesive is        non-tacky and relatively firm at room temperature. The familiar        “hot melt glue” is an example of a thermoplastic adhesive.        Thermosetting adhesives are those formulated to be tacky and        flowable when first heated but “cure” to a non-flowable,        hardened 3-dimensional polymer network during extended elevated        temperature exposure. The 3-dimensional network has increased        integrity contributing to improved bond strength and ability to        withstand rigors of subsequent processing. Many industrial        adhesives are thermosetting. For example, those used to laminate        metal foils to polymer substrates for eventual subtractive        printed circuit manufacture are thermosetting. Here the adhesive        is thermally “cured” to prevent metal delamination of etched        fine lines and to withstand soldering. “Curing” is also commonly        employed with sealing or “potting” materials intended to bathe        structure in a protective or supporting polymeric structure. In        these cases the sealing material must originally show high flow        to completely fill the entire void regions of the structure.        However, following this initial penetration of sealing material,        curing hardens the sealing material so that the object maintains        its integrity and is able to be handled without tackiness or        deformation. Other adhesives possess adhesive characteristics of        tack and flow at room temperature. Common forms of room        temperature adhesives are pressure sensitive adhesives (PSA)        widely used with adhesive tape. PSA films are typically quite        thin and therefore are not normally considered encapsulating        materials. Other forms of room temperature adhesive are        formulations curable to a 3 dimensional network at room        temperature. Room temperature may be accomplished through        chemical reaction or through radiation initiation such as        ultraviolet curing. A familiar room temperature curable adhesive        is a two part epoxy.    -   The chemical composition of an adhesive is important in        determining its suitability for application and affinity to a        specific surface. Polymeric adhesives may comprise polar or        ionic groups such as acrylates, acetates and epoxies which        contribute to polar adhesive bonding with mating surfaces. It is        important to recognize that some functional groups may actually        be detrimental to a sensitive mating surface such as a        photovoltaic cell. Therefore, when dealing with sensitive        semiconductor materials sometimes present in photovoltaic        applications, compatibility of the adhesive with its intended        mating surface must be determined. It must be recognized that        sensitive semiconductors such as cadmium sulfide, cuprous        sulfide, copper indium gallium diselenide and even conductive        transparent metal oxides may be sensitive to deterioration when        brought into contact with some common polymeric polar groups and        additives.    -   A number of polymeric materials may not only have adhesive        characteristics but also may serve as sealants and encapsulants.        Here the material may also be expected to be an intermediary        “planarization” layer between the underlying structure and an        overlaying structure such as a glass sheet Here the form of the        material such as surface area and thickness, and “flowability”        are fundamental requirements. The material form must be        expansive and thick enough to totally “pot” or encapsulate the        underlying structure. The material must exhibit a viscosity low        enough to penetrate close separations that may exist in the        underlying structure. When dealing with underlying structure        having relatively pronounced protuberances or height changes, a        sufficient thickness of starting material is required.        Relatively thick sheets of thermosetting materials such as 450        micrometer thick EVA have been used in the past as encapsulating        materials for “string and tab” series interconnected modules. In        contrast, the instant invention has been successfully        demonstrated using adhesive or encapsulant layers (such as layer        72) having thickness as low as 12 micrometers.    -   The application of an adhesive or sealing layer to a        complimentary support or carrier layer may be accomplished using        a variety of processes. Should the adhesive be available as a        discrete sheetlike form, it may be simply laminated to a        structural polymer “carrier” continuously using roll lamination.        Other adhesive layers may be extruded as a sheet directly onto        the carrier layer, or both adhesive and carrier layers may be        formed simultaneously by coextrusion and layering of the molten        sheet forms. Thin layers of adhesive may be applied by spraying        or coating a liquid adhesive formulation over a substrate. Such        a coating operation may be assisted using a solvent to assist        film forming of the adhesive.

The multilayered structure depicted in the embodiment of FIG. 7 may beproduced using a number of different processes. If flexible, a polymerbased structural or carrier film is normally a component of the filmstack shown. The structural film supports and positions other layerswhich may not have the integrity required to be formed or processedwithout the support of the structural film. Typical process routesinclude:

-   -   1. Spray or fluid application of a material layer onto a surface        of the structural film. For example, thin, room temperature        active pressure sensitive adhesive layers may be formed this        way.    -   2. Should the layers be originally self supporting and discrete,        they may be brought together using standard lamination practice        such as roll lamination or vacuum lamination. For example,        discrete sheets of an ionomer and a polyethylene terepthalate        (PET) may be combined in continuous form using roll lamination.    -   3. Simultaneous polymer melt extrusion of one or more layers and        layering while the one or more materials remain molten may be        used to form laminates wherein the extruded (molten) layers may        have a wide range of thickness. Multilayer co-extrusion is        widely practiced in the plastics and packaging arts to produce        multilayered articles having tailored mechanical, chemical        resistance and barrier properties. Multilayered articles        including intermediary adhesive layers adhering functional        layers together are commonly produced by combining one or more        melt extruded layers.

The embodiment of FIG. 7 depicts a structure wherein all the layersextend over the entire expanse of the article. As will be shown insubsequent embodiments of instant specification, the various layers maybe present in only selected regions of the flexible body. In other wordsthe substrate structures of the invention may comprise a patchwork ofregions having different layer stacks seamed together in a “quiltlike”arrangement. Further, FIG. 7 suggests the various layers overlap overtheir entire extent (i.e. completely overlap). This is not a requirementof the invention, as will be illustrated for subsequent embodiments.However, as instant examples, FIGS. 7A and 7B are sectional viewsembodying alternate overlapping structures. FIG. 7A shows a sheetlikeform with layers 77 and 79. Layer 77 partially overlaps layer 79.Conversely, it can be stated that layer 79 completely overlaps layer 77.FIG. 7B shows layers 81 and 83, each of which partially overlap theother.

Sheetlike substrate 70 has first surface 80 and second surface 82. Inparticular, in light of the teachings to follow, one will recognize thatit may be advantageous to have layer 72 forming surface 80 comprise asealing or adhesive material. As will be recognized by those skilled inthe art, layer 72 forming surface 80 will typically be electricallyinsulating in order to accommodate transparency requirements. However,more recently developed materials combining transparency andconductivity may be appropriate. Adhesive or sealing materials such asan ethylene vinyl acetate (EVA), ethylene ethyl acetate (EEA), polyvinylacetate (PVA), ionomers, polyacrylics, polyacrylates, polyolefin basedadhesives or a polymer containing polar functional groups may impartadhesive characteristics during a possible subsequent laminationprocess. Other sealing or adhesive materials useful in certainembodiments include those comprising atactic polyolefin, fluorocarbonpolymers, or styrene based polymers. Other sealing or adhesive materialsuseful in certain embodiments include those comprising silicones,silicone gels, epoxies, polydimethyl siloxane (PDMS), RTV rubbers, suchas room temperature vulcanized silicones (RTV silicones)polyvinylbutyral (PVB), and polyurethanes. Many different adhesive types,including thermosetting, thermoplastic, and PSA adhesives have beensuccessfully employed in the practice of the invention.

The thickness of substrate 70, and specifically the thickness ofadhesive, sealing layers such as layer 72 forming surface 80, may varydepending on the requirements imposed by subsequent processing or enduse application. For example, should the underlying structure permit asubsequent roll lamination process the thickness of layer 72 maytypically be between 10 micrometers to 250 micrometers. In rolllamination, sheetlike materials are heated and passed through a “nip”created by matched rollers. Pressure and heat applied by passing throughthe hot “nip” expels air between the sheets and laminates them together.Height variations in the underlying structure should be minimized toreduce required thickness of the layer of sealing material. Alternately,should a lamination process include encapsulation of relatively thickitems having large height variations such as “string and tab”arrangements of cells, thicker layers from 250 micrometers to 600micrometers may be employed for the encapsulation or sealing layer. Inthis case vacuum lamination may be a preferred choice of process.

Lamination of such sheetlike films employing such sealing materials is acommon practice in the packaging industry. In the packaging industrylamination is known and understood as applying a film, normally polymerbased and having a surface comprising a sealing material, to a secondsurface and sealing them together with heat and/or pressure. Sealingmaterials generally will be tacky and exhibit adhesive affinity for amating surface when activated. The adhesive affinity is normallyassociated with the ability of the sealing material to flow and “wet”the mating surface. Thus a sealing material is normally “uncross-linked”when first brought into contact with the mating surface. The adhesiveaffinity of many suitable sealing materials may be activated (made tackyand flowable) by heating and the adhesive bond to the mating surface isretained upon cooling. Some adhesives, such as PSA's, solvent basedadhesives and 2-part epoxies, have adhesive affinity for mating surfacesat room temperature. Some adhesives remain “uncrosslinked” but retaintheir adhesive affinity to the mating surface after application or uponcooling. Some sealing materials undergo cross-linking after initialcontacting, a reaction which may be accelerated by heat in the case ofthermoset adhesives. Some adhesives, such as RTV silicone formulationsor 2-part epoxy systems are designed to crosslink at room temperaturefollowing contacting with mating surfaces.

In many embodiments substrate 70 may be generally be characterized as alaminating material. For example, the invention has been successfullydemonstrated using standard office laminating films of 75 micrometer and150 micrometer thicknesses sold by GBC Corp., Northbrook, Ill., 60062.It has also been successfully demonstrated using a 75 micrometer thickSurlyn adhesive layer supported by a 50 micrometer thick polyethyleneterepthalate carrier film. It has also been successfully demonstratedusing a 100 micrometer thick olefinic adhesive layer supported by a 75micrometer thick BOPP carrier film. It has also been successfullydemonstrated using 75 micrometer thick crosslinkable EVA adhesive layersupported by a 50 micrometer thick polyethylene terepthalate carrierfilm. It has also been successfully demonstrated using a 250 micrometerthick Surlyn adhesive layer supported by a 50 micrometer thickpolyethylene terepthalate carrier film. Surlyn is a registered trademarkfor an ionomer material sold by Dupont. Accordingly, a wide variety oflaminating films with associated sealing materials is possible,depending on the surface to which the adhesive seal or bond is to bemade. In particular, sealing materials such as ionomers, olefinicpolymers and copolymers or atactic polyolefins may be advantageous incertain applications since these materials allow for the minimizing ofmaterials which may be detrimental to the longevity of a solar cell withwhich it is in contact

Additional layers 74, 76 etc. may comprise carrier materials whichsupply structural support for processing. A carrier material film istypically an insulating structural polymer present to assist in overallintegrity of the substrate. For example, the carrier film maystructurally support relatively thin layers of an adhesive materialwhich may not be self supporting absent the carrier. Typical carrierfilms comprise polymer support layers and may include polymers such aspolypropylene, polyethylene terepthalate (PET), polyethylene naphthalate(PEN), acrylic, and polycarbonate and fluorinated polymers.

FIG. 8 depicts the structure of substrate 70 (possibly laminate) as asingle layer for purposes of presentation simplicity. Substrate 70 willbe represented as this single layer in many subsequent embodiments, butit will be understood that structure 70 may be a laminate of any numberof layers. In addition, substrate 70 is shown in FIGS. 6 through 8 ascomprising uniform, unvarying monolithic sheets. However, it isunderstood that various regions of substrate 70 may differ incomposition. For example, selected regions of substrate 70 may comprisediffering sheetlike structures patched together using appropriateseaming techniques. Possible applications for such a “patchwork”structure will become clear in light of the teachings to follow.

FIG. 9 is a plan view of the structure following an additionalmanufacturing step.

FIG. 10 is a sectional view taken along line 10-10 of FIG. 9.

FIG. 11 is a sectional view taken along line 11-11 of FIG. 9.

In the specific embodiments of FIGS. 9, 10, and 11, the structure is nowdesignated 71 to reflect the additional processing. It is seen that amaterial pattern has now been positioned on surface 80 of substrate 70.In the embodiments of FIGS. 9, 10, and 11, a pattern of material isembodied as repetitive “fingers” “traces” or “lines” 84. Fingers orlines are arranged in a grid pattern comprising multiple substantiallyparallel lines. While the material patterns of the invention oftencomprises a defined repetitive structure, random structures are alsoincluded within the scope of the patterns of the invention. An exampleof a random “pattern” is a non-woven fabric.

Material forming “busses” or “tabs” 86 is also positioned on supportingsubstrate 70. Busses or tabs 86 may be absent in certain embodiments,but they may be useful for processing and structural integrity of otherembodiments as will be seen in the following.

Permissible dimensions and structure for the “fingers” 84 and “busses”86 will vary somewhat depending on materials and fabrication processused for the pattern of fingers and busses, and the dimensions andcomposition of the individual photovoltaic cells. Moreover, “fingers”and “busses” may comprise material structure having dimensions, form orshape which may not be self supporting and may only be properlymaintained using a supporting substrate such as sheetlike substrate 70.For example, one readily realizes that patterns of electrodepositedmetal, ink traces, or patterns of fine metal wires would likely demandadditional support to maintain pattern shape and material integrity ofthe intended structure.

One notes that one of the objectives in the design of a currentcollector pattern for a photovoltaic cell is to minimize radiation“shading” of the coverage of the cell with opaque conductive material.This leads to consideration of delicate, fragile conductive structuraldesigns such as parallel unconnected lines or “fingers” of conductivematerial. Such desirable structures may only maintain their integrity inthe presence of a supporting substrate. Thus a polymeric supportingsubstrate is often a key component of the interconnection components ofthe invention. Not only does the substrate maintain the integrity of thepattern, but it also conveys the pattern and helps position it duringapplication to the cell. However, a polymeric supporting substrate couldnot withstand the heat treatments associated with manufacture of manythin film photovoltaic stacks. Thus the independent preparation of thepattern on the substrate and its subsequent application to the cellsurface is a key concept of the invention.

As shown in FIGS. 11 and 14, the embodied pattern comprises multiplelines 84 have a width Wt and a spacing St. Width Wt and spacing St arechosen in consideration of a number of variables. Line width Wt (or wirediameter) is normally kept small to minimize shading of thesemiconductor. Typically width Wt is less than 375 micrometers (0.015inch). The minimum width Wt depends on many factors, including theprocessing by which the “fingers” or “lines” are formed. When formingthe lines using circular wire forms width Wt will typically correspondto the diameter of the wire as shown in FIG. 60A. In that case a minimumdiameter will be that which is cost effective and which can be handledconveniently. Typically wire diameters greater than 0.001 inch (i.e.0.001 inch, 0.002 inch, 0.005 inch, 0.010 inch, 0.015 inch) areemployed. When forming the lines using subtractive processes such asphotoetching of metal foils, very thin lines of about 0.001 inch (0.0025cm) are possible. Some additive processes such as screen printing andmasked deposition may typically produce line widths of 0.002 inch (0.005cm) or greater (i.e. 0.002 inch, 0.003 inch, 0.005 inch, 0.008 inch,0.011 inch, 0.015 inch). Some processes such as ink jet printing mayoffer very thin line widths less than 0.001 inch, but the value of suchsmall widths is often diminished by their low current carrying ability.In the embodiments of FIGS. 10 through 15 the “fingers” and “busses” areshown to have a rectangular cross section. Other cross sections such asround or oval are possible. A rectangular cross section does have thepotential advantage of a flat surface to achieve increased contact withmating surfaces as further discussed below.

The thickness or height of a conductive line or trace (represented by“H” of FIG. 13) can be up to 0.012 inch (300 micrometer) or evengreater, especially if the traces or lines comprise a round wire form.Alternatively, dimension “H” may often be about 0.002 inch (50micrometers) or less when the pattern comprises printed or depositedmaterials or when the pattern is produced by photoetching of metalfoils. When “H” is less than about 0.002 inch, the pattern may becharacterized as a “low profile” structure. A “low profile” line ortrace is often referred to as a “printed wire”. “Printed wire” boardsform the substrate wiring patterns for the electronic componentscommonly referred to as “printed circuits”. Dimension “H” will typicallybe greater than 3 micrometers (0.00012 inch) when the line or trace isused for current collection from a photovoltaic cell.

The spacing between parallel lines, St, depends on the current carryingcapacity of the individual lines and also on the surface characteristicsof the photovoltaic cells. Many thin film cells have augmented surfaceconductivity using a light incident surface formed from a transparentconductive material such as a transparent metal oxide. The resultantelectrical conductivity of the cell surface allows the choice of spacingbetween lines St to be expanded without excessive resistive losses incurrent transport to the conductive lines. Typically, with thin filmcells having a conductive transparent surface the spacing St is normallyless than 0.5 inches (1.27 cm) (e.g. 0.1 inch, 0.2 inch, 0.3 inch, 0.4inch, 0.5 inch) in order to manage resistive losses in lateral currenttransport over the conductive top surface of a photovoltaic cell. Thisspacing St is also normally above 0.05 inch (0.127 cm) to reduce shadingfrom an excessively close line placement. However, if the underlyingcells are absent a transparent conductive surface, a closer line spacingmay be appropriate. For example, line spacing of approximately 0.02 inchhave been taught in the literature for CdS/Cu2S cells. However, as onerealizes, a closer line spacing also demands finer line widths in orderto avoid excessive shading from the current collector structure. Ingeneral, conductive current collector grid lines should not shade(block) more than fifteen percent of the incident radiation impinging onthe top cell surface. More preferably, shading should be less than tenpercent (i.e. ten percent, seven percent, five percent).

The actual pattern structure can vary widely. Many forms other than thestraight lines embodied in FIGS. 9-15 may be appropriate. For example,the pattern may consist of a mesh or screen pattern of conductivetraces. A mesh or screen pattern may have an advantage of multipleredundant paths for current transport. In addition, meshes may bereadily produced by established techniques such as expanded metal foilsor wire weaving. Some mesh structures also have an advantage in beingsomewhat more structurally stable than individual separated adjacentlines. Thus a mesh structure may exhibit desirable handling andmanufacturing characteristics. A significant disadvantage to mesh typepatterns is that the structure implies increased radiation shading for adirectional current carrying capacity equivalent to simple unconnectedstraight conductive lines of the same cross section. This result is aconsequence of having substantial trace portions of the pattern having adirectional component perpendicular to the net current flow. Theincreased shading intrinsic using a mesh form thus reduces some of theadvantages of mesh structures. For example, to compensate for theincreased shading, the width of mesh fibrils should be reduced. However,such a reduction reduces the structural robustness of the mesh.

“Fingers”, “lines” or “traces” 84 extend in the width X-71 direction ofarticle 71 from “busses” or “tabs” 86 extending in the Y-71 directionsubstantially perpendicular to the “fingers. As suggested above, article71 may be processed and extend continuously in the length “Y-71”direction. Repetitive multiple “finger/buss” arrangements are shown inthe FIG. 9 embodiment with a repeat dimension “F” as indicted. When usedfor current collection from the top light incident surface of thephotovoltaic cell, portions of substrate 70 not overlayed by “fingers”84 and “busses” 86 remain transparent or translucent to visible light.In the embodiment of FIGS. 9 through 11, the “fingers” 84 and “busses”86 are shown to be a single material layer for simplicity ofpresentation. However, the “fingers” and “busses” can comprise multiplelayers of differing materials chosen to support various functionalattributes. For example, a wire form may comprise a conductive wire corecoated with nickel or a polymer based conductive material. The materialin direct contact with substrate 70 defining the “buss” or “finger”patterns may be chosen for its adhesive affinity to surface 80 ofsubstrate 70 and also to a subsequently applied constituent of the bussor finger structure. Further, it may be advantageous to have the firstvisible material component of the fingers and busses be of dark color orblack. As will be shown, the light incident side (upper or outsidesurface) of the substrate 70 will eventually be surface 82. By havingthe first visible component of the fingers and busses be dark, they willaesthetically blend with the generally dark color of the photovoltaiccell. This eliminates the often objectionable appearance of a metalcolored grid pattern.

The pattern of “fingers” 84 and “busses” 86 may comprise electricallyconductive material. A number of material options are available forpositioning the pattern comprising conductive material on the substrate.Examples of such materials are metal wires and foils, stamped or die cutmetal patterns, conductive metal containing inks and pastes such asthose having a conductive filler comprising silver or stainless steel,patterned deposited metals such as etched metal patterns or maskedvacuum deposited metals, intrinsically conductive polymers and DERformulations and polymeric fibers or meshes coated with a conductivematerial. In preferred embodiments, the “fingers” and “busses” areproduced on the substrate using a substantially “fully additive”process. A “fully additive process is one wherein a material structureis produced without significant material removal or waste. Fullyadditive production has the advantage of producing minimal waste and maybe less complicated than subtractive processing. Subtractive processinghas the ability to produce very fine and detailed structure. A first“fully additive” option is to attach a “bulk” metal form such as a wireor mesh or patterned metal foil, such as a stamped foil pattern,directly onto the surface of the substrate. In this case provision mustbe made to hold the metal form in place on the substrate. Coating the“bulk” metal form with an adhesive prior to attachment is one option.Alternatively, one may consider attaching or “embedding” the bulk metalform into an adhesive layer forming a surface of the substrate. Typicaldiameters for circular wire form may be from 0.002 inch to 0.012 inch,depending on a number of considerations such as cost and handling.Forming patterns using wire placement is considered a fully additiveprocess. “Bulk” foils may have a thickness of from 0.0003 inch to asmuch as 0.010 inch or greater, again depending on processing and desiredpattern design. Stamping patterns from bulk foils is considered asemi-additive process in that the metal foil web remains following thestamping of the pattern. However, the process of attaching the stampedfoil pattern to a substrate would be considered fully additive.

Alternatively, one may consider applying a metal foil to the substrateusing adhesive attachment and then using photoetch processing to createthe desired pattern. This “subtractive” processing is common in themanufacture of printed wire boards and circuits. The thickness of foilsis typically about 0.001 inch and the final patterned conductivematerial has the same thickness (height). Thus, patterns produced thisway may be considered “low profile”.

Alternatively one may consider applying a metal pattern using vacuummetallizing or sputtering. While well established, these processes arelimited in the thicknesses of deposit that can be practically achieved.Thicknesses on the order of 1 micrometer are typical. Thicker depositscan be limited by deposition times and integrity of deposits. Therefore,vacuum deposited patterns would generally be augmented with subsequentlyapplied additional conductive material. Regarding selective depositionof vacuum deposits, there is considerable waste and inconvenience inmasking. Selective vacuum deposition is considered a subtractiveprocess.

Alternatively, one may apply conductive material by printing aconductive ink formulation comprising conductive particles in apolymeric binder. Commonly used conductive particles are silver andcarbon. Silver is typically used for inks applied to the light incidentsurface of photovoltaic cells to produce current collector structure.Further, deposition of highly conductive metals may be considered toaugment the conductivity and physical robustness of printed inks.Electrodeposition over a conductive ink is one alternative. For example,in a preferred embodiment, the “fingers and “busses” compriseelectroplateable material such as DER or an electrically conductive inkwhich will enhance or allow subsequent additive metal electrodeposition.“Fingers” 84 and “busses” 86 may also comprise non-conductive materialwhich would assist accomplishing a subsequent deposition of conductivematerial. “Fingers” 84 or “busses” 86 may comprise a polymer which maybe seeded to catalyze chemical deposition of a metal in a subsequentstep. For example, electroless metal plating may be considered over aprinted pattern of a material such as catalyzed ABS. Patterns comprisingelectroplateable materials or materials facilitating subsequentelectrodeposition or chemical deposition are often referred to as “seed”patterns or layers.

“Fingers” 84 and “busses” 86 may also comprise materials selected topromote adhesion of a subsequently applied conductive material.“Fingers” 84 and “busses” 86 may differ in actual composition and beapplied separately. For example, “fingers” 84 may comprise a conductiveink while “buss/tab” 86 may comprise a conductive metal foil strip.Alternatively, fingers and busses may comprise a continuous unvaryingmonolithic material structure forming portions of both fingers andbusses. Fingers and busses need not both be present in certainembodiments of the invention. While “busses” may be absent in certainembodiments, they are very useful for electrodeposition processing aswell as certain electrical connecting.

Printing and any subsequent processing such as electroless orelectroplating metals are considered fully additive processes. Ingeneral, the patterns produced with such efforts is less than about0.002 inch in thickness (height) and can be considered a “low profile”pattern.

One will recognize that while shown in the embodiments as a continuousvoid free structure, “buss” 86 could be selectively structured. Suchselective structuring may be appropriate to enhance functionality, suchas flexibility, of article 71 or any article produced there from.Furthermore, regions of substrate 70 supporting the “buss” regions 86may be different than those regions supporting “fingers” 84. Forexample, substrate 70 associated with “buss region” 86 may comprise afabric while substrate 70 may comprise a void free film in the regionassociated with “fingers” 84. A “holey” structure in the “buss region”would provide increased flexibility, increased surface area andincreased structural characteristic for an adhesive to grip. Moreover,the embodiments of FIGS. 9 through 11 show the “fingers” and “busses” asessentially planar structures of constant rectangular cross section.Other geometrical forms are clearly possible when design flexibility isassociated with the process used to establish the material pattern of“fingers” and “busses”. “Design flexible” processing includes printingof conductive inks or “seed” layers, foil etching or stamping, maskeddeposition using paint or vacuum deposition, and the like. For example,these conductive paths can have triangular type surface structuresincreasing in width (and thus cross section) in the direction of currentflow. Thus the resistance decreases as net current accumulates to reducepower losses. Alternatively, one may select more intricate patterns,such as a so-called “watershed” pattern. Various structural features,such as radiused connections between fingers and busses may be employedto improve structural robustness.

The embodiment of FIG. 9 shows multiple “busses” 86 extending in thedirection Y-71 with “fingers” extending from one side of the “busses” inthe X-71 direction. Many different such structural arrangements of thelaminating current collector structures are possible within the scopeand purview of the instant invention. It is important to note howeverthat many of the interconnection components of the instant invention maybe manufactured utilizing continuous, bulk processing including thatusing roll to roll web processing. While the collector grid embodimentsof the current invention may advantageously be produced using continuousprocessing, one will recognize that combining of grids or electrodes soproduced with mating conductive surfaces may be accomplished usingeither continuous or batch processing. In one case it may be desired toproduce photovoltaic cells having discrete defined dimensions. Forexample, single crystal silicon cells are often produced having X-Ydimensions of approximately 6 inches by 6 inches. In this case thecollector grids of the instant invention, which may themselves beproduced continuously, may then be subdivided to dimensions appropriatefor combining with such cells. In other cases, such as production ofmany thin film photovoltaic structures, a continuous roll-to-rollproduction of an expansive surface article can be accomplished in the“Y” direction as identified in FIG. 1. Such a continuous expansivephotovoltaic structure may be combined with a continuous arrangement ofcollector grids of the instant invention in a semicontinuous orcontinuous manner. Alternatively the expansive semiconductor structuremay be subdivided into continuous strips of cell stock. In this case,combining a continuous strip of cell stock with a continuous strip ofcollector grid of the instant invention may be accomplished in acontinuous or semi-continuous manner.

FIGS. 12, 13 and 14 correspond to the views of FIGS. 9, 10 and 11respectively following an additional optional processing step. FIG. 15is a sectional view taken substantially along line 15-15 of FIG. 12.Such additional optional process steps accomplish improved function ofthe conductive patterns of the grid/interconnect structures of theinvention. This is especially the case when using “seed” layers toestablish the conductive pattern. Specifically,

-   -   In the case of a pattern defined by a conductive metal filled        ink, the ink itself may be relatively brittle and it may have        relatively low current carrying capacity. In the case where the        substrate surface is both flexible and soft or fluid, these inks        will readily crack. This would be the case if the ink line or        pattern were positioned on an adhesive surface which would be        soft during ink drying or subject to flow during application to        a mating surface. A subsequent process of chemical plating or        electroplating a continuous metal over the ink improves both        current carrying capacity and ability of the pattern to        withstand handling without cracking.    -   In the case of a pattern defined by selective vacuum metallizing        of a metal, the metal is typically thin, less than one        micrometer. In this case conductivity and integrity during        subsequent processing is a concern, similar to that for        conductive metal filled inks. In this case also, a subsequent        deposit of chemically plated or electroplated metal overlaying        the vacuum metallized “seed” layer would be appropriate.    -   In the case of a directly electroplateable resin (DER) “seed”        layer, the material in general has very limited current carrying        capacity. Like the alternatives above, the DER pattern requires        a overlaying metal layer for integrity and current carrying        capacity.    -   In the case of a polymeric “seed” layer catalyzed to initiate        electroless metal deposition, the “seed” layer itself may be        non-conductive. In this case an additional processing step        depositing conductive material embodied in FIGS. 12-15 is        required.

It is noted that the optional processing depicted in FIGS. 12-15 may beavoided when using bulk metal forms such as wire forms and stamped oretched foils to form the initial conductive patterns of FIGS. 9 through11. In these cases the original “bulk” metal forms may be robust and mayexhibit adequate conductivity. Further the “bulk” forms may comprisemulti-layered laminates supplying desired functional attributes. Forexample, a copper wire core may be coated with nickel for corrosionresistance. Alternatively, it may be coated with a conductive adhesivefor improving contact to a mating surface. In that case, the copper wirewould perform a current carrying function and the coating would performits specific function. Such functional coatings on bulk metal forms canbe applied suing techniques such as dipping, spraying, electroplatingand the like.

As indicated above, when forming the conductive pattern design usingtechniques such as printing or masked deposition, it may be desirable toenhance current carrying ability and pattern robustness above thatsupplied by the initial pattern “84/86”. For example, such enhancementmay be appropriate as the length of fingers 84 increases. Accordingly,returning attention to FIGS. 12 through 15, there is shown additionalconductive material deposited onto the “fingers” 84 and “busses” 86 ofFIGS. 9 through 11. In this embodiment additional conductive material isdesignated by one or more layers 88, 90. This additional conductivematerial enhances the current carrying capacity and integrity of the“fingers” and “busses”.

While shown as two layers 88, 90, it is understood that this conductivematerial could comprise more than two layers or be a single layer. Inaddition, while each additional conductive layer is shown in theembodiment as having the same continuous monolithic material extendingover both the buss and finger patterns, one will realize that selectivedeposition techniques would allow the additional “finger” layers todiffer from additional “buss” layers. For example, as shown in FIG. 14,“fingers” 84 have free surface 98 and “busses” 86 have free surface 100.As noted, selective deposition techniques such as brush electroplatingor masked deposition would allow different materials to be consideredfor the “buss” surface 100 and “finger” surface 98. In a preferredembodiment, one or more of the additional layers 88, 90 etc. isdeposited by electrodeposition, taking advantage of the depositionspeed, compositional choice, low cost and selectivity of theelectrodeposition process. Many various metals, including highlyconductive silver, copper and gold, nickel, tin, indium and alloysincluding low melting point solders can be readily electrodeposited. Inthese embodiments, it may be advantageous to utilize electrodepositiontechnology giving an electrodeposit of low tensile stress to preventcurling and promote flatness of the metal deposits. In particular, useof nickel deposited from a nickel sulfamate bath, nickel deposited froma bath containing stress reducing additives such as brighteners, orcopper from a standard acid copper bath have been found particularlysuitable. Electrodeposition also permits precise control of thicknessand composition to permit optimization of other requirements of theoverall manufacturing process for interconnected arrays. Thus, theelectrodeposited metal may significantly increase the current carryingcapacity of the “buss” and “finger” structure and may be the dominantcurrent carrying material for these structures. In general,electrodeposit thicknesses characterized as “low profile”, less thanabout 0.002 inch, supply adequate current carrying capacity for the grid“fingers” of the instant invention. Alternatively, these additionalconductive layers may be deposited by selective chemical deposition orregistered masked vapor deposition.

As will be discussed in more detail below, structures such as thatembodied in FIGS. 9-11 and 12-15 are combined with a mating conductivesurface such as upper surface 59 of photovoltaic cell 10. Thiscombination is normally achieved by laminating the structures togethersuch that surface 80 and the conductive pattern thereupon face topsurface 59 of photovoltaic cell 10 such that exposed surfaces of thepattern (for example 98 of FIGS. 14-15) contact the conductive surfacesuch as 59 of cell 10. Good contact between the top surface 59 of cell10 and the mating exposed surface of finger or line 84 will be achievedby ensuring good adhesion between surface 80 of substrate 70 and surface59 of cell 10. The exposed surfaces may also comprise materials intendedto promote adhesion or contact of the patterns to a subsequently appliedmating surface 59. For example, the exposed surface of the fingerpattern may comprise a low melting point metal or alloy such as asolder. Such low melting point metals or alloys often comprise metalssuch as tin, indium, lead, bismuth and gallium. an indium or gallium.Such a material would melt during lamination of the pattern to themating surface to result in improved surface wetting or possibly a“solder” bond depending on the nature of the mating cell surface. Ineither case, an improved electrical contact may be expected.Alternatively, additional layers (such as 88, 90 of FIGS. 13-15) mayalso comprise conductive inks or adhesives applied by techniques such asregistered printing, electrodeposition or selective wetting. If theconductive ink or adhesive includes a thermoplastic binder, it may meltduring lamination to promote electrical contact of the surfaces. Onewill understand that should the pattern comprise bulk metal forms suchas wires, these forms could include a functional coating of the bulkform prior to application to the flexible substrate.

As indicated in FIGS. 10 and 13 the lines, fingers and busses projectproudly above surface 80 of substrate 70 by dimension “H”. Theprojection may be important to ensure to adequate contacting of theexposed surfaces (such as 98, 100) with mating surfaces of aphotovoltaic cell during lamination processing which brings the matingsurfaces together. Specifically, during the lamination process heat andpressure may force the insulating material layer such as 72 to softenand become fluid. Care must be taken to prevent insulating materialbeing forced between the two mating conductive surfaces (such as 98 andcell top surface 59). Sufficient projection “H” will force the matingconductive surfaces into firm contact before insulating material canflow between them.

On the other hand it may be desirable to reduce the height of projection“H” prior to eventual combination with a conductive surface such as 59or 66 of photovoltaic cell 10. In other cases it may be desirable toimprove the coupling between the conductive pattern and the substrate70. Suitable height reduction or increased coupling may be accomplishedby embedding the pattern into the substrate. This embedding may beaccomplished by passing the structures as depicted in FIG. 9-11 or 12-15through a roll lamination process wherein pressurized and/or heatedrollers embed “fingers” 84 and/or “busses” 86 into layer 72 of substrate70. Depending on the degree of heat and pressure and the nip spacingbetween rollers, the degree of the embedding (and residual projection“H”) can be closely controlled.

In another embodiment, it has been demonstrated that a surface combininga conductive pattern embedded in a layer 72 of substrate 70 can be madevery smooth, showing a minimum of spatial discontinuity between theconductive and non-conductive surfaces. Such a unique surface couldallow deposition of thin active semiconductor layers directly onto acurrent collection grid without discontinuities at the edges of the gridlines. For example, FIG. 71 shows a starting structure for such anembodiment of the instant invention. The FIG. 71 structure replicatesthe structure shown in FIG. 15. FIG. 73 shows the structure of FIG. 20but from the perspective of FIG. 17. The sectional views of FIGS. 72 and74 show the result of embedding the conductive pattern into thesubstrate 70 or 70 f.

The structure of FIG. 73 will be used to illustrate the use of thecurrent collector structures of the instant invention as a starting“superstrate” for subsequent deposition of semiconductor materialforming a photovoltaic stack. The process of this embodiment is asfollows:

-   -   1. An interconnection component is first produced as a pattern        of electrically conductive material (84 f/86 f) supported by a        transparent sheetlike material 70 f. The transparent sheetlike        material 70 f may comprise glass or a transparent polymeric        material. In many cases a transparent polymeric material is        advantageous in that it may be processed in continuous fashion.    -   2. Optionally, the FIG. 73 structure is passed through a        compressive step to imbed projecting pattern portions into the        underlying supporting substrate 70 f. The amount of the        “embedment” can be closely controlled using spaced nip rollers        and appropriate heat and pressure. In this case, patterns        supported on a flowable polymer may be advantageous in allowing        embedment, even to the point where the pattern and the substrate        are substantially “coplanar” and a very smooth surface        transition from substrate to pattern is achieved. Such a        coplanar structure is indicated in FIGS. 74 and 75.    -   3. Optionally, a transparent conductive material 18 is applied        to the patterned superstrate. This is shown in the embodiment of        FIG. 76 using the perspective of the FIG. 75 sectional view.        Such a material would often be a transparent conductive metal        oxide (TCO) as is known in the art. An alternative would be a        transparent conductive material comprising an intrinsic        conductive polymer. Yet another alternate would be a material        comprising a dispersion of transparent or small conductive        particles in a resin matrix. Transparent conductive layers        comprising polymer binders or intrinsically conductive polymers        are discussed in greater detail below with reference to layer 95        of FIGS. 20A and 15A.    -   4. Layers of semiconductor materials 15/16 are deposited over        the transparent conductive material. Semiconductor material        15/16 forms a photovoltaic junction. Printing of the        semiconductors from appropriate inks is one form of process        allowing the selective deposition shown. Alternatively, masked        vapor, chemical deposition or electrodeposition onto the        conductive TCO surface may be considered for semiconductor        deposition. In the latter case the combination TCO/collector        pattern would function as a very effective electrode allowing        expansive area electrodeposition. Alternatively, the        semiconductor material may be deposited over the entire        superstrate and portions subsequently removed to result in the        desired semiconductor spatial arrangement.    -   5. Next a backside electrode 8 is deposited. This may be        accomplished by methods known in the art such as vacuum        deposition and printing of conductive inks.    -   6. As a next step, an interconnecting conductor 9 is applied        over the backside electrode 8. When interconnecting conductor 9        comprises a highly conductive material such as a metal foil, it        is noted that backside electrode 8 need not be highly        conductive, since backside electrode 8 may be very thin and area        expansive. In this case, one may consider inexpensive and easily        applied materials for the backside electrode 8. For example, 8        could comprise an adhesive film formulated using carbon black or        low levels of other conductive additive. The outlying portion 7        of interconnecting conductor 9 may be used to interconnect to an        adjacent photovoltaic stack.

When considering the above steps using the embodiments of FIGS. 71-77,an important observation is that the entire production of an integratedarray of cells can be achieved monolithically (on a monolithicsuperstrate 70F) in a continuous fashion using a continuous polymericweb. Process steps are primarily additive in nature. Subtractive stepsenvisioned do not demand great precision in material removal. Priorefforts at monolithic integration using a continuous polymeric web haveproven difficult because of the difficulty in achieving precise laserscribing on the flexible web. In addition, because of the absence of atopside current collector structure, prior efforts at photovoltaicstructure deposition onto polymeric web superstrates have been limitedto relatively small cell widths of about 1 centimeter. These small cellwidths require increased precision in accomplishing interconnectionsamong cells.

Returning now to the discussion of the structure embodied in FIGS. 9-12and FIGS. 12-15, it has been found very advantageous to form the exposedsurface of “fingers” 84 or of “busses” 86 with a material compatiblewith the conductive surface with which eventual contact is made. In thecase of “bulk” metal forms such as wires, foils or meshes the exposedsurface may be formed prior to application of the bulk form to thesubstrate 70. In the case of the additive processes embodied in FIGS.12-15, the exposed surface is formed by deposition of material in apattern predefined by original material. In either case, electrolessdeposition or electrodeposition may be a suitable method to apply amaterial layer or coating forming the exposed surface of the pattern.Specifically electrodeposition offers a wide choice of potentiallysuitable materials to form the free surface. Corrosion resistantmaterials such as nickel, chromium, tin, indium, silver, gold andplatinum are readily electrodeposited. When compatible, of course,surfaces comprising metals such as copper or zinc or alloys of copper orzinc may be considered. Alternatively, the exposed surface may comprisea conversion coating, such as a chromate coating, of a material such ascopper or zinc. Nickel has been found to be a suitable choice for theexposed surface of patterns contacting transparent conductive oxidemetal surfaces. Nickel is readily electroplated using a wide range ofestablished electroplating baths. Nickel is corrosion resistant,relatively inexpensive, non-migratory and has high melting point. Animportant consideration is that nickel is not a precious metal (as isgold, silver etc.) and therefore not subject to the exaggerated pricefluctuations typical of precious metals.

Alternatively, as will be discussed below, it may be highly advantageousto choose a material to form exposed surfaces which exhibits adhesive orbonding ability to a subsequently positioned abutting conductivesurface. For example, it may be advantageous to form exposed surfacesusing a coating of electrically conductive adhesive.

Alternatively, it may be advantageous to form exposed surfaces of“fingers” 84 or “busses” 86 with a coating of conductive materialcomprising a low melting point metal such as tin, indium, bismuth, lead,gallium or tin containing alloys in order to facilitate electricaljoining to a complimentary conductive surface. Such low melting pointmetals or alloys are often referred to as solders. Such low meltingpoint materials may be applied to the “fingers” or “busses” byelectrodeposition or simple dipping to wet the underlying conductivelines. Suitable low melting point metals often comprise tin, indium,gallium, lead or bismuth. In this case the low melting point metal orsolder would be chosen to have a melting point below a temperaturereached during processing such that exposed surfaces of the fingers orbusses would become molten and thereby wet the complimentary conductivesurface. Many plastic materials may be properly processed attemperatures less than 600 degree Fahrenheit. Thus, for purposes of thisspecification and claims, a metal or metal-based alloy whose meltingpoint is less than 600 degree Fahrenheit is considered a low meltingpoint metal. One will note that materials forming the “fingers” surfaceand “buss” surface need not be the same. It is emphasized that many ofthe principles taught in detail with reference to FIGS. 6 through 15extend to additional embodiments of the invention taught in subsequentFigures.

FIG. 16 is a top plan view of an article 102 embodying another form ofthe electrodes of the current invention. FIG. 16 shows article 102having structure comprising a pattern of “fingers” or lines 84 aextending from “buss/tab” 86 a arranged on a substrate 70 a. Substrate70 a is similar to substrate 70 of FIGS. 6-15, and the structure of FIG.16 is similar to that shown in FIG. 9. However, whereas FIG. 9 depictedmultiple finger and buss/tab structures arranged in a substantiallyrepetitive pattern in direction “X-71” on a common substrate, the FIG.16 embodiment consists of a single unit of finger/buss pattern. Thus,the dimension “X-102” of FIG. 16 may be roughly equivalent to the repeatdimension “F” shown in FIG. 9. Indeed, it is contemplated that article102 of FIG. 16 may be produced by subdividing structure such as 71 ofFIG. 9 into units according to repeat dimension “F” shown in FIG. 9.Dimension “Y-102” may be chosen appropriate to the particular processingscheme envisioned for the eventual lamination to a conductive surfacesuch as a photovoltaic cell. However, it is envisioned that “Y-102” maybe much greater than “X-102” such that article 102 may be characterizedas continuous or capable of being processed in a roll-to-roll fashion.Article 102 has a first terminal edge or boundary 104 and secondterminal edge or boundary 106. In the FIG. 16 embodiment “fingers” 84 aare seen to terminate prior to intersection with terminal edge 106. Onewill understand that this is not a requirement.

“Fingers” 84 a and “buss/tab” 86 a of FIG. 16 have the samecharacterization as “fingers” 84 and “busses” 86 of FIGS. 9 through 11.Like the “fingers” 84 and “busses” 86 of FIGS. 9 through 11, “fingers”84 a and “buss” 86 a of FIG. 16 may comprise materials that are eitherare conductive or may assist in a subsequent deposition of conductivematerial or promote adhesion of a subsequently applied conductivematerial to substrate 70 a. While shown as a single layer, oneappreciates that “fingers” 84 a and “buss” 86 a may comprise multiplelayers. The materials forming “fingers” 84 a and “buss” 86 a may bedifferent or the same. In addition, the substrate 70 a may comprisedifferent materials or structures in those regions associated with“fingers” 84 a and “buss region” 86 a. For example, substrate 70 aassociated with “buss region” 86 a may comprise a fabric to providethru-hole communication and enhance flexibility, while substrate 70 a inthe region associated with “fingers” 84 a may comprise a film devoid ofthru-holes such as depicted in FIGS. 6-8. A “holey” structure in the“buss region” 86 a would provide increased flexibility, surface area andstructural characteristic for an adhesive to grip.

FIGS. 17 and 18 are sectional embodiments taken substantially from theperspective of lines 17-17 and 18-18 respectively of FIG. 16. FIGS. 17and 18 show that article 102 has thickness Z-102 which may be muchsmaller than the X and Y dimensions, thereby allowing article 102 to beflexible and processable in roll form. Also, flexible sheet-like article102 may comprise any number of discrete layers (three layers 72 a, 74 a,76 a are shown in FIGS. 17 and 18). These layers contribute tofunctionality as previously pointed out in the discussion of FIG. 7. Thediscussion of the structure and characteristics of article 70 aboveapplies for the most part to article 70 a. As will be understood inlight of the following discussion, it is normally helpful for layer 72 aforming free surface 80 a to exhibit adhesive characteristics andaffinity to the eventual abutting conductive surface.

FIG. 17A is a sectional view showing additional structure 68 applied tothe FIG. 17 embodiment. Structure 68 comprises an insulating strip ortape spanning the intersection of “fingers” 84 a and “buss” 86 a. Aswill be seen in the teachings to follow, it is this region where theconductive lines normally cross an edge of a photovoltaic cell. Thus thestrip 68 prevents shorting caused by incidental contact of a line withboth the top and bottom surfaces of a cell. The strip of tape comprisesan adhesive layer 64 and carrier layer 63 as is common with pressuresensitive tapes or laminating sheets.

FIG. 19 is an alternate representation of the sectional view of FIG. 18.FIG. 19 depicts substrate 70 a as a single layer for ease ofpresentation. The single layer representation will be used in manyfollowing embodiments, but one will understand that substrate 70 a maycomprise multiple layers.

FIG. 20 is a sectional view of the article now identified as 110,similar to FIG. 19, after an additional optional processing step. In afashion like that described above for production of the currentcollector structure of FIGS. 12 through 15, additional conductivematerial (88 a/90 a) has been deposited by optional processing toproduce the article 110 of FIG. 20. The discussion involving processingto produce the article of FIGS. 12 through 15 is proper to describeproduction of the article of FIG. 20. Thus, while additional conductivematerial has been designated as a single layer (88 a/90 a) in the FIG.20 embodiment, one will understand that layer (88 a/90 a) of FIG. 20 mayrepresent any number of multiple additional layers. In subsequentembodiments, additional conductive material (88 a/90 a) will berepresented as a single layer for ease of presentation. In its formprior to combination with a conductive surface of cells 10, thestructures such as shown in FIGS. 9-15, and 16-20 can be referred to as“interconnection components”. Articles 102 and 110 may be characterizedas units of “interconnection component”. Moreover, “interconnectioncomponents” can be in either continuous or discrete form. Further, inlight of the teachings to follow one will recognize that the structuresshown in FIGS. 9-15 and 16-20 may function and be characterized aslaminating electrodes. As will be taught below, the interconnectioncomponent may often be applied to a photovoltaic cell as a “strap” or“tape”.

It has been found very advantageous to form surface 98 a of “fingers” 84a or surface 100 a of “busses” 86 a with a material compatible with theconductive surface with which eventual contact is made. In preferredembodiments, electroless deposition or electrodeposition is used to forma suitable metallic surface. Specifically electrodeposition offers awide choice of potentially suitable materials to form the surface.Corrosion resistant materials such as nickel, chromium, tin, indium,silver, gold and platinum are readily electrodeposited. When compatible,of course, surfaces comprising metals such as copper or zinc or alloysof copper or zinc may be considered. Alternatively, the surfaces 98 aand 100 a may comprise a conversion coating, such as a chromate coating,of a material such as copper or zinc. Further, as will be discussedbelow, it may be highly advantageous to choose a material to formsurfaces 98 a or 100 a which exhibits adhesive or bonding ability to asubsequently positioned abutting conductive surface. For example, it maybe advantageous to form surfaces 98 a and 100 a using an electricallyconductive adhesive. Alternatively, it may be advantageous to formsurfaces 98 a of “fingers” 84 a or 100 a of “busses” 86 a with aconductive material such as a low melting point alloy solder in order tofacilitate electrical joining to a complimentary conductive surface. Forexample, forming surfaces 98 a and 100 a with materials comprising tin,lead, bismuth, gallium or indium or alloys of these metals would resultin a low melting point surface to facilitate electrical joining duringsubsequent lamination steps. One will note that materials forming“fingers” surface 98 a and “buss” surface 100 a need not be the same.

Another alternative embodiment of the laminating contacts of the instantinvention, particularly suitable for photovoltaic application, employs afilm of transparent or translucent conductive or semi-conductivematerial to further enhance adhesion and contact of the highlyconductive patterns to a complimentary surface. In this case, atransparent conductive material is positioned between the pattern andthe complimentary surface. In the embodiment of FIG. 20A, a transparentelectrically conductive material layer 95 has been applied over both theconductive pattern (84 c/86 c) and the regions of substrate positionedbetween pattern portions. In this case the FIG. 20A structure may beapplied to the upper surface of a photovoltaic cell because layer 95 istransparent. A similar arrangement is shown for a repetitive structurein FIG. 15A.

Transparent conductive or semi-conductive material 95 may be appliedover the conductive pattern (84 c/86 c) and supporting substrate 70 cusing standard lamination processing should material 95 be presented asa film. Alternatively, material 95 may be applied as a dissolved solidin solution using standard spray, doctor blade or printing techniques.Transparent conductive material 95 may comprise transparent conductiveparticles dispersed in a resin matrix. Transparent conductive particlesmay comprise, for example, metal oxides such as zinc oxide or indium-tinoxide. Alternatively, conductive particles may comprise intrinsicallyconductive polymers. Alternatively, small volume percentages of smalldiameter metal fibers (nanowires) or particles may be employed withoutintroducing excessive shading through the material thickness.Combinations of transparent and opaque conductive particles may beconsidered.

A resin binder for material 95 may be chosen to have adhesive affinityfor both the substrate surface 80 c and light incident top surface 59 ofa photovoltaic cell 10. In this case conductive or semi-conductivematerial 95 can be considered a transparent conductive orsemi-conductive adhesive bonding the substrate/pattern stack to thesurface of the photovoltaic cell.

Transparent conductive material 95 may be applied to either the lightincident top surface 59 of a photovoltaic cell or to the substratesurface 80 c and pattern as shown in FIG. 20A. In the former case,material 95 may augment a characteristic of an underlying TCO, such asto impart an adhesive ability or protective barrier. In the later casethe transparent conductive material may be applied to the laminatingsubstrate as a step in continuous production.

The intrinsic resistivity of the transparent conductive material may berelatively high, for example of the order 1 ohm-cm. or even higher. Thisis because the transparent conductive or semi-conductive material neednot contribute in a significant way to lateral conductivity on the lightincident surface 59 of the photovoltaic cell. There, lateral surfaceconductivity is primarily managed by the application of the TCO layer18. The material 95 need only transport current through a very thinlayer (typically 1-12 micrometer) and over a relatively broad surfacedefined by the conductive pattern. Since there is not a requirement forhigh conductivity for the material 95, the actual volume loading ofconductive particles (in the case of resin dispersed particles) can bereduced to thereby increase light transmission.

FIG. 20B shows an embodiment of a possible structural stack employingthe FIG. 20A structure applied to the upper surface 59 of a photovoltaiccell 10. Application may be by straightforward lamination of the FIG.20A structure to the upper surface of a photovoltaic cell 10.

The current collector structures embodied in FIGS. 9-15 and 16-20 areeventually combined with mating conductive surfaces. For example, FIG.21 illustrates a process 92 by which the current collector grids ofFIGS. 16 through 20 may be combined with the structure illustrated inFIGS. 1A, 2A and 2C to accomplish lamination of current collectingelectrodes to the top and bottom surfaces of a photovoltaic cell stock.The process envisioned in FIG. 21 has been demonstrated using standardlamination processing such as roll lamination and vacuum lamination. Ina preferred embodiment, roll lamination is employed. In roll lamination,sheetlike feed streams are fed to a nip formed by a pair of rollers. Thefeed streams are normally of continuous form. Heat and pressure appliedwhen passing through the hot nip expels air and bonds the sheetlikesurfaces together.

Roll lamination allows continuous processing and a wide choice ofapplication temperatures and pressures. However, the relatively rapidprocessing afforded by roll lamination places limits on the thicknessesof the feed streams because of the relatively rapid heating ratesinvolved. Moreover, roll lamination typically requires adequatestructural integrity of the feed streams. This is especially true whencontinuous lamination is involved. Thus roll lamination will typicallyinvolve a relatively thin adhesive sealing material layer supported on astructural polymeric carrier film. Roll lamination is furthercharacterized as allowing relatively short thermal exposure. This is anadvantage in processing throughput and also in some instances may avoidthermal semiconductor deterioration. However, such short thermalexposures (rapid heat up and cool down) normally require relatively thinmaterials. For example, using roll lamination the total thickness of asealing layer would typically be less than 250 micrometers (i.e. 75micrometers, 150 micrometers, 200 micrometers). A complimentary carrierlayer would typically be less than 125 micrometers (i.e. 50 micrometers,100 micrometers). In contrast, many of the legacy encapsulationtechniques for solar cell modules employ thermosetting sealing materialshaving thickness in excess of 450 micrometers. Such thick materialsrequire extended batch processing such as that characteristic of vacuumlamination processing.

Temperatures employed for process 92 of FIG. 21 are typical forlamination of standard polymeric materials used in the high volumeplastics packaging industry, normally less than about 600 degreesFahrenheit. Process 92 is but one of many processes possible to achievesuch application. In FIG. 21 rolls 94 and 97 represent “continuous” feedrolls of grid/buss structure on a flexible sheetlike substrate (currentcollector stock) as depicted in FIGS. 16 through 20. Roll 96 representsa “continuous” feed roll of the sheetlike cell stock as depicted inFIGS. 1A, 2A and 2C.

FIG. 22 is a sectional view taken substantially from the perspective ofline 22-22 of FIG. 21. FIG. 22 shows a photovoltaic cell 10 such asembodied in FIG. 2A or 2B disposed between two current collectingelectrodes 110 a and 110 b such as article 110 embodied in FIG. 20. FIG.23 is a sectional view showing the article 112 resulting from usingprocess 92 to laminate the three individual structures of FIG. 22 whilesubstantially maintaining the relative positioning depicted in FIG. 22.FIG. 23 shows that a laminating current collector electrode 110 a hasnow been applied to the top conductive surface 59 of cell 10. The gridpattern of “fingers” or lines 84 a extends over a preponderance of thelight incident surface 59 of cell 10. Laminating current collectorelectrode 110 b mates with and contacts the bottom conductive surface 66of cell 10. Grid “fingers” 84 a of a current collector electrode 110 aproject laterally across the top surface 59 of cell stock 10 and extendto a “buss” region 86 a located outside terminal edge 45 of cell stock10. The grid “fingers” 84 a of a bottom current collector electrode 110b project laterally across the bottom surface 66 of cell stock 10 andextend to a “buss” region 86 a located outside terminal edge 46 of cellstock 10. Thus article 112 is characterized as having readily accessibleconductive surface portions 100 a in the form of tabs 101 a, 101 b inelectrical communication with both top cell surface 59 and bottom cellsurface 66.

Those skilled in the art will recognize that contact between the topsurface 59 of cell 10 and the mating surface 98 a of finger 84 a will beachieved by ensuring good adhesion between surface 80 a of substrate 70a and surface 59 of cell 10. One will further recognize that contactbetween bottom surface 66 of cell 10 and fingers 84 a of collector grid110 b will be ensured by achieving adhesion between surface 80 a ofsubstrate 70 a and surface 66 of cell 10. These contacts are ensured bythe blanketing “hold down” afforded by the adhesive bonding adjacent theedges of the conductive pattern portions. In particular, the materialforming the remaining free surface 80 a of articles 110 a and 110 b(that portion of surfaces 80 a not covered with conductive material) ischosen to promote good adhesion between articles 110 a and 110 b and thecorresponding cell surfaces during a laminating process. Thus, in theembodiment of FIGS. 22 and 23 surface 80 a comprises material havingadhesive characteristic and affinity to both surfaces 59 and 66 of cell10. Further, it is important to realize that the laminated contacts maybe achieved through the blanketing “hold down” and do not require usingsolder or conductive adhesives. However, solder type materials andconductive adhesives may be selected to form free surfaces 98 a/100 a ofthe conductive patterns if appropriate.

Article 112 can be described as a “tabbed cell stock”. In the presentspecification and claims, a “tabbed cell stock” is defined as aphotovoltaic cell structure combined with electrically conductingmaterial in electrical communication with a conductive surface of thecell structure, and further wherein the electrically conducting materialextends outside a terminal edge of the cell structure to present areadily accessible contact surface. In light of the present teachings,one will understand that “tabbed cell stock” can be characterized asbeing either continuous or discrete. One will also recognize thatelectrodes 110 a and 110 b can be used independently of each other. Forexample, 110 b could be employed as a back side electrode while acurrent collector electrode different than 110 a is employed on theupper side of cell 10. Also, one will understand that while electrodes110 a and 110 b are shown in the embodiment to be the same structure,different structures and compositions may be chosen for electrodes 110 aand 110 b.

A “tabbed cell stock” 112 has a number of fundamental advantageousattributes. First, it can be produced as a continuous cell “strip” andin a continuous roll-to-roll fashion in the Y direction (directionnormal to the paper in the sectional view of FIG. 23). Following theenvisioned lamination, the “tabbed cell stock” strip can be continuouslymonitored for quality since there is ready access to the exposed freesurfaces 100 a in electrical communication with top cell surface 59 andthe cell bottom surface 66. Thus defective cell material can beidentified and discarded prior to final interconnection into an array.Finally, the laminated current collector electrodes protect the surfacesof the cell from defects possibly introduced by the further handingassociated with final interconnections.

The lamination process 92 of FIG. 21 normally involves application ofheat and pressure. Temperatures of up to 600 degree F. are envisioned.Lamination temperatures of less than 600 degree F. would be more thansufficient to melt and activate not only typical polymeric sealingmaterials but also many low melting point metals, alloys and metallicsolders. For example, tin melts at about 450 degree F. and its alloyseven lower. Tin alloys with for example bismuth, lead and indium orgallium are common industrial materials. Many conductive “hot melt”adhesives can be activated at even lower temperatures such as 300 degreeF. Typical thermal cross-linking temperatures for polymers are in therange 200 to 350 degree F. Thus, typical lamination practice widespreadin the packaging industry is normally appropriate to simultaneouslyactivate and accomplish many conductive joining possibilities.

The sectional drawings of FIGS. 24 and 25 show the result of joiningmultiple articles 112 a, 112 b. Each article has a readily accessibledownward facing conductive surface pattern (in the drawing perspective)114 in communication with the cell top surface 59. It is clear that eachunit 112 a, 112 b, etc. has its own individual current collectorstructure 110 a harvesting current from the cells top surface. Thus eachcell is covered by its own individual substrate layer 70 a which isseparate and distinct from the substrate layer of an adjacent cell. Areadily accessible upward facing conductive surface pattern 116 extendsfrom the cell bottom surfaces 66. Series connection is achieved by atleast a partial overlapping of tab 101 a of article 112 b and tab 101 bof article 112 a as shown in FIGS. 24 and 25.

One will clearly recognize that these readily accessible surfaces 114and 116 may function as terminal bars for the end cells of a modulararray of interconnected cells. One also appreciates that as shown inthis embodiment, current collector 110 b functions as an interconnectingsubstrate unit. Series connections between adjacent cells are easilyachieved by overlapping the top conductive surface extension 114 (i.e.tab 101 a) of one article 112 b and a bottom conductive surfaceextension 116 (i.e. tab 101 b) of a second article 112 a andelectrically connecting these conductive extensions with electricallyconductive joining means such as conductive adhesive 42 shown in FIGS.24 and 25. Other electrically conductive joining means including thosedefined above may be selected in place of conductive adhesive 42. Forexample, conductive surfaces 114 and 116 could overlap and beelectrically joined to top and bottom surfaces of a metal foil or meshmember. Finally, since the articles 112 of FIG. 23 can be produced in acontinuous form (in the direction normal to the paper in FIG. 23) theseries connections and array production embodied in FIGS. 24 and 25 mayalso be accomplished in a continuous manner by using continuous feedrolls of “tabbed cell stock” 112. However, while continuous assembly maybe possible, other processing may be envisioned to produce theinterconnection embodied in FIGS. 24 and 25. For example, definedlengths of “tabbed cell stock” 112 could be produced by subdividing acontinuous strip of “tabbed cell stock” 112 in the Y dimension and theindividual articles thereby produced could be arranged as shown in FIGS.24 and 25 using, for example, standard pick and place positioning.

FIG. 26 is a top plan view of an article in production of anotherembodiment of a laminating current collector grid or electrode accordingto the instant invention. FIG. 26 embodies a polymer based film or glasssubstrate 120. Substrate 120 has width X-120 and length Y-120. Inembodiments, taught in detail below, Y-120 may be much greater thanwidth X-120, whereby film 120 can generally be described as “continuous”in length and able to be processed in length direction Y-120 in acontinuous roll-to-roll fashion. FIG. 27 is a sectional view takensubstantially from the view 27-27 of FIG. 26. Thickness dimension Z-120is small in comparison to dimensions Y-120, X-120 and thus substrate 120may have a flexible sheetlike, or web structure contributing to possibleroll-to-roll processing. As shown in FIG. 27, substrate 120 may be alaminate of multiple layers 72 b, 74 b, 76 b etc. or may comprise asingle layer of material. Thus substrate 120 may have structure similarto that of the FIGS. 6 through 8 embodiments, and the discussion of thecharacteristics of article 70 of FIGS. 6 through 8 is proper tocharacterize article 120 as well. As will be seen in preferredembodiments, material forming surface 80 b possesses adhesivecharacteristics, being able to flow and wet mating surfaces. As with therepresentation of the article 70 of FIGS. 6 through 8, and as shown inFIG. 28, article 120 (possibly multilayered) will be embodied as asingle layer in the following for simplicity of presentation.

FIG. 29 is a top plan view of an article 124 following an additionalprocessing step using article 120. FIG. 30 is a sectional viewsubstantially from the perspective of lines 30-30 of FIG. 29. Thestructure depicted in FIGS. 29 and 30 is similar to that embodied inFIGS. 16 and 18. It is seen that article 124 comprises a pattern of“fingers” or “lines”, designated 84 b, extending from “buss” or “tab”structures, designated 86 b. In the embodiments of FIGS. 29 and 30, both“fingers” 84 b and “busses” 86 b are positioned on supporting substrate120 in a grid pattern. “Fingers” 84 b extend in the width X-124direction of article 124 and “busses” (“tabs”) extend in the Y-124direction substantially perpendicular to the “fingers”. Structure 124may be produced, processed and extend continuously in the length “Y-124”direction.

In the FIG. 29 embodiment, it is seen that the distal ends 85 of thefingers located away from the “buss” 86 b are joined by connecting lineof material 128 extending in the “Y-124” direction. One readilyunderstands that should an individual “finger” 84 b become severed orotherwise conductively impaired at a point along its length theconnecting material line 128 allows a shuttling of the affected currentflow to an adjacent finger. In this way a defective finger does notappreciably detract from overall cell performance. One may alsoappreciate the substantial functional redundancy characteristic of thegrid/interconnect structures of the invention.

In the embodiment of FIGS. 29 and 30, the buss 86 b region ischaracterized as having multiple regions 126 devoid of material forming“buss” 86 b. In the FIG. 29 embodiment, the voided regions 126 arepresented as circular regions periodically spaced in the “Y-124”direction. One will understand in light of the teachings to follow thatthe circular forms 126 depicted in FIG. 29 is but one of many differentpatterns possible for the voided regions 126. The sectional view of FIG.30 shows the voided regions 126 leave regions of the surface 80 b ofsubstrate 120 exposed. Surface 80 b of substrate 120 remains exposed inthose regions not covered by the finger/buss pattern. These exposedregions are further indicated by the numeral 127 in FIG. 29.

“Fingers” 84 b and “busses” 86 b may comprise electrically conductivematerial. Examples of such materials are metal wires and foils, stampedmetal patterns, conductive metal containing inks and pastes such asthose having a conductive filler comprising silver or stainless steel,patterned deposited metals such as etched metal patterns or maskedvacuum deposited metals, intrinsically conductive polymers and DERformulations. In a preferred embodiment, the “fingers and “busses”comprise electroplateable material such as DER or an electricallyconductive ink which will enhance or allow subsequent metalelectrodeposition. “Fingers” 84 b and “busses” 86 b may also comprisenon-conductive material which would assist accomplishing a subsequentdeposition of conductive material in the pattern defined by the“fingers” and “busses”. For example, “fingers” 84 b or “busses” 86 bcould comprise a polymer which may be seeded to catalyze chemicaldeposition of a metal in a subsequent step. An example of such amaterial is seeded ABS. Patterns comprising electroplateable materialsor materials facilitating subsequent metal deposition are often referredto as “seed” patterns or layers. “Fingers” 84 b and “busses” 86 b mayalso comprise materials selected to promote adhesion of a subsequentlyapplied conductive material. For example the material defining the“buss” or “finger” patterns which is in direct contact with substrate120 may be chosen for its adhesive affinity to surface 80 b of substrate120 and also to a subsequently applied constituent of the buss or fingerstructure. Further, it may be advantageous to have the first visiblematerial component of the fingers and busses be of dark color or black.As will be shown, the light incident side (outside surface) of thesubstrate 120 will eventually be surface 82. By having the first visiblecomponent of the fingers and busses be dark, they will aestheticallyblend with the generally dark color of the photovoltaic cell. Thiseliminates the often objectionable appearance of a metal colored gridpattern. “Fingers” 84 b and “busses” 86 b may differ in actualcomposition and be applied separately. For example, “fingers” 84 b maycomprise a conductive ink while “buss/tab” 86 b may comprise aconductive metal foil strip. Alternatively, fingers and busses maycomprise a continuous unvarying monolithic material structure formingportions of both fingers and busses. Fingers and busses need not both bepresent in certain embodiments of the invention.

Portions of substrate 120 not overlayed by material forming “fingers” 84b and “busses” 86 b remain transparent or translucent to visible light.These regions are generally identified by numeral 127 in FIG. 29. In theembodiment of FIGS. 29 and 30, the “fingers” 84 b and “busses” 86 b areshown to be a single layer for simplicity of presentation. However, the“fingers” and “busses” can comprise multiple layers of differingmaterials chosen to support various functional attributes. Permissibledimensions and structure for the “fingers” and “busses” will varysomewhat depending on materials and fabrication process used for thefingers and busses, and the dimensions of the individual cell. Ingeneral, parallel adjacent portions of the conductive lines (“traces” or“fingers”) will be separated by a minimum of 0.050 inch of “voided area”127 in order to reduce shading while allowing grid widths between 0.003inch and 0.012 inch.

The embodiments of FIGS. 29 and 30 show the “fingers” 84 b, “busses” 86b, and connecting line 128 as essentially planar rectangular structures.Other geometrical forms are clearly possible, especially when designflexibility is associated with the process used to establish thematerial pattern of “fingers” and “busses”. “Design flexible” processingincludes printing of conductive inks or “seed” layers, foil etching orstamping, masked deposition using paint or vacuum deposition, and thelike. For example, these conductive paths can have triangular typesurface structures increasing in width (and thus cross section) in thedirection of current flow. Thus the resistance decreases as net currentaccumulates to reduce power losses. Alternatively, one may select moreintricate patterns, such as a “watershed” pattern. Various structuralfeatures, such as radiused connections between fingers and busses may beemployed to improve structural robustness.

It is important to note that the laminating current collector structuresof the instant invention may be manufactured utilizing continuous, bulkroll to roll processing. While the collector grid embodiments of thecurrent invention may advantageously be produced using continuousprocessing, one will recognize that combining of grids or electrodes soproduced with mating conductive surfaces may be accomplished usingeither continuous or batch processing. In one case it may be desired toproduce photovoltaic cells having discrete defined dimensions. Forexample, single crystal silicon cells are often produced having X-Ydimensions of 6 inches by 6 inches. In this case the collector grids ofthe instant invention, which may be produced continuously, may then besubdivided to dimensions appropriate for combining with such cells. Inother cases, such as production of many thin film photovoltaicstructures, a continuous roll-to-roll production of an expansive surfacearticle can be accomplished in the “Y” direction as identified inFIG. 1. Such a continuous expansive photovoltaic structure may becombined with a continuous arrangement of collector grids of the instantinvention in a semicontinuous or continuous manner. Alternatively theexpansive semiconductor structure may be subdivided into continuousstrips of cell stock. In this case, combining a continuous strip of cellstock with a continuous strip of collector grid of the instant inventionmay be accomplished in a continuous or semi-continuous manner.

FIG. 31 corresponds to the view of FIG. 30 following an additionaloptional processing step. The FIG. 31 article is now designated bynumeral 125 to reflect this additional processing. FIG. 31 showsadditional conductive material deposited onto the “fingers” 84 b and“buss” 86 b. In this embodiment additional conductive material isdesignated by one or more layers (88 b, 90 b). It is understood thatconductive material could comprise more than two layers or be a singlelayer. Conductive material (88 b,90 b) is shown as a single layer in theFIG. 31 embodiment for ease of presentation.

Article 125 is another embodiment of a unit of “current collectorstock”. The projection of the pattern above surface 80 b is indicated bythe dimension “H” in FIG. 31. Dimension “H” may be as large as about 300micrometers (0.012 inch), especially when the traces or lines comprise awire form. Alternatively, “H” may be less than about 0.002 inch when thepattern comprises printed material, chemical or electrochemicallydeposited material or material produced from foils. When “H” is lessthan about 0.002 inch the structure of fingers and busses depicted inFIG. 31 may be considered as a “low profile” structure. In some cases itmay be desirable to reduce the height of projection “H” prior toeventual combination with a conductive surface such as 59 or 66 ofphotovoltaic cell 10. This reduction may be accomplished by passing thestructures as depicted in FIGS. 30, 31 through a pressurized and/orheated roller or the like to embed “fingers” 84 b and/or “busses” 86 binto layer 72 b of substrate 120.

While each additional conductive material is shown the FIG. 31embodiment as having the same continuous monolithic material extendingover both the buss and finger patterns, one will realize that selectiveformation techniques would allow the additional “finger” layers todiffer from additional “buss” layers. For example, as shown in FIG. 31,“fingers” 84 b have free surface 98 b and “busses” 86 b have freesurface 100 b. As noted, selective deposition techniques such as brushelectroplating or masked deposition would allow different materials tobe considered for the “buss” surface 100 b and “finger” surface 98 b. Ina preferred embodiment, at least one of the additional layers (88 b, 90b) etc. are deposited by electrodeposition, taking advantage of thedeposition speed, compositional choice, low cost and selectivity of theelectrodeposition process. Many various metals, including highlyconductive silver, copper and gold, nickel, tin and alloys can bereadily electrodeposited. In these embodiments, it may be advantageousto utilize electrodeposition technology giving an electrodeposit of lowtensile stress to prevent curling and promote flatness of the metaldeposits. In particular, use of nickel deposited from a nickel sulfamatebath, nickel deposited from a bath containing stress reducing additivessuch as brighteners, or copper from a standard acid copper bath havebeen found particularly suitable. Electrodeposition also permits precisecontrol of thickness and composition to permit optimization of otherrequirements of the overall manufacturing process for interconnectedarrays. Alternatively, these additional conductive layers may bedeposited by selective chemical deposition or registered masked vapordeposition. These additional layers (88, 90) may also compriseconductive inks or adhesives applied by registered printing orelectrodeposition of composite materials comprising conductivecomponents.

It has been found very advantageous to form surface 98 b of “fingers” 84b or surface 100 b of “busses” 86 b with a material compatible with theconductive surface with which eventual contact is made. In preferredembodiments, electroless deposition or electrodeposition is used to forma suitable metallic surface. Specifically electrodeposition offers awide choice of potentially suitable materials to form the surface.Corrosion resistant materials such as nickel, chromium, tin, indium,silver, gold and platinum are readily electrodeposited. When compatible,of course, surfaces comprising metals such as copper or zinc or alloysof copper or zinc may be considered. Alternatively, the surface 98 b maycomprise a conversion coating, such as a chromate coating, of a materialsuch as copper or zinc. Further, as will be discussed below, it may behighly advantageous to choose a material to form surfaces 98 b or 100 bwhich exhibits adhesive or bonding ability to a subsequently positionedabutting conductive surface. For example, it may be advantageous to formsurfaces 98 b and 100 b using an electrically conductive adhesive.Conductive inks or adhesives may be selectively applied by registeredprinting, masked deposition or selective electrodeposition of compositematerials comprising conductive components. Alternatively, it may beadvantageous to form surface 100 b of “busses” 86 b with a conductivematerial such as a low melting point alloy solder in order to facilitateelectrical joining to a complimentary conductive surface havingelectrical communication with an electrode of an adjacent photovoltaiccell. For example, forming surfaces 98 b and 100 b with materials suchas tin or indium or alloys of tin with an alloying element such as lead,bismuth or indium or gallium would result in a low melting point surfaceto facilitate electrical joining during subsequent lamination steps. Onewill note that materials forming “fingers” surface 98 b and “buss”surface 100 b need not be the same.

FIG. 32 depicts an arrangement of 3 articles just prior to a laminatingprocess according to a process embodiment such as that of FIG. 21. Inthe FIG. 32 embodiment, “current collector stock” 125 is positionedabove a photovoltaic cell 10. A second article of laminating “currentcollector stock”, identified by numeral 129, is positioned beneath cell10. Article 129 may be similar in structure to article 110 of FIG. 20.

FIG. 33 shows the article 130 resulting from passing the FIG. 32arrangement through a lamination process as depicted in FIG. 21. Thelamination process has applied article 125 to the top surface 59 of cell10. Thus, the conductive surfaces 98 b of grid “fingers” 84 b of article125 are fixed by the lamination in intimate contact with conductive topsurface 59 of cell 10. This intimate contact is produced at least inpart through the adhesive blanketing produced by major portions ofsurface 80 b being adhesively laminated to surface 59 of cell 10. Thegrid pattern of “fingers” or “lines” 84 b extends over a preponderanceof the light incident surface 59 of cell 10. The lamination process hassimilarly positioned the conductive surface 98 a of “fingers” 84 a ofarticle 129 in intimate contact with the bottom surface 66 of cell 10.The conductive material associated with current collector stock 125extends past a first terminal edge 46 of cell 10. The conductivematerial associated with current collector stock 129 extends past secondterminal edge 45 of cell 10. These extensions, identified by numerals134 and 136 in FIG. 33, form convenient “tab” surfaces to facilitateelectrical connections to and from the actual cell. Thus article 130 canbe properly characterized as a form or embodiment of a “tabbed cellstock”. One also realizes that these extensions 134, 136 also mayfunction as “terminal bars” should the cell occur as an end cell in aninterconnected array.

In the present specification lamination has been shown as a means ofcombining the collector grid or electrode structures with a conductivesurface. However, one will recognize that other application methods tocombine the grid or electrode with a conductive surface may beappropriate such as transfer application processing. For example, in theembodiments such as those of FIG. 23 or 33, the substrate is shown toremain in its entirety as a component of the “tabbed cell stock” andfinal interconnected array. However, this is not a requirement. In otherembodiments, all or a portion of substrate may be removed prior to orafter a laminating process accomplishing positioning and attachment of“fingers” 84 and “busses” 86 to a conductive cell surface. In this case,a suitable release material (not shown) may be used to facilitateseparation of the conductive collector electrode structure from aremoved portion of substrate 70 during or following an application suchas the lamination process depicted in FIG. 21. Thus, in this case theremoved portion of substrate 70 would serve as a surrogate or temporarysupport to initially manufacture and transfer the grid or electrodestructure to the desired conductive surface. One example would be thatsituation where layer 72 of FIG. 7 would remain with the finalinterconnected array while layers 74 and/or 76 would be removed.

FIG. 34 embodies the combination of multiple portions of “tabbed cellstock” 130. In the FIG. 34 embodiment, an extension 134 a associatedwith a first unit of “tabbed cell stock” 130 a overlaps extension 136 bof an adjacent unit of “tabbed cell stock” 130 b. The same spatialarrangement exists between “tabbed cell stock” units 130 b and 130 c.The conductive surfaces associated with the mating extensions arepositioned and held in secure contact as a result of an adhesivematerial forming surface 80 b of the substrate 120 melting and fillingthe “buss” voided regions 126 as shown. The mating contact isadditionally secured by adhesive bonding produced by adhesive materialforming surface 80 b in originally exposed regions 127. These originallyexposed regions of substrate surface in the region of the mechanical andpressure induced electrical joining between adjacent units of “tabbedcell stock” are identified by the numeral 127 in the FIG. 34. It isclear that in the FIG. 34 embodiment a secure and robust serieselectrical connection is achieved between adjacent units of “tabbed cellstock” by virtue of the lamination process taught herein. It is furtherevident that no solder or conductive adhesives are required to achievethe electrical joining such as between extensions 134 a and 136 b shown.However, in some circumstances use of solders or conductive adhesivesmay be considered to increase the robustness or decrease resistance ofthe conductive joining.

Referring now to FIGS. 35 through 38, there are shown embodiments of astarting structure for another grid/interconnect article of theinvention. FIG. 35 is a top plan view of an article 198. Article 198comprises a polymeric film or glass sheet substrate generally identifiedby numeral 200. Substrate 200 has width X-198 and length Y-198. WidthX-198 is defined by terminal boundaries 104 a and 106 a. Length Y-198 issometimes much greater the width X-198 such that film 200 can beprocessed in essentially a “roll-to-roll” fashion. However, this is notnecessarily the case. Dimension “Y” can be chosen according to theapplication and process envisioned. FIG. 36 is a sectional view takensubstantially from the perspective of lines 36-36 of FIG. 35. Thicknessdimension Z-198 is normally small in comparison to dimensions Y-198 andX-198 and thus substrate 200 has a sheetlike structure and is oftenflexible. In the embodiment of FIG. 35, substrate 200 is furthercharacterized by having two joined regions joined along separating line201. Line 201 may be imaginary, or may represent change in structuresuch as a seam. A first region is identified as Wc, representing thewidth of a collection region. Region Wc is shown as a substantiallysolid structure. However, it is not required that the substrate ofregion Wc be totally solid and void-free as in the FIGS. 35-38embodiment. It is important that the substrate of region Wc besubstantially transparent, either because it is formed of intrinsicallytransparent material or its structure is “open” (like a mesh) to allowsubstantial transmission. The region identified as Wi, represents aninterconnection region. Region (Wi) has holes 202 extending through thethickness Z-200. Holes 202 of the embodiment represent discontinuitiesin the substrate 200 extending from the top side to bottom side. As suchthey constitute passageways or vias through the thickness Z-20. Theparticular structure of holes 202 can vary (e.g. round, rectangular,slit or slot-like). Holes 202 may be formed in a number of ways, such aspunching, drilling or forming the substrate around an object definingthe hole. Alternatively, holey region Wi may comprise a fabric joined toregion Wc along line 201, whereby the fabric structure comprisesthrough-holes. The reason for these distinctions and definitions willbecome clear in light of the following teachings.

Referring now to FIG. 36, substrate 200 has a first surface or side 210and second surface or side 212. The sectional view of substrate 200shown in FIG. 36 shows a single layer structure. This depiction issuitable for simplicity and clarity of presentation. Often, however,film 200 will comprise a laminate of multiple layers as depicted in FIG.37. In the FIG. 37 embodiment, substrate 200 is seen to comprisemultiple layers 204, 206, 208, etc. As previously taught herein, forexample in the discussion of substrate 70 of FIGS. 6 and 7, the multiplelayers may comprise inorganic or organic components such asthermoplastics, thermosets, or silicon containing glass-like layers. Thevarious layers are intended to supply functional attributes such asenvironmental barrier protection or adhesive characteristics. Inparticular, in light of the teachings herein, one will recognize that itmay be advantageous to have layer 204 forming surface 210 comprise anadhesive sealing material such as ethylene vinyl acetate (EVA),polyvinyl acetate, an ionomer, polyacrylics, an olefin based adhesive,atactic polyolefin, or a polymer containing polar functional groups foradhesive characteristics during a possible subsequent laminationprocess. For example, the invention has been successfully demonstratedusing a standard laminating material sold by GBC Corp., Northbrook,Ill., 60062. Additional layers 206, 208 etc. may comprise materialswhich assist in support or processing such as polypropylene,polyethylene terepthalate and polyethylene naphthalate (PEN), barriermaterials such as fluorinated polymers, biaxially oriented polypropylene(BOPP), poly(vinylidene chloride), such as Saran, a product of DowChemical, and Siox., and materials offering protection againstultraviolet radiation as previously taught in characterizing substrate70 of FIGS. 6 and 7.

As embodied in FIGS. 35 and 36, the regions Wc and “holey” regions Wi ofsubstrate 200 may comprise the same material. This is not necessarilythe case. For example, the “holey” regions Wi of substrate 200 couldcomprise a fabric, woven or non-woven, joined to an adjacent regionalong line 201. However, the materials or structure forming thesubstrate region Wc should be relatively transparent or translucent tovisible light, as will be understood in light of the teachings tofollow.

An example of such an alternate structure is embodied in FIGS. 35A and36A. There a structure 199 is formed by seaming two sheetlike materialforms 213 and 215. While a “butt” seam is shown in FIG. 36A, otherseaming techniques are appropriate such as a “lap” seam. Structure 199itself has an overall sheetlike form having oppositely facing surfaces210 a and 212 a. Material form 213 is transparent or translucent.Material form 215 is electrically conductive. Material form 215 maycomprise materials such as an electrically conductive polymer, a bulkmetal foil or mesh or a fabric comprising metal fibrils or metallizedpolymeric fibrils. Material form 215 may also comprise a conductiveadhesive, such as a conductive hot melt laminating adhesive, forming anexposed surface intended for ohmic electrical bonding to a matingconductive surface. It is important to note that the sheetlike structure199 has electrical conductivity through its thickness Z-199 from surface210 a to surface 212 a in the region Wi either because the bulk materialform 215 is conductive or through holes intrinsic in the structureinvolve conductive material extending through the thickness. While shownas single layers, it is understood that material forms 213 and 215 maycomprise multiple distinct layers.

FIG. 38 depicts an embodiment wherein multiple widths 200-1, 200-2 etc.of the general structure of FIGS. 35 and 36 are joined together in agenerally repetitive pattern in the width direction. Such a structureallows simultaneous production of multiple repeat structurescorresponding to widths 200-1, 200-2 in a fashion similar to that taughtin conjunction with the embodiments of FIGS. 6 through 15.

FIG. 39 is a plan view of the FIG. 35 substrate 200 following anadditional processing step, and FIG. 40 is a sectional view taken alongline 40-40 of FIG. 39. In FIGS. 39 and 40, the article is now designatedby the numeral 214 to reflect this additional processing. In FIGS. 39and 40, it is seen that a pattern of “fingers” or “lines” 216 has beenformed by material 218 positioned in a pattern onto surface 210 oforiginal sheetlike substrate 200. “Fingers” or “lines” 216 extend overthe width Wc of the sheetlike structure 214. The “fingers” 216 extend tothe “holey” interconnection region generally defined by Wi. Portions ofthe Wc region not overlayed by “fingers” 216 remain transparent ortranslucent to visible light. The “fingers” may comprise electricallyconductive material. Examples of such materials are metal containinginks, patterned deposited metals such as etched metal patterns, stampedmetal patterns, masked vacuum deposited metal patterns, fine wires,intrinsically conductive polymers and DER formulations. In otherembodiments the “fingers” may comprise materials intended to facilitatesubsequent deposition of conductive material in the pattern defined bythe fingers. An example of such a material would be ABS, catalyzed toconstitute a “seed” layer to initiate chemical “electroless” metaldeposition. Another example would be a material functioning to promoteadhesion of a subsequently applied conductive material to the substrate200. In a preferred embodiment, the “fingers” comprise material whichwill enhance or allow subsequent metal electrodeposition such as a DERor electrically conductive ink. In the embodiment of FIGS. 39 and 40,the “fingers” 216 are shown to be a single layer of material 218 forsimplicity of presentation. However, the “fingers” can comprise multiplelayers of differing materials chosen to support various functionalattributes as has previously been taught.

Continuing reference to FIGS. 39 and 40 also shows additional material220 applied to the “holey” region Wi of article 214. As with thematerial 218 comprising the “fingers” 216, the material 220 applied tothe region Wi is either conductive or material intended to facilitatesubsequent deposition of conductive material.

In an alternate embodiment, region Wi may comprise a fabric with thenatural “holes” in the fabric serving as the holes 202. Material 220would extend through the natural holes of the fabric. Further, such afabric may comprise fibrils formed from conductive materials such asmetals or conductive polymers. The conductive fibrils can be intermixedwith nonconductive fibrils to give a fabric combining metalliccharacteristics such as high conductivity with polymer characteristicssuch as flexibility and adhesive affinity to a mating conductive surfacesuch as the bottom surface of a photovoltaic cell. Moreover, a fabricstructure can be expected to increase and retain flexibility aftersubsequent processing such as metal electroplating and perhaps bondingability of the ultimate interconnected cells as will be understood inlight of the teachings contained hereafter.

In the embodiment of FIGS. 39 and 40, the “holey” region takes thegeneral form of a “buss” or “tab” 221 extending in the Y-214 directionin communication with the individual fingers. However, as one willunderstand through the subsequent teachings, the invention requires onlythat conductive communication extend from the fingers to a region Wiintended to be electrically joined to the bottom conductive surface ofan adjacent cell. The region Wi thus does not require overall electricalcontinuity in the “Y” direction as is characteristic of a “buss” formdepicted in FIGS. 39 and 40. However, as will be clear, a continuous“tab” or “buss” may serve as a convenient terminal bar for exteriorconnections when article 214 is used combined with an end cell of aninterconnected array.

Reference to FIG. 40 shows that the material 220 applied to the “holey”interconnection region Wi is shown as the same as that applied to formthe fingers 216. However, these materials 218 and 220 need not beidentical. It is understood that while the material extending oversurface 212 is shown in the figure to mirror structure on surface 210this need not be the case. The pattern of material positioned on surface212 may differ from that on surface 210 in dimensional structure and/orcomposition. In this embodiment material 220 applied to the “holey”region extends through holes 202 and onto the opposite second surface212 of article 214. The extension of material 220 through the holes 202can be readily accomplished as a result of the relatively smallthickness (Z dimension) of the sheetlike substrate 200. Techniquesinclude two sided printing of material 220, through hole sprayapplication, masked metallization or selective chemical deposition ormechanical means such as stapling, wire sewing or riveting.

FIG. 41 is a view similar to that of FIG. 40 following an additionaloptional processing step. The article embodied in FIG. 41 is designatedby numeral 226 to reflect this additional processing. It is seen in FIG.41 that the additional processing has deposited conductive material 222over the originally free surfaces of materials 218 and 220. Material 222normally comprises metal-based material such as copper or nickel, tin ora conductive metal containing paste or ink. Typical depositiontechniques such as printing, chemical or electrochemical metaldeposition and masked deposition can be used for this additionaloptional process to produce the article 226. In a preferred embodiment,electrodeposition is chosen for its speed, ease, and cost effectivenessas taught above. It is understood that articles 214 and 226 areembodiments of “interconnecting components”.

It is seen in FIG. 41 that highly conductive material 222 extendsthrough holes to electrically join and form electrically conductivesurfaces on opposite sides of article 226. It is understood that whilethe conductive material extending over surface 212 of region Wi is shownin the Figures to mirror structure on surface 210, this need not be thecase. The pattern of conductive material positioned on surface 212 maydiffer from that on surface 210 in dimension, structure and/orcomposition. While shown as a single layer in the FIG. 41 embodiment,the highly conductive material can comprise multiple layers to achievefunctional value. In particular, a layer of copper is often desirablefor its high conductivity. The exterior layer forming exposed surfaces229 of material 222 can be selected for corrosion resistance and bondingability. It is normally advantageous to form surface 229 with a materialcompatible with the conductive surface with which eventual contact ismade. In preferred embodiments, electroless deposition orelectrodeposition is used to form suitable metallic surfaces.Specifically electrodeposition offers a wide choice of potentiallysuitable materials to form the surface 229. Corrosion resistantmaterials such as nickel, chromium, tin, indium, silver, gold andplatinum are readily electrodeposited and may be chosen to form surface229. In particular, an exterior layer of nickel is often suitable forits adhesion characteristics, plateability and corrosion resistance.When compatible, of course, surfaces comprising metals such as copper orzinc or alloys of copper or zinc may be considered. Alternatively, thesurface 229 may comprise a conversion coating, such as a chromatecoating, of a material such as copper or zinc. Further, it may be highlyadvantageous to choose a material, such as a conductive adhesive ormetallic solder to form surface 229 which exhibits adhesive or alloybonding or wetting ability to a subsequently positioned abuttingconductive surface. In this regard, electrodeposition offers a widechoice of materials to form surface 229. In particular, indium, tin ortin containing alloys are a possible choice of material to form theexposed surface 229 of material 222. These metals melt at relatively lowtemperatures less than about 600 degree Fahrenheit, which may beachieved during subsequent processing. Thus these metals may bedesirable to promote ohmic joining, through soldering or simple wetting,to mating surfaces during subsequent processing such as plasticslamination. Alternatively, exposed surface 229 may comprise anelectrically conductive adhesive applied by printing orelectrodeposition. Selective deposition techniques such as brush platingor printing would allow conductive materials of region Wi to differ fromthose of fingers 216. In addition to supplying electrical communicationfrom surfaces 210 to 212, holes 202 also function to increaseflexibility of “buss” 221 by relieving the “sandwiching” effect ofcontinuous oppositely disposed layers. Holes 202 can clearly be theholes naturally present should substrate 200 in the region Wi be afabric.

One appreciates that in the embodiments of FIGS. 39 through 41electrical communication between oppositely facing surface regions 210and 212 is achieved using holes 202 which constitute vias for conductivematerial extending between oppositely facing surfaces 210 and 212 ofarticles 214/226. The holes shown in the embodiments are but one of anumber of different ways to achieve such communication. One alternatemeans of establishing such electrical communication was embodied inFIGS. 35A and 36A. There material 215 of region Wi of sheetlike article199 comprised an electrically conductive material extending betweensurfaces 210 a and 212 a. Material form 215 may comprise materials suchas an electrically conductive polymer, a bulk metal foil or a fabriccomprising metal fibrils.

FIG. 41A is a sectional view of the FIGS. 35A/36A embodiment followingan additional processing step positioning conductive material 222 a ontothe surface 210 a. Material 222 a may be applied using the techniquesfor materials 218/222 identified above. The FIG. 41A embodiment isidentified as 226 a to reflect this additional processing. Material 222a forms a conductive pattern such as lines or fingers 216 a extendingacross surface 210 a and overlapping a portion of material 215 in theregion Wi. Electrical communication may thereby be achieved between the“fingers”, the conductive material 215 of region Wi and consequentlythat portion of surface 212 a within region Wi. Thus in this embodimentthe conductive material 215 is substituted for the conductive material222 extending through the holes 202 of FIG. 41. Material 215 maycomprise multiple layers of conductive material. Material 215 may takemany different forms, such as layered or mesh. It should also beunderstood that lines 222 a and material 215 can comprise a commonmonolithic material forming portions of both 222 a and 215.

While shown as a single layer, finger 216 a may comprise multiplematerials and layers as has previously been discussed for the materiallines of FIGS. 39 through 41. Moreover one may formulate material 215 tocomprise an electrically conductive polymer having an adhesive affinityto the bottom surface of a photovoltaic cell. Such an adhesive affinitycould be conveniently activated by heat and/or pressure associated witha laminating process to electrically and physically join a conductiveportion of surface 212 a to the bottom surface 66 of a photovoltaiccell.

The material patterns represented by structure 218/222 and 222 a inFIGS. 39, 40-41A are often very delicate and may require a supportingsubstrate materials such as 200 or 213 to maintain integrity. However,certain forms of conductive material patterns that have at least limitedself supporting characteristic present additional possibilities forcollector/interconnect structures. An embodiment of an interconnectioncomponent comprising a self supporting conductive form is illustrated inFIGS. 39A and 41B. FIG. 39A is a top plan view of a structure 226 b andFIG. 41B is a sectional view along the lines 41B-41B of FIG. 39A.Structure 226 b has an overall sheetlike form comprising a combinationof a pattern of conductive material 222 b overlaying a reinforcing orcarrier structure 224. While shown as a single layer, it is understoodthat structure 224 can comprise multiple layers. Structure 224 isincluded to assist maintaining a substantially planar form of material222 b. The pattern of conductive material 222 b is in the form of awoven, expanded metal or etched foil mesh as is known in the art. Such astructure may exhibit limited self supporting integrity even though theindividual fibrils making up the mesh are themselves delicate andflimsy. As shown in FIGS. 39A and 41B, in the interconnect region Wi thematerial pattern 222 b extends past a terminal boundary 105 of structure224 and is self supporting. Thus in the region Wi, structure 226 b hasoppositely facing surfaces in electrical communication with each otherand the rest of the pattern.

The structures such as those embodied in FIGS. 39, 39A, 40, 41, 41A, and41B can be referred to as “interconnecting components” or “straps”.

One method of combining the interconnection component 226 embodied inFIG. 41 with a cell stock 10 as embodied in FIGS. 1A and 2A isillustrated in FIGS. 42 and 43. In the FIG. 43 structure,interconnecting components 226 are combined with cells 10 to produce aseries interconnected array. This may be accomplished via a processgenerally described as follows.

As embodied in FIG. 42, a unit of “interconnection component”, such as226 of FIG. 41, is combined with a cell such as 10 by positioning ofsurface region “Wc” of current collector stock 226 having free surface210 in registration with the light incident surface 59 of cell 10. Thegrid pattern of “fingers” or “lines” 216 extends over a preponderance ormajor portion of the light incident surface 59 of cell 10. The articleso produced, identified as 227, embodies a “tabbed” or “strapped” cellstock”. Adhesion joining the two surfaces is accomplished by a suitableprocess. In particular, the material forming the remaining free surface210 of article 226 (that portion of surface 210 not covered withconductive material 222) may be a sealing material chosen for adhesiveaffinity to surface 59 of cell 10 thereby promoting good adhesionbetween the collector stock 226 and cell surface 59 resulting from alaminating process. One such laminating process is that depicted in FIG.21. Such a laminating process brings the conductive material of fingers216 into firm and effective contact with surface 59 of cell 10. Thiscontact is ensured by the blanketing “hold down” afforded by theadhesive bonding adjacent the conductive fingers 216. One skilled in theart will further understand that the nature of a polymer support layersuch as may be represented by layer 206 of FIG. 37, may be important inensuring the integrity of the blanket “hold down”. This is because themechanical properties such as tensile modulus of the support layer willoften exceed that of the adhesive bonding layer. Therefore, the“blanket” is less susceptible to movement over time when exposed toenvironmental conditions such as thermal cycling. Specifically, inpreferred embodiments the polymer support or carrier layer may comprisematerials such as polyethylene terepthalate (PET), polyethylenenaphthalate (PEN), polypropylene, biaxially oriented polypropylene(BOPP), polycarbonate and acrylic polymers and fluorinated polymers.Also, as taught above, the nature of the free surface of conductivematerial 222 may optionally be manipulated and chosen to further enhanceohmic joining and adhesion.

Both batch or continuous laminating are suitable when combining a unitof “interconnection component” with a cell 10 to produce the “tabbedcell stock” or “strapped cell stock” 227. The invention has beendemonstrated using both roll laminators and batch vacuum laminators.Should the articles 226 and 10 be in a continuous form it will beunderstood that the combination article 227 could be formed continuouslyand possibly collected as a continuous “tabbed cell stock”.

Referring to FIGS. 42A and 42B, there is shown sectional views of thearticles of FIGS. 41A and 41B in combination with photovoltaic cells 10.These combined structures are designated as 227 a and 227 brespectively. The structures 227, 227 a, and 227 b of FIGS. 42, 42A and42B are similar in that in these cases a pattern of conductive material(222, 222 a, 222 b) extends over a predominance or major portion of thetop cell surface 59 and ohmic electrical communication exists betweenthe pattern and an exposed conductive surface suitable for attachment toa conductive surface of an adjacent cell or connector.

FIG. 43 is a sectional view showing multiple articles as in FIG. 42arranged in a series interconnected array. It is seen in FIG. 43 thatproper positioning allows the conductive material 222 extending over thesecond surface 212 of article 227-2 to be ohmicly adhered to the bottomsurface 66 of cell 10 a. This joining is accomplished by suitableelectrical joining techniques such as soldering, riveting, spot weldingor conductive adhesive application. The particular ohmic joiningtechnique embodied in FIG. 43 is through electrically conductiveadhesive 42. A particularly suitable conductive adhesive is onecomprising a carbon black filler in a polymer matrix possibly augmentedwith a more highly conductive metal filler. Such adhesive formulationsare relatively inexpensive and can be produced as hot melt formulations.Despite the fact that adhesive formulations employing carbon black alonehave relatively high intrinsic resistivities (of the order 1 ohm-cm),the bonding in this embodiment is accomplished through a relatively thinadhesive layer and over a broad surface. Thus the resulting resistancelosses are relatively limited. A hot melt conductive adhesive is verysuitable for establishing the ohmic connection using a straightforwardlamination process. A hot melt conductive adhesive melts to activateadhesive characteristics during the lamination process and firmly joinsthe conductive surfaces upon cooling. An additional attractive aspect ofusing conductive adhesives to ohmically join the cell bottom surface tothe conductive material 222 extending over the surface 212 is that sucha connection requires no soldering. Thus a wide variety of choices areavailable for the conductive material 222 and its corresponding surface.For example, corrosion resistant materials such as nickel or chromiummay be considered without regard to their “solderability”. Further,chemical conversion coatings such as “chromate” coatings may beconsidered.

One also notes that the unit of collector/interconnection stock, or“strap”, also accomplishes a mechanical function of holding two adjacentcells in proper and robust relative position. This can be a substantialadvantage compared to fragile prior art cell “strings”.

FIG. 43 embodies multiple cells assembled in a series arrangement usingthe teachings of the instant invention. In FIG. 43, “i” indicates thedirection of net current flow and “hv” indicates the light incidence forthe arrangement. It is noted that the arrangement of FIG. 43 resembles ashingling arrangement of cells, but with an important distinction. Theprior art shingling arrangements have included an overlapping of cellsat a sacrifice of portions of very valuable cell surface. In the FIG. 43teaching, the benefits of the shingling interconnection concept areachieved without any loss of photovoltaic surface from shading by anoverlapping cell. In addition, the FIG. 43 arrangement retains a highdegree of flexibility because there is no immediate overlap of the metalfoil cell substrate.

FIG. 43A embodies a module employing the tabbed cells 227 a of FIG. 42A.Structure 227 a combines a cell 10 with an interconnection structure 226a of FIG. 41A. Tabbed cells 227 a-1, 227 a-2, etc. are connected inseries by ohmically and mechanically joining adjacent cells by adheringa surface of conductive material form 215 of a first tabbed cell 227 a-2to a bottom conductive cell surface 66 of an adjacent tabbed cell 227a-1. In the FIG. 43A embodiment, the conductive joining is achievedusing conductive adhesive 42. Conductive adhesive 42 may be separatelyapplied just prior to placing the adjacent cells in relative positionand set following the positioning. Alternatively, adhesive 42 may be a“laminating” adhesive forming the free surface 212 a of material form215. In that case, the laminating adhesive is caused to melt andactivate during the juxtaposition of the adjacent cells, thereby causingmaterial form 215 to adhere to the bottom conductive surface 66 of theadjacent cell as shown in the FIG. 43A.

Referring now to FIG. 43B, there is shown an embodiment of a moduleemploying the tabbed cells 227 b of FIG. 42B. In this case the mesh oretched foil has a free surface region (Wi) which may be attached to thebottom surface 66 of a cell 10 as shown. As in the embodiments of FIGS.43 and 43A above, the conductive joining between strapped cells is shownusing a conductive adhesive 42. As with the embodiments of FIGS. 43 and43A, alternate electrical joining techniques such as soldering,riveting, spot welding may be considered.

Referring now to FIG. 43C, there is shown an alternate way of assemblingstrapped cells 227 of FIG. 42 into an interconnected array. As shown inFIG. 43C the interconnections among cells may be made without using aconductive adhesive 42 shown in FIG. 43. However, conductive adhesivemay be employed if desirable in the FIG. 43C arrangement. In FIG. 43C,there is shown a substrate identified by numeral 211. Substrate 211 maycomprise one or more layers. A first of the layers is a polymericadhesive 205. During a lamination process, adhesive 205 flows into holes202 to contact the bottom surface 66 of cells 10. In addition, adhesive205 flows over the originally exposed surfaces of cell bottom 66 tosecurely attach the cells in position to the substrate. The adhesivecontacting in the holes and at the strap edges (shown at 217) ensureselectrical contact of the strap of a first cell to the bottom conductivesurface of an adjacent cell. Thus the underlying substrate 211 extendsunder multiple cells and functions to “laminate” the conductive contactsand secure the multiple cells in proper position. FIG. 43C also showssubstrate 211 may further comprise an additional layer 209. While shownas a single layer, structure 209 may comprise multiple layers. Layer 209may comprise a rigid material such as wood, glass or metal or rigidplastic. Layer 209 may comprise a flexible material layer such as astructural polymeric film layer or metal foil barrier layer. Substrate211 can be transparent or opaque. In addition to its interconnectingfunction, substrate 211 can serve multiple additional functions such asa barrier and supporting member.

FIG. 43D is yet another embodiment of a multi-cell module according tothe inventive concepts taught herein. FIG. 43D shows interconnection ofthe strapped cells 227 b according to the FIG. 42B embodiment. In theFIG. 43D structure, the conductive material extending past terminalboundary 105 of structure 224 is electrically connected to an adjacentcell. However, compared to the FIG. 43B, conductive adhesive 42 is notshown in FIG. 43D. Rather, underlying substrate 21 la extends undermultiple cells and functions to “laminate” the conductive contacts andsecure cells in adjacent positioning. Specifically, polymeric adhesive205 a is forced through the holes in mesh structure 222 b in theportions extending past boundary 105 and forming interconnect region Wi.This adhesive penetration and resulting bonding to the bottom surfaces66 ensures a laminated electrical interconnection between the strappedcells. In a manner similar to that of FIG. 43C, an additional layer 209a is shown in the FIG. 43D embodiment. While shown as a single layer,structure 209 a may comprise multiple layers. Layer 209 a may be rigidor flexible, transparent or opaque and can serve multiple complimentaryfunctions such as barrier and structural support. Layer 209 a maycomprise a rigid material such as wood, glass or metal or rigid plastic.Layer 209 may comprise a flexible material layer such as a structuralpolymeric film layer or metal foil barrier layer.

Yet another form of the instant invention is embodied in FIGS. 44through 56. FIG. 44 is a top plan view of a substrate article designated230. Article 230 has width “X-230” and length “Y-230”. Width X-230 isdefined by terminal boundaries 104 b and 106 b. It is contemplated that“Y-230” may be considerably greater than “X-230” such that article 230may be processed in continuous roll-to-roll fashion. However, suchcontinuous processing is not a requirement.

FIG. 45 is a sectional view taken substantially from the perspective oflines 45-45 of FIG. 44. It is shown in FIG. 45 that substrate article230 may comprise any number of material layers such as those designatedby numerals 232, 234, 236. The layers are intended to supply functionalattributes to substrate article 230 as has been discussed for priorembodiments, for example in FIG. 7. Article 230 is also shown to havethickness “Z-230”. “Z-230” is much smaller than “X-230” or “Y-230” andthus article 230 can generally be characterized as being flexible andsheetlike. Article 230 is shown to have exterior surface 238 andopposite exterior surface 240. As will become clear in subsequentembodiments, it may be advantageous to form layer 232 forming surface238 using a material having adhesive affinity to the bottom surface 66of cell 10. As will be discussed below, regions of surface 238 mayunderlie and be adhesively bonded directly to a bottom surface 66 of aphotovoltaic cell. Such surface regions may be formed of eitherinsulating or conductive adhesive material, the choice depending on anumber of considerations. A conductive adhesive for the material oflayer 232 may be advantageous to improve overall contact to the bottomsurface 66 of cell 10, as will be understood by the skilled artisan inlight of teachings to follow. On the other hand, insulating polymericmaterials offer a far wider choice of material and processing optionsand are normally less expensive than conductive adhesives. Specifically,laminating adhesives are normally relatively solid at room temperatureyet quickly activate (soften and readily flow) at laminatingtemperatures. This processing characteristic may be impeded by a heavyloading of conductive filler normally associated with conductiveadhesives. Layer 232 is shown in FIG. 45 to form the complete expanse ofupper surface 238 of substrate article 230. This is not always the caseas will be shown in subsequent embodiments.

Continuing attention to FIGS. 44 and 45, it may be advantageous to havesurface 240 formed by a material having adhesive affinity to surface 59of cell 10. Thus layer 236 will often comprise a polymeric adhesive andtypically be electrically insulating because of transparencyrequirements. However, transparent electrically conductive layers formedby metal oxides or transparent conductive polymers may be considered forlayer 236 forming surface 240. As with layer 232, layer 236 does nothave to form the complete lower expanse of article 230. The materialsforming surfaces 238 and 240 may be the same or be different. As hasbeen previously described, layer 234 may comprise a structural polymerlayer such as polypropylene, polyethylene terepthalate (PET),polyethylene naphthalate (PEN), acrylic or polycarbonate.

Many alternate embodiments for substrate articles exist. For example,FIG. 46 is an alternate sectional embodiment depicting a substratearticle 230 a. The layers forming article 230 a do not necessarily haveto extend over the entire expanse of article 230 a. In FIG. 46, only aportion of the upward facing surface (in the drawing perspective) 238 aof article 230 a is formed by material layer 232 a. Another portion ofsurface 238 a is formed by material layer 234 a. Similarly only aportion of the downward facing surface 240 a is formed by material layer236 a. Another portion of the downward facing surface 240 a is formed bymaterial layer 234 a. If material layer 236 a eventually is positionedto overlay the light incident surface 59 of a photovoltaic cell it willbe transparent or translucent. In addition, it may be advantageous tochoose material 236 a to have adhesive affinity to the top surface 59 ofa photovoltaic cell 10. Material 232 a is eventually positioned tocontact the bottom surface 66 of a photovoltaic cell 10. Thus, it may beadvantageous to choose material 232 a to have adhesive affinity to thebottom surface 66 of a photovoltaic cell 10. One also understands thatmaterial 232 a need not necessarily be transparent or translucent sinceit is overlayed by the cell. In some embodiments materials 232 a and 236a may be different or in other embodiments they may be the same.Furthermore, the thickness of materials 232 a and 236 a may differ.

In some embodiments the substrate articles “230” will comprise a commoninsulating carrier or support layer extending over the full width andlength of the article. See, for example, layer 234 a of FIG. 46. Such acommon layer is often present to facilitate handling and processing andto support the various functional layers associated with the article.However, it is noted that such a common layer is not necessary forpractice of the invention. Articles “230” comprising a patchwork ofdiffering sheetlike portions may be employed. Further, one willappreciate in light of the teachings to follow that articles “230” maycomprise multiple, discrete and separated sheetlike portions joined in away to maintain the spatial arrangement of the discrete portions.

An example of another alternate embodiment is depicted in FIG. 46A. FIG.46A is a sectional view showing a sheetlike substrate article 230 bhaving an arrangement of multiple portions. A first portion ischaracterized as having the downward facing substrate surface 240 bformed from a transparent or translucent material 236 b having adhesiveaffinity for the top surface 59 of photovoltaic cell 10. A secondportion has the upward facing surface 238 b formed by a material 232 bhaving adhesive affinity to the bottom surface 66 of cell 10. Theindividual portions each may have optional carrier or support layers(231,233) to facilitate processing and possibly support functionallayers. The carrier or support layers (231,233) are normally structuralpolymeric materials such as polyethylene, polypropylene, polyethyleneterepthalate (PET), polyethylene naphthalate (PEN), acrylic orpolycarbonate or fluorinated polymers. After a seaming operation joinsthe portions together as shown, the overall article 230 b assumes asubstantially planar sheetlike form. One notes that surface topographyfeatures of the drawings are exaggerated for clarity. Seaming may beaccomplished by any number of known techniques such as laminatingoverlapping regions, stitching and adhesive bonding. A common feature ofsuch articles “230” is that they have a portion of their upward facingsurface “238” (in the drawing perspective) comprising a material havingadhesive affinity for a bottom surface of a photovoltaic cell and aportion of their downward facing surface “240” comprising a materialhaving adhesive affinity for a top light incident surface of aphotovoltaic cell.

Another embodiment of the substrate articles “230” is illustrated inFIGS. 46C and 46D. There an article 230 c is embodied which comprisesthree distinct portions patched together into a sheetlike form. A firstmaterial form 245 is transparent or translucent. Portions of surface 240c formed by material form 245 have adhesive affinity for the uppersurface 59 of photovoltaic cells. Material form 246 forms a portion ofupper surface 238 c having adhesive affinity for the bottom surfaced 66of a photovoltaic cell. Material forms 245 and 246 are positioned andjoined together using conductive material 215 a. Material 215 a maycomprise a conductive polymer, a bulk metal foil, a metal mesh or fabriccomprising metal fibrils and the like. Material 215 a supplies aconductive communication between surfaces 240 c and 238 c. While shownas single layers, it is understood that material forms 245, 215 a, and246 may comprise multiple materials and layers.

Another embodiment of the substrate articles “230” is depicted in FIG.46F. In this top plan view an embodiment comprising two sheetlikeportions 247 and 248 is shown in relative position with a gap separatingthem. While not shown in FIG. 46F, portion 247 has a surface 240 d whichhas adhesive affinity to a top surface 59 of a photovoltaic cell.Portion 248 has an oppositely facing surface 238 d having adhesiveaffinity to the bottom surface 66 of a photovoltaic cell.

Terminal boundaries defining the width dimension of the varioussubstrate articles “230” embodied in the FIGS. 44 through 46F aredesignated as 104 and 106 with an additional letter designation for theparticular embodiment.

FIG. 47 is a simplified sectional view of the substrate articles “230”which will be used to simplify presentation of teachings to follow.While FIG. 47 presents articles 230 as a single layer, it is emphasizedthat in the teachings to follow articles 230 may comprise any number oflayers and structural portions as taught above. One will readilyunderstand the application of the inventive concepts to follow whenusing the various article embodiments 230 through 230 d of the priorFigures. A common feature of all such articles “230” is that they havean upward facing surface 238 at least a portion of which is formed by amaterial having adhesive affinity for a bottom surface of a photovoltaiccell. The adhesive material forming that portion of surface 238 may beconductive or insulating. Further, a downward facing surface 240 atleast a portion of which is formed by a material having adhesiveaffinity for a top light incident surface of a photovoltaic cell. Thematerials forming these adhesive surfaces may be the same or different.

FIG. 48 is a top plan view of the initial article 230 following anadditional processing step. The article embodied in FIG. 48 isdesignated 244 to reflect this additional processing step. FIG. 49 is asectional view taken substantially from the perspective of lines 49-49of FIG. 48. Reference to FIGS. 48 and 49 show that the additionalprocessing has produced holes 242 in the direction of length “Y-244”.The holes extend from the surface 238 to the surface 240 of article 244.Holes 242 may be produced by any number of techniques such as laserdrilling or simple punching.

FIG. 50 is a top plan view of the article 244 following an additionalprocessing step. The article of FIG. 50 is designated 250 to reflectthis additional processing. FIG. 51 is a sectional view takensubstantially from the perspective of lines 51-51 of FIG. 50. Referenceto FIGS. 50 and 51 shows that material 251 has been applied to thesurface 238 in the form of a pattern of “fingers” or extending lines252. Further, material 253 has been applied to surface 240 in the formof a pattern of “fingers” 254. In the embodiment, “fingers” 252 and 254extend in the “X-250” width dimension, substantially perpendicular to a“buss-like” structure 256 extending in the length direction “Y-250”. Asseen in FIG. 51, additional materials 251 and 253 extend through theholes 242. In the FIG. 51 embodiment, materials 251 and 253 are shown asbeing the same. This is not necessarily a requirement and they may bedifferent. Also, in the embodiment of FIGS. 50 and 51, the buss-likestructure 256 is shown as being formed by materials 251/253. This is notnecessarily a requirement. Materials forming the “fingers” 252 and 254and “buss” 256 may all be the same or they may differ in actualcomposition and be applied separately. Alternatively, fingers and bussesmay comprise a continuous material structure forming portions of bothfingers and busses. Fingers and busses need not both be present incertain embodiments of the invention.

As in prior embodiments, “fingers” 252 and 254 and “buss” 256 maycomprise electrically conductive material. Examples of such materialsare metal wires and metal foils, conductive metal containing inks andpastes, patterned metals such as etched or punched metal patterns ormasked vacuum deposited metals, intrinsically conductive polymers,conductive inks and DER formulations. In a preferred embodiment, the“fingers and “busses” comprise material such as DER or an electricallyconductive ink such as silver containing ink which will enhance or allowsubsequent metal electrodeposition. “Fingers” 252 and 254 and “buss” 256may also comprise non-conductive material which would assistaccomplishing a subsequent deposition of conductive material in thepattern defined by the “fingers” and “busses”. For example, “fingers”252 and 254 or “buss” 256 could comprise a polymer which may be seededto catalyze chemical deposition of a metal in a subsequent step. Anexample of such a material is ABS. “Fingers” 252 and 254 and “buss” 256may also comprise materials selected to promote adhesion of asubsequently applied conductive material.

FIG. 52 is a sectional view showing the unit article 250 following anadditional optional processing step. The article of FIG. 52 isdesignated 260 to reflect this additional processing. In a fashion likethat described above for production of prior embodiments of currentcollector and interconnect structures, additional conductive material266 has been deposited by optional processing to produce the article 260of FIG. 52. The discussion involving processing to produce the articlesof FIGS. 12-15, 20, 31, and 41 is proper to describe the additionalprocessing to produce the article 260 of FIG. 52. In a preferredembodiment, conductive material 266 may comprise material applied byelectrodeposition. In addition, while shown in FIG. 52 as a singlecontinuous, monolithic layer, the additional conductive material maycomprise multiple layers and materials. As in prior embodiments, it maybe advantageous to use a material such as a low melting point alloy orconductive adhesive to form exterior surfaces of additional conductivematerial 266. Additional conductive material overlaying “fingers” 252need not be the same as the additional conductive material overlaying“fingers” 254.

In the embodiments of FIGS. 50 through 52 electrical communicationbetween conductive patterns on oppositely facing surfaces 238 and 240 isachieved using holes 242 which constitute vias for conductive materialextending between oppositely facing surface 238 and 240 of articles250/260. One will appreciate that the holes shown in the embodiments ofFIGS. 50-52 are but one of a number of different ways to achieve suchcommunication.

The embodiments of FIGS. 50 through 52 show a structure of “fingers” and“busses”. Other geometrical forms and patterns are clearly possible.This is especially the case when considering structure for contactingthe rear or bottom surface 66 of a photovoltaic cell 10. One embodimentof an alternate structure is depicted in FIGS. 53 and 54. FIG. 53 is atop plan view while FIG. 54 is a sectional view taken substantially fromthe perspective of lines 54-54 of FIG. 53. In FIGS. 53 and 54, there isdepicted an article 275 analogous to article 250 of FIG. 50. The article275 in FIGS. 53 and 54 comprises “fingers” 280 similar to “fingers” 254of the FIG. 50 embodiment. However, the pattern of material 251 aforming the structure on the surface 238 a of article 275 isconsiderably different than the “fingers” 252 and “buss” 256 of the FIG.50 embodiment. In FIG. 53, material 251 a has a mesh-like pattern havingvoids 276 leaving multiple regions of surface 238 a exposed. Laminationof such a structure may result in improved surface area contact of thepattern compared to the finger structure of FIG. 50. It is emphasizedthat since surface 238 a of article 275 eventually contacts rear surface66 of the photovoltaic cell, potential shading is not an issue and thusgeometrical design of the exposed contacting surfaces 238 a relative tothe mating conductive surfaces 66 can be optimized without considerationto shading issues. Many various alternate patterns can be considered forpositioning on a surface such as 238 a. For example, patterns can beformed by arranging wires, patterning foils or deposition of metals andconductive inks onto the surface.

An alternate means of providing electrical communication betweenconductive patterns extending over oppositely facing surfaces of asheetlike substrate is depicted in FIG. 46B. In FIG. 46B, the article ofFIG. 46A is modified with additional structure. In FIG. 46B a metal formsuch as a wire, ribbon or metal foil stamping 266 a extends over surface238 b, through the substrate where portions of the substrate are seamedor overlap and further over surface 240 b. The metal wires, ribbons, orstampings may be mechanically or adhesively attached to the respectivesurfaces by partially embedding the wire, ribbon or stamping into thesurfaces. Vias for conductive material are the natural holes 242 aformed by the wire penetrating through the substrate.

FIG. 46E embodies an alternate arrangement. FIG. 46E shows additionalconductive structure 266 b and 266 c extending over opposite faces ofsheetlike substrate 230 c of FIG. 46C FIG. 46D. In FIG. 46E the articleis identified as 260 b to reflect this additional structure. Aspreviously described, material 215 a in region Wi of sheetlike article260 b comprises an electrically conductive material extending betweensurfaces 240 c and 238 c. Material form 215 a may comprise materialssuch as an electrically conductive polymer, a bulk metal foil or afabric comprising metal fibrils. In the FIG. 46E embodiment, additionalconductive material 266 b and 266 c forms conductive lines or fingersextending over surface 240 c in material region 245 and surface 238 c ofmaterial region 246 respectively. The conductive lines or fingers onopposite surfaces of article 260 b overlap and contact material 215 a tothereby establish electrical communication between the conductive linepatterns on opposing surfaces of the article 260 b. Thus in thisembodiment the conductive material 215 a is substituted for theconductive material extending through the holes 242 of FIG. 52. Whileshown as a single layer, material form 266 b may comprise multiplematerials and layers as has previously been discussed for such lines.

FIGS. 46G and 46H embody a modification to the structure of FIG. 46F.The new modified structure is identified as 260 c. In the FIGS. 46G and46H, it is seen that portions 247 and 248 have been joined and fixed inrelative spatial position with a gap between them using metal wires,ribbons, mesh or a metallized fabric 266 c spanning the gap between thetwo portions. The composite substrate combining portions 247 and 248thus maintains an overall sheetlike form. In addition, the wires extendover a surface 238 d of portion 248 and also surface 240 d of portion247. As previously indicated, surface 238 d of portion 248 would haveadhesive affinity for a bottom surface of a photovoltaic cell andsurface 240 d of portion 247 would have adhesive affinity to a topsurface 59 of a photovoltaic cell. The metal wires or ribbons could bemechanically attached to the respective surfaces by partially embeddingthe wires or ribbons into the surfaces. This attachment may be enhancedby adhesive characteristics of the material forming the surface itself.Alternatively attachment of the wires to the surfaces by first coatingwith a conductive adhesive may be considered.

The alternate structural embodiments “260” of FIGS. 46B, 46E, 46H and 52may be characterized as “interconnection components”. Inspection of theembodiments reveals some important common characteristics for such“interconnection components”:

-   -   A sheetlike substrate having oppositely facing upward and        downward facing sides.    -   At least a portion of the substrate is formed by transparent or        translucent material such that the portion is transparent or        translucent through its thickness.    -   The articles all have a portion of their downward facing side        formed by a polymeric adhesive and further have an electrically        conductive pattern positioned on the downward facing side.    -   The articles all have a portion of their upward facing side        formed by a polymeric adhesive and further having an        electrically conductive pattern positioned on the upward facing        surface.    -   The articles all have electrical communication between the        conductive patterns positioned on the upward facing and downward        facing sides.

In many cases the articles “260” will also comprise a flexiblemultilayered laminating sheet comprising a structural polymer layersupporting an adhesive layer. Materials suitable for the structuralpolymer layer include materials such as polyethylene terepthalate (PET),polyethylene naphthalate (PEN), polypropylene, biaxially orientedpolypropylene (BOPP), polycarbonate and acrylic polymers. Further, inmany cases the articles “260” will have a length much greater than widthand therefore may be characterized as continuous and be suitable forcontinuous processing.

The sectional views of FIGS. 55 and 56 embody the use of unit articles250 or 260 to achieve a series connected structural array ofphotovoltaic cells 10. In FIG. 55, an article designated as 270 has beenformed by combining article 260 with cell 10 by laminating the surface240 of article 260 to the top conductive surface 59 of cell 10. The gridpattern of “fingers” or “lines” 254 extends over a preponderance of thelight incident surface 59 of cell 10. In a preferred embodiment,portions of exposed surface 240 (regions not covered with “fingers” 254)are formed by a material having adhesive affinity to surface 59 and asecure and extensive adhesive bond forms between surfaces 240 and 59during the heat and pressure exposure of the lamination process. Thus anadhesive “blanket” holds conductive material 266 of “fingers” 254 insecure electrical and physical contact with surface 59. One skilled inthe art will further understand that the nature of the structuralpolymer support layer such as may be represented by layer 234 of FIG. 45may be important in ensuring the integrity of the blanket “hold down”.This is because the mechanical properties such as tensile modulus of thestructural support layer will often exceed that of the adhesive bondinglayer. Therefore, when the support layer is present, the “blanket” isless susceptible to movement over time when exposed to environmentalconditions such as thermal cycling. For similar reasons, it may beadvantageous to reduce the thickness of the adhesive layer between thestructural polymer and mating surface such as 59 of cell 10. Aspreviously pointed out, low melting point alloys or conductive adhesivesmay also be considered to enhance the contact of the conductive patternsto the mating surfaces.

It is understood that article 270 of FIG. 55 is yet another embodimentof a “tabbed” or “strapped” cell stock. One clearly appreciates that thearticle 270 has readily accessible surfaces of opposite cell polarity.Surface 66 is readily accessible as seen. Conductive material 266contacts top cell surface 59 and extends to form an accessible surfaceremoved from the cell. Thus, the performance characteristics of the“tabbed cell” can be readily determined. This allows immediate andfacile identification of cell performance characteristics, sorting ofcell material according to performance and removal of defective cellmaterial prior to assembly into a multi-cell module.

An additional feature of the “interconnection components” 260 embodiedin FIGS. 46B, 46E, 46H and 52 is the extending portion comprisingconductive material positioned on upward facing surfaces 238. Choosingmaterial forming surface 238 to have adhesive affinity to the bottomsurface 66 of a photovoltaic cell allows electrical connection to beachieved during lamination of surface 238 to bottom surface 66 of cells10 and also results in a secure spatial positioning of the multiplecells. The sectional view of FIG. 56 illustrates these features. Regionsof surface 238 remaining uncovered by conductive material directlycontact and adhesively bond to the bottom surface 66 of cell 10 therebyblanketing the conductive material to hold it in secure electrical andphysical contact with the bottom surface of cell 10.

FIG. 56 embodies multiple articles 270 arranged in a seriesinterconnected array. The series connected array is designated bynumeral 290 in FIG. 56. In the FIG. 56 embodiment, it is seen that“fingers” 252 positioned on surface 238 b of article 270 b have beenbrought into contact with the bottom surface 66 of cell 10 associatedwith article 270 a. This contact is achieved by choosing materialforming free surface 238 b of article 270 b to have adhesive affinityfor bottom conductive surface 66 of cell 10 of article 270 a. Secureadhesive bonding is achieved during the heat and pressure exposure of alaminating process thereby resulting in a hold down of the “fingers” 252in contact with surface 66.

With most embodiments, the portion of upper surface 238 of substrate 230that underlies the adjacent cell comprises a continuous adhesive layer.The pattern of conductive material (e.g. fingers 252) is positioned onthis adhesive layer to allow the adhesive blanketing and laminatedcontact discussed elsewhere in this specification. The adhesive bondingin those regions not covered by the conductive material pattern alsosecurely maintains the cells in proper relative spatial position.Another aspect of the FIG. 56 embodiment is an extension of substrates230, (shown as “E-230 c” for substrate 230 c in the FIG. 56). In otherwords, a “100 percent portion” of the bottom cell surface is covered bythe upward facing surface 238 of the interconnection componentsubstrate. While not necessary for the electrical and mechanical cellassembly, these extensions achieve a complete plastic encapsulation ofthe individual cells and contribute additional robustness to the array.

It may be important to realize that contact between the conductivesurfaces of the article 260 and the photovoltaic cells is achieved viapressure exerted by the “blanketing effect” of adhesive layers ofarticle 260 contacting the corresponding photovoltaic cell surface. Itis important to understand that these contacts may be achieved withoutthe use of solders or conductive adhesives.

Thus, it is seen that with the FIG. 56 structure the current collectionand electrical communication may achieved employing a continuous,monolithic conductive structure extending over the top surface of onecell and the bottom or rear surface of an adjacent cell. This structureminimizes the number of electrical connections and contacts required toachieve the connection. Since electrical contacts may be subject todeterioration over the expected life of the module, the FIG. 56structure increases reliability. Further, one readily appreciates thatno solder or electrically conductive adhesives are required to achievethe current collection and interconnecting contacts associated with theFIG. 56 structure. This avoids potential degradation of contactssometimes experienced when using conductive adhesives or solders. Onerealizes that a similar elimination or reduced use of solder orconductive adhesives is associated with many of the prior embodiments ofthe instant invention. However, as discussed above one may choose toemploy low melting point solders or conductive adhesives at theelectrical contacting surfaces if appropriate to enhance or furtherensure contact.

In addition, the FIG. 56 embodiment clearly shows an advantageous“shingling” type structure but which minimizes shielding of valuablephotovoltaic cell surface. As seen, the only light shielding of thephotovoltaic cells is from the lines 254. No overlapping of cells isrequired, as has been the case for “legacy” shingled arrangements.Furthermore, the FIG. 56 structural arrangement requires no separation,in a direction parallel to the cell surface, among adjacent cells. Thiscontrasts with prior art “string and tab” approaches which employ such aseparation for positioning of tabs and short prevention.

While not a requirement, it is seen that the structural embodiment ofFIG. 56 includes complete encapsulation of cells 10. This is achieved byhaving article 260 be of sufficient width dimension (X-250) to exceedthe combined span of two adjacent cells. Surface 240 of a first article270 extends slightly past a terminal edge of a first cell and surface238 extends sufficiently to complete encapsulation of the cells asshown.

The sectional view of FIG. 56 suggests sharp and abrupt variations insurface topography when traversing right to left from cell-to-cell.These variations are a result of the drawing format only and do notrepresent the actual surface variations of the article. Indeed,variations in surface topography of actual articles are slight whenconsidering the horizontal distances over which they occur. This is aresult of the relatively small thickness dimensions (dimension “Z” inthe various drawing embodiments) characteristic of both theinterconnecting substrate structure and the thin film photovoltaic cellstaught herein. Indeed, the actual surface topography of the embodimentssuch as that of FIG. 56 may in practice be characterized assubstantially planar.

A “substantially planar” surface topography with smooth undulations isimportant. First, efforts to overlay integrated modular cell arrays withflexible barrier films normally demand a substantially planar surfaceupon which to laminate the barrier film. The importance of surfaceplanarization prior to application of barrier films is discussed in U.S.patent application Ser. No. 12/372,720, the entire contents of which arehereby incorporated by this reference. It is readily appreciated thatthe upper and lower surfaces of the modular arrays as depicted in FIG.56 are formed by smooth polymeric films forming a structure having verylow aspect ratio (depth to width ratio) and wherein the seams betweenthe units are smoothed by the pressures and material flow during thelamination step. Thus requirements for thick intermediary“planarization” layers between the modular arrays taught herein, (suchas that of FIG. 56), and overlaying functional layers are reduced.Furthermore, material defects are avoided during a subsequent laminationof the flexible barrier film.

A second significant advantage of the structure embodied in FIG. 56 isthat the substantially planar upper and lower surfaces require only aminimum thickness of intermediary material, such as an adhesive orsealing layer, to achieve the planarization associated with firmly anduniformly laminating the structure to additional material sheets such asglass or barrier film. Typical thicknesses for intermediary adhesive orsealing materials required for the structure embodied in FIG. 56 areless than 250 micrometer. Thick intermediary materials (typicallythicker than 250 micrometers) required for higher aspect ratio structuresuch as “string and tab” arrangements can be avoided. This leads toreduced material cost. Moreover, more efficient processing optionsbecome available. Specifically, thinning of the intermediary sealinglayer allows for better thermal management (faster heat up/cool downtimes using less heat) and wider processing options such as rolllamination. Also, the thin flexible structures such as embodied in FIGS.24, 34, 43, 56 and the like allow along with the reduced sealingmaterial requirements allow unique modular construction andmanufacturing options as will be explained herein below.

Further, one notes that the structure of the integrated array of FIG. 56remains highly flexible. This permits the array to be further processedusing techniques, such as roll lamination, which operate best when oneof the material feed streams is flexible. For example a process of rolllamination of the FIG. 56 structure to a glass support/barrier sheet isdepicted in FIG. 66 and more thoroughly discussed below. There the glassmay be fed as a rigid member while the FIG. 56 structure andintermediary adhesive are fed as flexible layers to the nip of a rolllaminator.

Finally, one notes that the FIG. 56 structure involves securepositioning of multiple cells in the modular array by a very robust andwell attached laminated interconnect structure. The robust cellattachment and seaming of the films associated with adjacent cellsensures that the permanent positioning and interconnection is maintaineddespite manipulations and handling associated with subsequentprocessing. This permits major expansion of design and form factorchoices for final modules of the instant invention. In comparison, priorto final lamination, series connected cell “strings” of the prior artare flimsy and prone to damage.

One also will appreciate that using the conductive pattern of linesjoined by a connecting line of material 128 as shown in FIG. 29 allowsfor substantial redundancy in current collection and contact. Should anyof the lines become electrically disabled alternate electrical paths arereadily available to accomplish the necessary current transport andcontacts.

Turning now to FIGS. 57 and 58 there is shown there a valuable featureof the modular arrays as depicted in FIG. 56. FIG. 57 is a top plan viewof a structural arrangement as depicted in FIG. 56 but with somestructural portions removed for clarity of explanation of a feature ofthe invention. FIG. 58 is a sectional view taken substantially from theperspective of lines 58-58 of FIG. 57. In FIG. 57, a pair of cells 10-1and 10-2 are shown positioned adjacent each other in series electricalarrangement as embodied in FIG. 56. In the embodiments of FIGS. 57 and58, one sees that a portion 257 of the “buss” 256 associated with thepair of cells may be designed to extend outside the area occupied by theadjacently paired cells.

The sectional view of FIG. 58 is taken thru that portion 257. Referenceto FIG. 58 shows that one may access the buss 256 positioned betweenadjacent cells. This is achieved by omission of a small portion of asupporting substrate 230 in the portion 257 as shown. One will thereforeunderstand that electrical connections between two consecutive bussextensions can be used to determine the electrical characteristics ofindividual cells after assembly into the module format. Furthermore, theelectrical connections between buss extensions allow for theidentification, isolation, and repair of shunted or shorted photovoltaiccells.

Alternatively, one may design the interconnect structures so as not tocompletely cover the back surface of an adjacent cells 10-1 and 10-2.This arrangement is depicted in FIGS. 59 and 59A where it is seen that aportion 67 of the bottom cell surfaces remains exposed. Another portionof the bottom surface of cell 10-1 overlays the interconnectioncomponent to define an overlapping region (“OR”) wherein said portion ofsaid downward facing bottom cell surface directly faces a portion of theupward facing side 238 of the substrate. Contacting the exposed surfaces67 associated with two adjacent units allows determining performancecharacteristics of individual cells. It is noted that in the FIGS. 59and 59A, portions of the interconnect structure associated withconnections to additional cells have been omitted for clarity.

A common problem encountered with photovoltaic cells, especially thinfilm cells is that of electrical shunting or shorting from the top lightincident surface to the opposite bottom electrode. Such shunting mayresult from a number of sources including:

-   -   a. So called “thin film” photovoltaic cells often comprise a        self supporting metal foil substrate. These foil substrates        allow continuous deposition and manufacture of the raw PV        materials. These PV layers may be deposited over relatively        broad surfaces of the underlying metal foil substrate. The PV        material layers are often very thin (of the order 1 micron). One        problem encountered here is the surface roughness of the        supporting metal foil. This foil roughness can be greater than        the thickness of the deposited semiconductor materials. In this        situation, metal portions may protrude through the PV layers and        effectively electrically connect the top and bottom electrodes.        While various efforts are made to “smooth” the supporting metal        foil, the roughness problem may remain.    -   b. The “thin film” PV deposits may also have discontinuities        such as pinholes extending through the thickness. These may        result from a number of sources such as insufficient substrate        cleaning or flaking and scratching during handling of the raw,        unprotected PV material prior to encapsulation. It is common to        apply a conductive silver containing ink to the light incident        surface of cells to function as a current collecting structure.        The ink, when extending over a sufficiently large discontinuity        in the PV material, may wick down to the underlying metal        substrate and result in a short.    -   c. In the case of a laminated contact such as that taught in        U.S. Pat. No. 7,635,810, a separately prepared grid is laminated        to the light incident surface of a PV cell. Because of the        reduced thickness of thin film PV materials, it is possible to        cause “punch through” of the grid from the top surface to the        underlying foil substrate during the heat and pressure exposure        encountered during the lamination process.        Such shunting or shorting causes deterioration in the        performance of the cell, normally lowering both the open circuit        voltage (Voc) and the short circuit current (Isc).        Unfortunately, it is difficult to detect and isolate shunts        prior to the application of the collection grid structure.

A shunt or short may often comprise a very minute contact of conductivematerial extending through the semiconductor body. Since the observedshunts or shorts often involve minimal point contacts, it has beenobserved that passing an electrical current through the shunted cellfrom front to back electrodes may heat up the short sufficiently to“burn it out” (much like a fuse burns out as a result of a shortcircuit). Alternately, heating up the region of the short may at least“disturb” it enough to separate the point contact. One will readilyappreciate that the exposed buss extensions as shown in FIGS. 57 and 58or the exposed regions 67 of bottom surfaces 66 shown in FIG. 56Aprovide contacts to pass the electrical current.

One can measure the electrical resistance through a PV cell byconnecting the leads of an ohmmeter to the opposite electrodes of acell. When this is done under “dark” conditions, (no illumination), theresistance determined is hereby defined as the “dark series resistance”and abbreviated as “Rd”. For example, Rd can be conveniently determinedby placing the light incident surface of a cell against an opaquesurface such as a wood table surface and measuring the resistancebetween top and bottom electrodes.

It has been observed that, for cells having a surface area of about 8square inches, a shunted or shorted cell may often be quickly identifiedif the “dark series resistance” Rd of the cell falls below about 2 ohms(i.e. 2 ohms, 1 ohm, 0.5 ohm). Cells showing an Rd above about 5 ohms(i.e. 5 ohms, 10 ohms, 20 ohms, 50 ohms, 75 ohms) typically performsatisfactorily. Thus, concern is raised when the Rd falls below about 5ohms. However, selected cells having Rd below 5 ohms have on occasionshown adequate performance, indicating that other parameters may, atleast partially, overcome the negative affects of partial shunting.

The use of exposed buss extensions to pass current and repair shorted orshunted cells was reduced to practice in San Jose, Calif. in August,2009. First, a number of “laminated cell stock” samples were preparedusing CIGS material supported on a stainless steel substrate. Thesesamples were prepared according to the teachings associated with FIG.55. Table A gives the data observed for the individual cells after theinitial lamination of the grids to the top surface of the cells:

TABLE A Cell # Rd After Initial Lamination 3-24 96 3-8 122 3-2 106 2-20103

These cells were then assembled into a “4-up” modular array in a fashionas depicted in FIG. 56. Table B provides the data observed followingthis array lamination:

TABLE B Cell # Rd of Cell 3-24 0.5 3-8 0.6 3-2 93. 2-20 91.

Cells 3-24 and 3-8 had thus shorted during the array lamination.Measurements of the modular array in the sun across the entire arrayshowed an open circuit voltage of 2.1 volts and a closed circuit currentof 1.51 amps. This showed that despite two cells (3-24 and 3-8) being“shunted”, the array performance had not suffered catastrophically.

The process to repair the cells involved connecting a wire probe to eachpole of a fresh 9-volt battery. These probes were then placed in contactwith the opposite electrodes of each of the shorted cells. The positivebattery pole was placed in contact with the bottom cell electrode(stainless steel) and the negative battery electrode was contacted tothe top grid electrode of the cell. It was observed that the initialcurrent across the shorted cells was 5-6 amps but it quickly droppedbelow 1 amp after about 10 seconds. Both cells 3-8 and 3-24 were treatedin this way. It should be noted that no electrical treatment was givento cells 3-2 and 2-20. Upon completion of this electrical exposure, thefollowing measurements were made:

TABLE C Cell # Rd 3-24 30.5 3-8 99.5 3-2 90. 2-20 95.The electrical measurements indicated that the shorts had been removedfrom the cells 3-24 and 3-8. In addition, it was observed that theprecise location of the original shorts could be observed by smallbubbling of the plastic around the short and even a tiny burn mark onthe backside stainless surface. In one case the shorted point “glowedred” for a brief period. It is apparent that forcing a current throughthe original short acted to remove the short by disturbing it, possiblyeither by “burning it out” like a fuse or by simply melting the plasticfilm. The “repaired” array had electrical performance virtuallyidentical to an array never having shorts. These electrical measurementsare reported in Table D.

TABLE D Readings were taken in the sun, Aug. 18, 2009, San Jose,approximately 2:00 PM. A slight haze existed. Initial readings Voc -2.20 V Isc - 1.58 amps. Readings after approximately ½ hour sun soak(cells very warm) Voc - 2.12 Isc - 1.56 amps. Readings after cells hadcooled down from sun soak Voc - 2.24 V Isc - 1.53 amps.

Using a laminating approach to secure the conductive grid materials to aconductive surface involves some design and performance “tradeoffs”. Forexample, if the electrical line or path “finger” 84 comprises a wireform, it has the advantage of potentially reducing light shading of thesurface (at equivalent current carrying capacity) in comparison to asubstantially flat electrodeposited, printed or etched foil member.However, the wire form typically has a higher profile. It has beentaught in the art that wire diameters as small as 50 micrometers (0.002inch) can be assembled into grid like arrangements. Thus when laid on aflat surface such a wire would project above the surface 0.002 inches.For purposes of this instant specification and claims, a structureprojecting above a surface less than 0.002 inches will be defined as alow-profile structure.

A potential cross sectional view of a circular wire 84 d laminated to asurface by the process such as that of FIG. 21 is depicted in FIG. 60A.FIG. 60B depicts a typical cross sectional view of an electrical line 84e formed by printing, electrodeposition, chemical “electroless” plating,foil etching, masked vacuum deposition etc. It is seen in FIG. 60A that,being round, the wire itself contacts the surface essentially along aline (normal to the paper in FIG. 60A). This situation results from thefact that with the inorganic cells the top light incident surface 59 ishard and impenetrable. Thus the wire will most often not significantlyembed into the photovoltaic layers even given high pressures duringlamination. In addition, attention should be addressed to promote flowof sealing material around the wire so that any voids as shown in FIG.60A at 99 are minimized. Such voids could lead to insecure contact. Aconverse problem is that material forming surface 80 d may flow underthe wire preventing conductive contact. Thus, the thickness of thesealing layer, lamination parameters, material choice and initialprojection of the wire form above the substrate surface are veryimportant when using a round wire form.

On the other hand, using a substantially flat conductive line such asdepicted in FIG. 60B increases contact surface area (at the same crosssection) compared to the line contact associated with a wire. The flatbottomed rectangular form of FIG. 60B facilitates broad surface contactand secure lamination but comes at the expense of increased lightshading. The flat structure does require consideration of the thicknessof the “flowable” sealing layer forming surface 80 e relative to thethickness of the conductive line. Excessive thickness of certain sealinglayer materials might allow relaxation of the “blanket” pressurepromoting contact of the surfaces 98 with a mating conductive surfacesuch as 59. Insufficient thickness may lead to voids similar to thosedepicted for the wire forms of FIG. 60A. However, it has been foundthat, when using lines having rectangular cross section and low profilesealing layer thicknesses ranging from 0.5 mil, (0.0005 inch) to 10 mil(0.01 inch) all perform satisfactorily. Thus a wide range of sealinglayer thickness is possible.

It may be advantageous for line structures such as depicted in FIGS. 60Aand 60B to have a low profile since that may allow minimizing adhesiveor sealing layer thickness. In general, it may be advantageous to limitthe thickness of a sealing layer (for example layer 72 of substrate 70,FIG. 7) to 5 mils (0.005 inch) or less. Reducing sealing layer thicknessreduces the total amount of functional groups present in the sealinglayer. Such functional groups may adversely affect solar cellperformance or integrity. Also, reduced sealing layer thickness mayincrease processing speeds and reduce costs. Finally, low profilestructure reduces structural height variations over the top surface andthus reduces “planarization” concerns for the top surface which ariseduring final module encapsulation.

Electrical contact between conductive grid “fingers” or “lines” 84 and aconductive surface (such as cell surface 59) may be further enhanced bycoating a conductive adhesive formulation onto “fingers” 84 and possibly“busses” 86 prior to or during the lamination process such as taught inthe embodiment of FIG. 21. In a preferred embodiment, the conductiveadhesive would be a “hot melt” material. A “hot melt” conductiveadhesive would melt and flow at the temperatures involved in thelaminating process 92 of FIG. 21. In this way surface 98 is formed by aconductive adhesive resulting in secure adhesive and electrical joiningof grid “fingers” 84 to a conductive surface such as top surface 59following the lamination process. In addition, such a “flowable”conductive material may assist in reducing voids such as depicted inFIG. 60A for a wire form. In addition, a “flowable” conductive adhesivemay increase the contact area for a wire form 84 d.

In the case of a flat faced form such as depicted in FIG. 60B, theconductive adhesive may be applied by techniques such as registeredprinting or “electrodeposition” of organic coatings. It is noted that aconductive adhesive coating for a conductive line may be very thin, ofthe order of 1-10 micron thick. Thus, the intrinsic resistivity of theconductive adhesive can be relatively high, perhaps up to or evenexceeding about 100 ohm-cm. This fact allows reduced loading andincreased choices for a conductive filler. Since the conductive adhesivedoes not require heavy filler loading (i.e. it may have a relativelyhigh intrinsic resistivity as noted above) other unique applicationoptions exist.

For example, a suitable conductive “hot melt” adhesive may be depositedfrom solution onto the surface of the “fingers” and ‘busses” byconventional paint electrodeposition techniques. Alternatively, should acondition be present wherein the exposed surface of fingers and bussesbe pristine (no oxide or tarnished surface), the well knowncharacteristic of such a surface to “wet” with water based formulationsmay be employed to advantage. A freshly activated or freshlyelectroplated metal surface will be readily “wetted” by dipping in awater-based polymer containing fluid such as a latex emulsion containinga conductive filler such as carbon black. Application selectivity wouldbe achieved because the exposed polymeric sealing surface 80 would notwet with the water based latex emulsion. The water based material wouldsimply run off or could be blown off the sealing material using aconventional air knife. However, the water based film forming emulsionwould cling to the freshly activated or electroplated metal surface.This approach is similar to applying an anti-tarnish or conversion dipcoating to freshly electroplated metals such as copper and zinc

Alternatively, one may employ a low melting point metal-based materialas a constituent of the material forming either or both surfaces 98 and100 of “fingers” and “busses”. In this case the low melting pointmetal-based material, or alloy, is caused to melt during the temperatureexposure of the process 92 of FIG. 21 (typically less than 600 degreesF.) thereby increasing the contact area between the mating surfaces 98,100 and a conductive surface such as 59. Such low melting pointmetal-based materials may be applied by electrodeposition or simpledipping to wet the underlying conductive line. Suitable low meltingpoint metals may be based on tin, such as tin-bismuth, tin-indium,tin-gallium and tin-lead alloys. Such alloys are commonly referred to as“solders”. In another preferred embodiment indium or indium containingalloys are chosen as the low melting point contact material at surfaces98, 100. Indium melts at about 314 degree Fahrenheit, considerably belowpossible lamination temperatures. In addition, indium is known to wetand bond to glass and ceramic materials when melted in contact withthem. Given sufficient lamination pressures, only a very thin layer ofindium or indium alloy would be required to take advantage of thisbonding ability.

In yet another embodiment, one or more of the layers 84, 86, 88, 90 etc.may comprise a material having magnetic characteristics. Magneticmaterials include nickel and iron. In this embodiment, either a magneticmaterial in the cell substrate or the material present in thefinger/grid collector structure is caused to be permanently magnetized.The magnetic attraction between the “grid pattern” and magneticcomponent of the foil substrate of the photovoltaic cell (or visa versa)creates a permanent “pressure” contact.

In yet another embodiment, the “fingers” 84 and/or “busses” 86 comprisea magnetic component such as iron or nickel and a external magneticfield is used to maintain positioning of the fingers or busses duringthe lamination process depicted in FIG. 21.

A number of methods are available to employ the current collecting andinterconnection structures taught herein above with photovoltaic cellstock to achieve effective interconnection of multiple cells intoarrays. A brief description of some possible methods follows. A firstmethod envisions combining photovoltaic cell structure with currentcollecting electrodes while both components are in their originallyprepared “bulk” form prior to subdivision to dimensions appropriate forindividual cells. An expansive surface area of photovoltaic structuresuch as embodied in FIGS. 1 and 2 of the instant specificationrepresenting the cumulative area of multiple unit cells is produced. Asa separate and distinct operation, an array comprising multiple currentcollector electrodes arranged on a common substrate, such as the arrayof electrodes taught in FIGS. 9 through 15 is produced. The bulk arrayof electrodes is then combined with the expansive surface ofphotovoltaic structure in a process such as the laminating processembodied in FIG. 21. This process results in a bulk combination ofphotovoltaic structure and collector electrode. Appropriate subdividingof the bulk combination results in individual cells having a preattachedcurrent collector structure. Electrical access to the collectorstructure of individual cells may be achieved using through holes, astaught in conjunction with the embodiments of FIGS. 35 through 42.Alternatively, one may simply lift the collector structure away from thecell surface 59 at the edge of the unit photovoltaic cell to expose thecollector electrode.

Another method of combining the collector electrode and interconnectstructures taught herein with photovoltaic cells involves a first stepof manufacture of individual current collecting electrode/interconnectstructures. A suitable method of manufacture is to produce a bulkcontinuous roll of electrodes using roll to roll processing. Examples ofsuch manufacture are the processes and structures embodied in thediscussion of FIGS. 9-15, 29-31, 39-42, and 48-54 of the instantspecification. The bulk roll is then subdivided into individual currentcollector electrodes for combination with discrete units of cell stock.The combination produces discrete individual units of “tabbed” cellstock. In concept, this approach is appropriate for individual cellshaving known and defined surface dimensions, such as 6″×6″, 4″×3″, 2″×8″and 2″×16″. Cells of such defined dimensions may be produced directly,such as with conventional single crystal silicon manufacture.Alternatively, cells of such dimension are produced by subdividing anexpansive cell structure into smaller dimensions. The “tabbed” cellstock thereby produced may be packaged in cassette packaging. Thediscrete “tabbed” cells are then electrically interconnected into anarray, optionally using automatic cassette dispensing, positioning andelectrical joining of multiple cells. The overhanging tabs of theindividual “tabbed” cells facilitate such joining into an array as wastaught in the embodiments of FIGS. 24, 34, 43, and 56 above

Alternate methods to achieve interconnected arrays according to theinstant invention comprise first manufacturing current interconnectingcomponents in bulk roll to roll fashion. In this case the “currentcollector stock” would comprise electrically conductive currentcollecting/interconnect structure on a supporting sheetlike webessentially continuous in the “Y” or “machine” direction. Furthermore,the conductive structure is possibly repetitive in the “X” direction,such as the arrangement depicted in FIGS. 9, 12 and 38 of the instantspecification. In a separate operation, individual rolls of unit “cellstock” are produced, possibly by subdividing an expansive web of cellstructure. The individual rolls of unit “cell stock” may be continuousin the “Y” direction and have a width corresponding to the width ofcells to be eventually arranged in interconnected array.

Having separately prepared rolls of “interconnection components” andunit “cell stock”, multiple array assembly processes may be consideredas follows. In one form of array assembly process, a roll of unit“interconnection component” is produced, possibly by subdividing a bulkroll of “interconnection component” to appropriate width for the unitroll. The rolls of unit “interconnection component” and unit “cellstock” are then combined in a continuous process to produce a roll ofunit “tabbed stock”. The “tabbed” stock therefore comprises cells, whichmay be extensive in the “Y” dimension, equipped with readily accessiblecontacting surfaces for either or both the top and bottom surfaces ofthe cell. The “tabbed” stock may be assembled into an interconnectedarray using a multiple of different processes. As examples, two suchprocess paths are discussed according to (A) and (B) following.

Process Example (A)

Multiple strips of “tabbed” stock are fed to a process such that aninterconnected array of multiple cells is achieved continuously in themachine (original “Y”) direction. This process would produce aninterconnected array having series connections of cells whose numberwould correspond to the number of rolls of “tabbed” stock being fed. Inthis case the individual strips of “tabbed” stock would be arranged inappropriate overlapping fashion as dictated by the particular embodimentof “tabbed” stock. The multiple overlapping “tabs” would be electricallyjoined appropriately using electrical joining means, surface matingthrough laminating or combinations thereof as has been taught above. Anexample of one embodiment of such an arrangement is depicted in FIG. 34.Both the feed and exit of such an assembly process would besubstantially in the original “Y” direction and the output of such aprocess would be essentially continuous in the original “Y” direction.The multiple interconnected cells could be rewound onto a roll forfurther processing.

Process Example (B)

An alternative process is taught in conjunction with FIGS. 61 and 62.FIG. 61 is a top view of the process and FIG. 62 is a perspective view.The process is embodied in FIGS. 61 and 62 using the “tabbed cell stock”270 as shown in FIG. 55. One will recognize that other forms of “tabbedcell stock” such as those shown in FIGS. 23, 33, 42, are also suitable.In the embodiment of FIG. 61 the “tabbed cell stock” is shownaccumulated and fed from a “continuous” roll 300. A strip of “tabbed”cell stock 270 is unwound from roll 300 and cut to a predeterminedlength “Y-61”. This operation produces a substantially rectangulartabbed cell from the “tabbed cell stock” with “Y-61” representing thewidth of the form factor of the eventual interconnected array. It hasbeen found that the presence of a polymeric substrate 230 adherent tothe top cell surface during the cutting helps prevent shorting byretarding any “smearing” contact of top and bottom conductive cellsurfaces. Strips of “tabbed cell stock” cut to length “Y-61” may then beprocessed according to alternate processing sequences. In a firstsequence as embodied in FIGS. 61 and 62 the cut strip is directlypositioned for further interconnecting into the modular array. Inanother sequence the strips of length “Y-61” are performance tested“in-line” and sorted into feeder cassettes prior to the modularizationprocess from the cassettes. Thus a possible advantage to the cassettingapproach is that the individual cut strips may be performance evaluatedand sorted according to performance prior to assembly into aninterconnected module.

In either of these “Process B” sequences, a first step in theinterconnection process secures a cut strip in position. In the processembodiment of FIGS. 61 and 62, this positioning is accomplished using avacuum belt 302. The strip is then “shuttled” in the original “x”direction of the “tabbed cell stock” a distance substantially the lengthof a repeat dimension among adjacent series connected cells. This repeatdistance is indicated in FIGS. 56 and 61 as “X-10”. A second strip of“tabbed cell stock” 270 is then appropriately positioned to properlyoverlap the first strip, such as shown for example in FIG. 56. Thesecond strip is then slightly tacked to the first strip of “tabbed cellstock” using exposed substrate material, such as that indicated atnumeral 306 in FIG. 56. The tacking may be accomplished quickly andsimply at points spaced in the “Y-61” direction using heated probes tomelt small regions of the sealing material forming the surface of theexposed substrate. It is understood that other methods of relativepositioning of tabbed cell strips, such as adhesive application or spotwelding, may be chosen to maintain positioning of the adjacent cells.

This process of positioning and tacking is repeated multiple times.Normally, the repetitively positioned cell structures are passed througha “fixing” step to accomplish completion of the structural andelectrical joining of the modular arrangement. The electrical joiningmay take many forms, depending somewhat on the structure of theindividual “tabbed cell stock”. For example, in the embodiment of FIGS.24 and 25, joining may take the form of an electrically conductiveadhesive, solder, etc. as previously taught. In the case of “tabbed”cell stock 270 such as embodied in FIG. 55, electrical joining maycomprise a simple “blanket hold down” of conductive structure resultingfrom adhesive lamination such as previously described and embodied inFIG. 56.

The “fixing” step may involve heat and or pressure and is oftenaccomplished using roll, vacuum, or press lamination. In the embodimentof FIGS. 61 and 62, the “fixing” is accomplished using lamination withroll laminator 310. Thus the series connected structure 290 depicted inFIG. 56 is achieved. It is seen that in the process depicted in FIGS. 61and 62 the interconnected cell stock would exit the basic laminationassembly process in a fashion substantially perpendicular to theoriginal “Y” direction of the “tabbed cell stock”. The interconnectedcells produced would therefore have a new predetermined width “Y-61” andthe new length (in the original “X” direction) may be of extendeddimension. The output in the new length dimension may be described asessentially continuous and thus if desired the output of interconnectedcells may be gathered on roll 320 as shown.

It is noted that the overall process depicted in FIGS. 61 and 62 issubstantially continuous in that the feed stream to the process (tabbedcell stock 270) is continuous while the output of the process 290 mayalso be continuous. The process scheme depicted in FIGS. 61 and 62permits other options while maintaining the substantially continuousnature of the overall process. For example, should one wish to apply atransparent environmental protective layer to the modular cell array,this can easily be accomplished using an auxiliary feed stream ofbarrier film either prior to the lamination depicted at rolls 310 or inan additional lamination step subsequent to the lamination at 310. Onemay also consider application of a flexible backsheet in similarfashion. In addition, other processing options may be considered bothbefore and after the “fixing” depicted by lamination 310 and while themodular array remains in it “continuous” form. These other optionsinclude additional lamination steps, quality checks on individual cellsor module lengths, and spray application of functional coatings.

It will be appreciated that using the processing as embodied in FIGS. 61and 62, a large choice of final form factors for the interconnectedarray is possible. For example, dimension “Y-61” could conceivably andreasonably be quite large, for example 8 feet while dimension “X-61” maybe virtually any desired dimension. It is seen that the FIGS. 61/62process results in a repetitive arrangement of cells seamed together ina robust, flexible sheetlike structure. Large module sizes can beproduced which are also very easy to handle and manipulate. To date,module sizes employing “string and tab” or “shingling” interconnectionshave been restricted by the practical problems of handling andinterconnecting large numbers of small individual cells. The largestcommercially available “string and tab” module known to the instantinventor is about 30 square feet. Using the instant invention, modulesizes far in excess of 30 square feet are reasonable. Large modulessuitable for combination with standard construction materials may beproduced. For example, a module surface area of 4 ft. by 8 ft. (astandard dimension for plywood and other sheetlike constructionmaterials) is readily produced using the processing of the instantinvention. Alternatively, since the final modular array can beaccumulated in roll form as shown in FIGS. 61 and 62, installation couldbe facilitated by the ability to simply “roll out” the array at theinstallation site. The ability to easily make modular arrays of veryexpansive surface and having wide choice of form factor greatlyfacilitates eventual installation and is a substantial improvement overexisting options for modular array manufacture. The ability to easilyspecify module dimensions allows a significant expansion of options forpre-fabrication of modules and module designs at the factory.

Another significant advantage to the modular processing taught here isthe ability to quickly and easily change electrical characteristics ofthe final module. The module currents are determined in large part bythe surface area of the individual cells (length by width) which may beeasily varied. The module voltage is determined in large part by thewidth of the individual cells and the module length (i.e. number ofcells). Both the current and voltage of the modular cell array may bespecified and readily achieved using the structure and processingtaught. The design flexibility allows performance characteristics of theeventual module can be readily specified. Using the depicted process,module electrical characteristics may be easily adjusted by simplyspecifying the module lengths “X-61” and the width “X-10” of theindividual cells.

Referring now to FIGS. 63 through 65 of this instant specification,details of a module structure according to embodiments of the instantinvention are presented. In FIG. 63, a top plan view of a portion ofphotovoltaic module 330 is depicted. In the FIG. 63 embodiment, overallmodule surface dimensions are indicated by width (Wm) and length (Lm).Typical module dimensions may be 4 ft. Wm by 8 ft. Lm. However, one willrealize that the invention is not limited to these dimensions. Modulesurface dimensions may be larger or smaller (i.e. 2 ft. by 4 ft., 4 ft.by 16 ft., 8 ft. by 4 ft., 8 ft. by 16 ft., 8 ft. by 100 ft., etc.)depending on specific requirements. Thus, the overall module may berelatively large.

The FIG. 63 depiction includes terminal ends 329 and 331 at oppositeends of module 330. Positioned adjacent the edge of the terminal end 331is electrically conductive terminal bar 334. One realizes that aterminal bar such as the region indicated as 334 in FIG. 63 may bepresent at the ends of modular arrangements such as embodied in FIGS. 43and 56. For example, a possible “terminal bar” region is shown atnumeral 339 in FIG. 42. One further understands that a terminal bar 338of polarity opposite that of 334 may be positioned at the terminal end329 opposite terminal end 331. In the embodiment of FIG. 63, throughholes 332 have been positioned within the terminal bars 334 and 338.Through holes such as those indicated by 332 may be used to achieveelectrical communication between conductive surfaces on opposite sidesof the terminal bar region. This feature expands installation designchoices and may improve overall contact between the terminal bars andconductive attachment hardware.

In the FIG. 63 embodiment, the module comprises multiple cells havingsurface dimensions of width Wcell (actually in the defined lengthdirection of the overall module) and length Lcell as shown. In the FIG.63 embodiment, the cell length (Lcell) is shown to be substantiallyequivalent to the module width (Wm). In addition, terminal bars 334 and338 are shown to span substantially the entire width (Wm) of the module,though this is not a requirement.

For purposes of describing embodiments of the invention, a typicalmodule as embodied in FIG. 63 may have an overall length Lm of 8 feetand overall width Wm of 4 feet. Typically the cell width (Wcell) may befrom 0.2 inch to 12 inches depending on choices among many factors. Fordescriptive purposes a cell width (Wcell) may be considered to be 1.97inches. Using these typical dimensions the module 330 of FIG. 63comprises 48 individual cells interconnected in series, with terminalbars 334 and 338 of about 0.7 inch width at each terminal end of themodule. Assuming an individual cell open circuit voltage of 0.5 volts,the open circuit voltage for the module embodied in FIG. 63 would beabout 24 volts. This voltage is noteworthy in that it is insufficient topose a significant electrical shock hazard, and further that theopposite polarity terminals are separated by 8 feet. Should highervoltages be permitted or desired, one very long module or multiplemodules connected in series may be considered, employing mounting andconnection structures taught herein for the individual modules.Alternatively, should higher voltage cells be employed (such as multiplejunction a-silicon cells which may generate open circuit voltages inexcess of 2 volts), the cell width (Wcell) may be increased accordinglyto maintain a safe overall module voltage. At a ten percent moduleefficiency, the module of FIG. 63 as described would generate about 290Watts.

Continuing reference to FIG. 64 shows photovoltaic cells 10 d, 10 e, 10f, etc. positioned in a repetitive arrangement. In the embodiment, theindividual cells comprise thin film semiconductor material such as CIGSsupported by a metal-based foil and modularized as taught above, forexample as embodied in FIG. 43 or 56. Alternate photovoltaic cellstructures known in the art and incorporated into expansive moduleswould be appropriate for practice of the invention. On the top freesurface 347 of module 330 in the FIG. 64 embodiment, a pattern offingers 348 and busses 349 collect power for transport to an adjacentcell in series arrangement.

FIG. 65 is a sectional depiction from the perspective of lines 65-65 ofFIG. 64. The FIG. 65 embodiment shows a series connected arrangement ofmultiple photovoltaic cells 10 d, 10 e, 10 f, etc. To promote clarity ofpresentation, the details of the series connections and cell structureare not shown in FIG. 65. One will realize that FIG. 65 is a greatlysimplified depiction of series connected structures such as those ofFIGS. 24, 34, 43, and 56.

One realizes the module structures depicted in FIG. 65 may be readilyfabricated at a factory and shipped in bulk packaging form to aninstallation site. Alternatively, additional components may beincorporated at the factory prior to shipment. For example, it may beappropriate to apply a transparent protective barrier over the topsurface 347 of module 330. Transparent protective layers may be eitherrigid or flexible. Rigid glass sheets have been commonly used astransparent barriers for photovoltaic modules. An alternative to rigidglass may be very thin flexible glass materials such as those identifiedas Corning 0211 and Schott D263. More recently expansive area, flexibletransparent barrier sheets have been proposed to allow production offlexible, environmentally secure photovoltaic modules. These barriersheets may typically comprise stacks of multiple films in a laminarstructure. The films may comprise multiple inorganic layers orcombinations of multiple organic and inorganic layers. The multiplelayers present a tortuous path for moisture or gas molecules topenetrate through the barrier sheet. The individual layers of thebarrier sheet are typically very thin, often of the order of onemicrometer or less, formed by various processing such as sputtering,chemical vapor deposition and atomic layer deposition. Thus theseindividual layers are typically not self supporting. A barrier stack ofmultiple thin polymer and inorganic pairs (dyads) may be applieddirectly to a device to be protected. Alternatively, the barrier stackmay be deposited onto a supporting carrier film which itself may beapplied over a device for protection. An example of such a barrier filmtechnology is that marketed by Vitex Systems under the tradename“Barix”.

FIG. 66 is a side view depicting a roll lamination of modular structure330 to protective or barrier structure 333. It is understood that ifstructure 333 is applied to overlay the light incident surface of themodule 330, structure 333 will be transparent or translucent. It isfurther understood that other lamination techniques such as vacuumlamination may be appropriate. Since module 330 is flexible theapplication of either a rigid barrier such as glass or a flexiblebarrier film may be accomplished using roll lamination such as depictedin FIG. 66. Glass sheets would normally be considered rigid. Polymersheets may be flexible or rigid. Structure 333 may also comprisemultiple additional layers imparting various functional attributes suchas structural processing strength, environmental barrier protection,adhesive characteristics and UV resistance, abrasion resistance, andcleaning ability.

The process embodiment of FIG. 66 illustrates an important principleintrinsic in the instant teachings. The final modular product includingthe protective packaging may be rigid or flexible. However, theinventive intermediate articles of manufacture taught herein areprimarily flexible and often can be processed in continuous fashion. Itis only at the latter or final stages of the manufacturing process thatthe form factor (voltage, current, flexible or rigid, physicaldimensions) characteristics of the product are established. Maintainingflexibility of the process material forms throughout the majority of themanufacturing process is an important advantage of the currentteachings. Accordingly, FIG. 66 embodies a roll lamination processdespite the final module having a rigid glass barrier package component.The flexibility of the intermediate module assembly 330 permits such aprocess. In addition, the effectively planar nature of the intermediatearticles embodied in FIGS. 24, 34, 43, 56 etc. allows minimization ofthe thickness of intermediary sealing layers such as 335 shown in FIG.66.

As one understands, the roll lamination depicted in FIG. 66 may havemanufacturing benefits compared to other lamination processes such asvacuum lamination. In the roll lamination process of FIG. 66,appropriate heat and pressure causes adhesive/sealant 335 tosufficiently soften and flow to form a seal between the facing surfacesof the module 330 and structure 333. Rolls 337 squeeze the warmedcomposite together to form this surface seal while at the same timeexpelling a majority of air. In this process the sheets may be preheatedprior to entering the rolls or the rolls themselves may be heated tosufficiently soften the sealant 335. Adhesive or sealant film 335 maycomprise a number of suitable materials, including thermoplastic orthermosetting materials, pressure sensitive adhesive formulations,ionomers, ethylene vinyl acetate (EVA) formulations, polyolefins,acrylics and the like. Alternatively, the sealant 335 may comprise apressure sensitive adhesive and the process of FIG. 66 may be practicedat room temperature. It is understood that adhesive or sealant film 335will be transparent or translucent when applied to overlay the lightincident surface of photovoltaic module 330.

FIG. 67 is a sectional view of one embodiment of adhesive/sealant film335 taken substantially from the lines 67-67 of FIG. 66. In FIG. 67,sealant film 335 is shown to compose multiple layers 344, 345, and 346.In this embodiment layers 344 and 346 are formed by materials capable ofadhesively bonding to the corresponding surfaces of structures 333 and330. Further in this embodiment, layer 345 represents a structuralcarrier film supporting the adhesive layers 344 and 346. Such astructural carrier film is used when adhesive layers 344, 346 do notpossess the integrity required for the envisioned processing. One willrealize that other embodiments are possible including a single adhesivelayer absent the carrier layer 345. One will also realize that shouldthe top surface 347 of module 330 have adhesive affinity for barrierstructure 333 then adhesive/sealant 335 may possibly be eliminated.

It is understood that once the module is applied to barrier structure333, the composite will behave mechanically similar to the barriersheet. Should structure 333 be rigid, as is typical for glass or a thickplastic sheet, the composite (module 330/sealant 335/transparentstructure) would be characterized as rigid. Should structure 333 beflexible, as is typical for many plastic barrier materials, thecomposite will remain flexible.

It is emphasized that the roll lamination process depicted in FIG. 66 isbut one form of process capable of creating the (module/sealant/barriersheet) structure. Other lamination techniques, such as vacuum laminationor simple spreading of sealing material followed by sheet application,may be alternatively employed. In some embodiments, adhesive/sealant 335may be eliminated and structure 333 may simply cover module 330. Inother embodiments, barrier structure 333 may be applied by liquid flowcoating or spraying of the module 330.

The sectional view of FIG. 68 embodies structure which may result fromthe process depicted in FIG. 66. In FIG. 68, cells 10 d, 10 e, 10 f areinterconnected in series and the arrangement is laminated to barrierstructure 333 through adhesive/sealant layer 335 as shown. Each cell hasa light incident surface 59 overlayed by its own distinctive laminatedunit of interconnecting structure. The unit of interconnecting structurecomprises a collector portion having electrically conductive material266 positioned on surface 240 of substrate 230 as has been previouslyembodied herein. In the FIG. 68 embodiment, substrate 230 comprisesthree layers, 232, 234, 236. Layer 236 forming surface 240 comprisesmaterial having adhesive affinity for the light incident surfaces 59 ofphotovoltaic cells 10. Layer 232 forming surface 238 comprises materialhaving adhesive affinity of the bottom conductive surface 66 of cell 10.Sandwiched between layers 232 and 236 is layer of structural polymer234. One readily realizes that the stack 232/234/236 is translucent ortransparent since it overlays the light incident surface of the cells.

Structural polymer support layer 234 may serve multiple functions.First, it may serve as a supporting layer for layers of material 232 and236. Often these layers 232 and 236 are formulated for adhesive affinitybut may suffer from a lack of structural integrity, being thin or havinglow modulus. This condition is often present in laminating films.Second, the structural layer may be important for facile processing ofthe substrate through various processing steps. In addition, thestructural layer 234 may supply a protective film to protect the cellsurfaces from abrasion and chafing from the handling through the variousprocess steps. Finally, the structural layer normally exhibits arelatively high elastic modulus, which contributes to firm “blanket”hold down of the electrical lines to the cell surface followinglamination. The firm hold down achieved with the high modulus structurallayer contributes to excellent thermal cycling and aging performance ofthe composites of the invention.

It is understood that layer 234 may in practice represent a multiplelayer structure. As has previously been taught the multiple layers mayprovide additional functional benefits such as environmental barrierproperties, uv resistance, cut resistance, electrical insulatingproperties etc.

Inspection of the structure embodied in FIG. 68 reveals that eachindividual cell has its light incident surface 59 overlayed by adistinct portion of unit of collector/interconnecting structure.Specifically, a cell such as 10 d is overlayed by a unit ofinterconnecting structure comprising layer portions 232 d, 234 d, 236 d.In particular, one will recognize that a polymer support layer 234 doverlaying a first cell 10 d is separate, and distinct from a polymersupport layer 234 e overlaying a second cell 10 e. Similarly, layer 232d is separate from layer 232 e, while layer 236 d is separate from layer236 e. Continued reference to FIG. 68 shows that these same structuraldistinctions exist for those portions of unit of interconnectingstructure contacting the bottom surfaces 66 of cells 10. For example,layer 232 e contacting the bottom surface 66 of cell 10 d is separatefrom layer 232 f contacting the bottom surface 66 of cell 10 e.Similarly, polymer support layer 234 e underlying the bottom surface 66of cell 10 d is separate from polymer support layer 234 f underlying thebottom surface 66 of cell 10 e.

Continued reference to FIG. 68 shows adhesive layer 335 positioned abovethe series arrangement of multiple cells. As seen in the embodiment, theadhesive layer extends as a continuous structure covering and common tomultiple of cells. As previously noted, adhesive layer 335 may be asingle layer or be a composite of multiple laminated layers. Positionedabove adhesive layer 335 is environmental barrier structure 333. Barrierstructure 333 may comprise glass or a flexible barrier sheet.

The module structure embodied in FIG. 68 may also include a protectivebackside barrier (not shown) commonly referred to as a “backsheet”.Suitable “backsheets” are known in the art. Typical “backsheets” maycomprise glass or laminated sheets combining metal foil and polymer filmlayers. Flexible backsheets of polymer/metal foil laminates may beapplied to the structures of the invention by techniques taughthereinbefore. For example, a flexible backsheet may be applied duringthe process of FIGS. 61,62 at laminating rolls 310. Alternatively, aflexible “backsheet” may be applied by the processing embodied in FIG.66.

The invention contemplates a particularly attractive conductive joiningthat may be achieved through a technique described herein as a laminatedcontact. In light of the teachings to follow one will recognize that thestructures such as those embodied in FIGS. 9-15, 16-20, 29-31, 39-41,46-54 etc. may function and be further characterized as electrodesemploying a laminated contact (laminating electrodes). One aspect of alaminated contact is a first portion of conductive structure which is tobe electrically joined to a second conductive surface. The first portioncomprises a conductive pattern positioned over or embedded in a surfaceof an adhesive. In a preferred embodiment, the adhesive is characterizedas a polymeric hot melt adhesive. A hot melt adhesive is a material,substantially solid at room temperature, whose full adhesive affinity isactivated by heating, normally to a temperature where the materialsoftens or melts sufficiently for it to flow. Often, laminationprocessing simultaneously applies heat and pressure to ensure flow andsurface wetting. Many various hot melt materials, such as acrylics andionomers, are well known in the art. It is noted that while theinvention is described herein regarding the use of hot melt laminatingadhesives, the invention contemplates use of laminating adhesives suchas pressure sensitive adhesives not requiring heat for function. Use ofpressure sensitive laminates without heating often includes removal of alayer of interleaf or release film from the composite sheet prior toapplication to the photovoltaic cell surface. In addition, the inventioncontemplates the use of cross-linkable adhesive formulations. Suchformulations exhibit adhesive tack or “affinity” prior to cross-linking.They are thus applied to a surface prior to cross-linking. Afterapplication, heating and optionally pressure causes a reaction toproduce cross-linking between the polymer chains. Such heat and pressuremay be applied during a laminating stage of the present invention. This“thermosetting” reaction eliminates polymer flow but results insubstantial increases in elasticity and strength. Other mechanisms, suchas ultraviolet exposure, may be employed to induce a cross-linkingreaction. One of course realizes that cross-linking prior to applicationwould prevent flow and surface wetting and thereby render the materialineffective as an adhesive.

In the process of producing a laminated contact using a hot meltadhesive, the exposed surface of a conductive material patternpositioned on or embedded in the surface of an adhesive is brought intofacing relationship with a second conductive surface to which electricaljoining is intended. Heat and/or pressure are applied to soften theadhesive which then may flow around edges or through openings in theconductive pattern to also contact and adhesively “grab” the exposedsecond surface portions adjacent the conductive pattern. When heat andpressure are removed, the adhesive adjacent edges of the conductivepattern firmly fixes features of conductive pattern in secure mechanicalcontact with the second surface.

The laminated contact is particularly suitable for the electricaljoining requirements of many embodiments of the instant invention. Asimplified depiction of structure to assist understanding the concept ofa laminated contact is embodied in FIGS. 69 and 70. FIG. 69 shows a topplan view of an article 350. Article 350 comprises a conductive mesh 352positioned on the surface of or partially embedded in adhesive 351. Mesh352 may be in the form of a metal screen, a metallized fabric or afabric comprising conductive fibers, an electrodeposited metal pattern apattern of wires and the like. Adhesive 351 possesses adhesive affinityto the conductive surface to which electrical joining is intended.Numeral 354 indicates holes through the mesh or fabric. One will realizethat many different patterns and conductive materials may be suitablefor the conductive material represented by conductive mesh 352,including conductive comb-like patterns, serpentine lines, monolithicmetal mesh patterns, metallized fabric, wires, etched or die cut metalforms, forms comprising vacuum deposited, chemically deposited andelectrodeposited metals, etc.

FIG. 70 shows a sectional view of article 350 juxtaposed such that thefree surface of adhesive 351 and mesh 352 are in facing relationship toa mating conductive surface 360 of article 362 to which electricaljoining is desired. In the embodiment, article 350 is seen to be acomposite of the conductive material pattern 352 positioned on a topsurface of hot melt adhesive film 351. In the embodiment, an additionalsupport film 366 is included for structural and process integrity, andpossibly barrier properties. Additional film 366 may be a polymer filmof a material such as polyethylene terephthalate, polyethylenenaphthalate (PEN), polypropylene, polycarbonate, etc. Film 366 may bemultilayered and comprise layers intended to achieve functionalattributes such as moisture barrier, UV protection etc. Film 366 mayalso comprise a structure such as glass. Article 350 can includeadditional layered materials (not shown) to achieve desired functionalcharacteristics similar to article 70 discussed above. Also depicted inFIG. 70 is article 362 having a bottom surface 360. Surface 360 mayrepresent, for example, the top or bottom surfaces 59 or 66 respectivelyof solar cell structure 10 (FIG. 2A).

In order to achieve the laminated contact, articles 350 and 362 arebrought together in the facing relationship depicted and heat andpressure are applied. The adhesive layer 351 softens and flows tocontact surface 360. In the case of the FIG. 70 embodiment, flow occursthrough the holes 354 in the mesh 352. Upon cooling and removal of thepressure, the metal mesh 352 overlays and is held in secure and firmelectrical contact with surface 360 by virtue of the adhesive bondbetween adhesive 351 and surface 360. Thus mesh may function as alaminated electrode or current collector in combination with surface360.

Example 1

A standard plastic laminating sheet from GBC Corp. 75 micrometer (0.003inch) thick was coated with DER in a pattern of repetitive fingersjoined along one end with a busslike structure resulting in an articleas embodied in FIGS. 16 through 19. The fingers were 0.020 inch wide,1.625 inch long and the repetitive intervening spaces were 0.150 inchwide. The buss-like structure which contacted the fingers extended in adirection perpendicular to the fingers as shown in FIG. 16. Thebuss-like structure had a width of 0.25 inch. Both the finger patternand buss-like structure were printed simultaneously using the same DERink and using silk screen printing. The DER printing pattern was appliedto the laminating sheet surface formed by the sealing layer (i.e. thatsurface facing to the inside of the standard sealing pouch).

The finger/buss pattern thus produced on the lamination sheet was thenelectroplated with nickel in a standard Watts nickel bath at a currentdensity of 50 amps. per sq. ft. Approximately 4 micrometers of nickelthickness was deposited to the overall pattern.

A photovoltaic cell having surface dimensions of 1.75 inch wide by2.0625 inch long was used. This cell was a CIGS semiconductor typedeposited on a 0.001 inch stainless steel substrate. A section of thelaminating sheet containing the electroplated buss/finger pattern wasthen applied to the top, light incident side of the cell, with theelectroplated grid finger extending in the width direction (1.75 inchdimension) of the cell. Care was taken to ensure that the buss region ofthe conductive electroplated metal did not overlap the cell surface.This resulted in a total cell surface of 3.61 sq. inch. (2.0625″×1.75″)with about 12% shading from the grid, (i.e. about 88% open area for thecell).

The electroplated “finger/buss” on the lamination film was applied tothe photovoltaic cell using a standard Xerox office laminator. Theresulting completed cell showed good appearance and connection.

The cell prepared as above was tested in direct sunlight forphotovoltaic response. Testing was done at noon, Morgan Hill, Calif. onApr. 8, 2006 in full sunlight. The cell recorded an open circuit voltageof 0.52 Volts. Also recorded was a “short circuit” current of 0.65 Amps.This indicates excellent power collection from the cell at highefficiency of collection.

Example 2

Individual thin film CIGS semiconductor cells comprising a stainlesssteel supporting substrate 0.001 inch thick were cut to dimensions of7.25 inch length and 1.75 inch width.

In a separate operation, multiple laminating collector grids wereprepared as follows. A 0.002 inch thick film of Surlyn material wasapplied to both sides of a 0.003 inch thick PET film to produce astarting laminating substrate as embodied in FIG. 44. Holes having a0.125 inch diameter were punched through the laminate to produce astructure as in FIG. 48. A DER ink was then printed on opposite surfacesand through the holes to form a pattern of DER lines. The resultingstructure resembled that depicted in FIGS. 50 and 51. The grid fingers254 depicted in FIGS. 50 and 51 were 0.012 inch wide and 1.625 inch longand were spaced on centers 0.120 inch apart in the length direction. Thegrid fingers 252 were 0.062 inch wide and extended 1 inch and werespaced on centers 0.5 inch apart. The printed film was thenelectroplated to deposit approximately 2 micrometers nickel strike, 5micrometers copper and an outer flash coating of 1 micrometer nickel.This operation produced multiple sheets of laminating current collectorstock having overall dimension of 7.5 inch length (“Y” dimension) and4.25 in width (“X” dimension) as indicated in FIG. 50. These individualcurrent collector sheets were laminated to cells having dimension of7.25 inches in length and 1.75 inches in width to produce tabbed cellstock as depicted in FIG. 55. A standard Xerox office roll laminator wasused to produce the tabbed cell stock. Six pieces of the tabbed cellstock were laminated together as depicted in FIG. 56. A standard Xeroxoffice roll laminator was used to produce the FIG. 56 embodiment. Thecombined series interconnected array had a total surface area of 76.1square inches. In full noon sunlight the 6 cell array had an opencircuit voltage of 3.2 Volts and a short circuit current of 2.3 amperes.

While many of the embodiments of the invention refer to “currentcollector” structure, one will appreciate that similar articles could beemployed to collect and convey other electrical characteristics such asvoltage.

Although the present invention has been described in conjunction withpreferred embodiments, it is to be understood that modifications,alternatives and equivalents may be included without departing from thespirit and scope of the inventions, as those skilled in the art willreadily understand. Such modifications, alternatives and equivalents areconsidered to be within the purview and scope of the invention andappended claims.

What is claimed:
 1. An article combining a first photovoltaic cell andan interconnecting structure wherein, said first cell has a downwardfacing conductive bottom surface, said interconnection structurecomprises a first polymeric adhesive layer positioned beneath said firstcell, said first adhesive layer has an upward facing surface, saidinterconnection structure further comprises first conductive materialpositioned between said first adhesive layer and said first cell bottomsurface, some regions of said upward facing surface of said firstadhesive layer remain uncovered with said first conductive material andare in direct physical contact and adhesively bonded to said bottom cellsurface and, said bonding of said regions and said bottom cell surfaceis responsible for maintaining direct physical and electrical contact ofa portion of said first conductive material with said first cell bottomsurface.